公开(公告)号：US20160021752A1

公开(公告)日：2016-01-21

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/18 ,  H05K5/00 ,  C04B41/88

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

Abstract translation: 封装基座包括封装体基体和在封装基体上以平面图形式设置成框状或环形的接合金属层，其中，接合金属层含有含有Ti-Ag-Cu的合金和属于金属的金属 到周期表中的第6组。

公开(公告)号：US20090050470A1

公开(公告)日：2009-02-26

申请号：US12262002

申请日：2008-10-30

Applicant: Tao-Chih Chang ,  Chiao-Yun Chang ,  Shan-Pu Yu

Inventor： Tao-Chih Chang ,  Chiao-Yun Chang ,  Shan-Pu Yu

IPC: B23K1/20 ,  C23C14/34

CPC classification number: H01L24/12 ,  H01L21/563 ,  H01L23/49582 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/24917 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion.

Abstract translation: 提供了一种用于增强无铅部件的可焊性的方法和装置。 所提供的方法与传统的焊接工艺兼容，并且能够提高焊料的润湿能力，从而提高可焊性和抗氧化能力。 此外，还可以提供可识别的无铅装置，以防止过程混淆。

公开(公告)号：US06994243B2

公开(公告)日：2006-02-07

申请号：US10974986

申请日：2004-10-26

Applicant: Joseph M. Milewski ,  Charles G. Woychik

Inventor： Joseph M. Milewski ,  Charles G. Woychik

IPC: B23K31/02

CPC classification number: H01L24/81 ,  B23K31/02 ,  B23K35/268 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract translation: 焊料互连优选地使用富铅焊料球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，在焊料球的表面上沉积优选纯锡的薄盖层。 在回流时形成互连共晶合金。 随后的退火使锡扩散到引线中，反之亦然，并且混合，从而提高所得组件的盖层的熔点温度。 该结构和工艺在后续处理中避免了二次回流问题。

公开(公告)号：US20050109820A1

公开(公告)日：2005-05-26

申请号：US10974986

申请日：2004-10-26

Applicant: Joseph Milewski ,  Charles Woychik

Inventor： Joseph Milewski ,  Charles Woychik

IPC: B23K31/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K31/02 ,  B23K35/268 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract translation: 焊料互连优选地使用富铅焊料球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，在焊料球的表面上沉积优选纯锡的薄盖层。 在回流时形成互连共晶合金。 随后的退火使锡扩散到引线中，反之亦然，并且混合，从而提高所得组件的盖层的熔点温度。 该结构和工艺在后续处理中避免了二次回流问题。

公开(公告)号：US06847118B2

公开(公告)日：2005-01-25

申请号：US10001421

申请日：2001-11-02

Applicant: Joseph M. Milewski ,  Charles G. Woychik

Inventor： Joseph M. Milewski ,  Charles G. Woychik

IPC: B23K31/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L24/81 ,  B23K31/02 ,  B23K35/268 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract translation: 焊料互连优选地使用富铅焊料球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，在焊料球的表面上沉积优选纯锡的薄盖层。 在回流时形成互连共晶合金。 随后的退火使锡扩散到引线中，反之亦然，并且混合，从而提高所得组件的盖层的熔点温度。 该结构和工艺在后续处理中避免了二次回流问题。

公开(公告)号：US20020036227A1

公开(公告)日：2002-03-28

申请号：US10001421

申请日：2001-11-02

Inventor： Joseph M. Milewski ,  Charles G. Woychik

IPC: B23K031/02 ,  B23K035/12 ,  C22C011/06 ,  H01L021/44 ,  H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L24/81 ,  B23K31/02 ,  B23K35/268 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract translation: 焊料互连优选地使用富铅焊料球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，在焊料球的表面上沉积优选纯锡的薄盖层。 在回流时形成互连共晶合金。 随后的退火使锡扩散到引线中，反之亦然，并且混合，从而提高所得组件的盖层的熔点温度。 该结构和工艺在后续处理中避免了二次回流问题。

