公开(公告)号：US09723718B2

公开(公告)日：2017-08-01

申请号：US14452785

申请日：2014-08-06

Applicant: Mitsubishi Electric Corporation

Inventor： Taichi Obara ,  Rei