公开(公告)号：US06227436B1

公开(公告)日：2001-05-08

申请号：US09160288

申请日：1998-09-25

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K3102

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  B23K2101/40 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/757 ,  H01L2224/7901 ,  H01L2224/81012 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Abstract translation: 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中排列。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。

公开(公告)号：US6127731A

公开(公告)日：2000-10-03

申请号：US266586

申请日：1999-03-11

Applicant: Mark K. Hoffmeyer

Inventor： Mark K. Hoffmeyer

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/44 ,  H01L23/48

CPC classification number: H01L24/13 ,  H01L24/11 ,  H05K3/3436 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/30107 ,  H05K2203/0435 ,  H05K3/3463 ,  Y02P70/613

Abstract: The melting point of the solder forming a controlled collapse chip connection is tailored by forming a thin metal cap of a metal such as palladium or silver on a solder bump. When the solder bump is melted during reflow, the metal cap dissolves into the solder. Because the resulting alloy has a higher melting point than the solder, subsequent reflow processing does not melt the chip join structure.

Abstract translation: 形成受控崩溃芯片连接的焊料的熔点通过在焊料凸块上形成诸如钯或银之类的金属的薄金属盖而被定制。 当回焊焊料凸起熔化时，金属帽溶解到焊料中。 由于所得合金的熔点高于焊料，所以后续的回流处理不会熔化芯片接合结构。

公开(公告)号：US5816473A

公开(公告)日：1998-10-06

申请号：US578054

申请日：1995-12-22

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: An apparatus comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to clean a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimentary recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Abstract translation: 一种装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。 代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待粘合的部件的表面，或者可以使用镀金的焊球。 要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的互补凹部。

公开(公告)号：US5542174A

公开(公告)日：1996-08-06

申请号：US307893

申请日：1994-09-15

Applicant: George W. Chiu

Inventor： George W. Chiu

IPC: B23K35/00 ,  B23K35/26 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H05K3/3436 ,  B23K35/001 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  B23K35/26 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for forming solder balls and an apparatus and method for forming solder columns on the electrical contact pads of an electronic package in order to establish a more reliable electrical and mechanical connection between an electronic package and a printed circuit board. In one embodiment, solder balls are formed on the electrical contact pads of a package by placing solder cylinders over the electrical contact pads and then passing the package through a reflow furnace where the solder cylinders take the form of spheres and are wetted onto the pads. In a second embodiment, a laminated solder column is formed that is resistant to collapse during the manufacturing process. The laminated solder column comprises a solder cylinder being clad on its top and bottom surfaces with a solder material having a lower melting temperature than that of the center solder cylinder. When attaching the solder column to a package or a printed circuit board reflow temperatures are maintained above the melting temperature of the cladding material but below the melting temperature of the center solder cylinder such that the cladding is wetted onto the electrical contact pads of the package or printed circuit board while the center solder cylinder maintains its solid form.

Abstract translation: 一种用于形成焊球的方法，以及用于在电子封装的电接触焊盘上形成焊料柱的装置和方法，以便在电子封装和印刷电路板之间建立更可靠的电气和机械连接。 在一个实施例中，通过将焊料圆柱放置在电接触焊盘上，然后使封装穿过回流焊炉，焊料圆筒呈球形并被润湿到焊盘上，在焊料的电接触焊盘上形成焊球。 在第二实施例中，形成层压的焊料柱，其在制造过程中耐塌陷。 层压焊料柱包括在其顶表面和底表面上包覆焊料圆筒的焊料料，其熔化温度低于中心焊料圆筒的熔化温度。 当将焊料柱连接到封装或印刷电路板时，回流温度保持在包层材料的熔化温度以上但低于中心焊料圆筒的熔化温度，使得包层被润湿到包装的电接触焊盘上，或者 印刷电路板，而中心焊锡圆筒保持其固体形式。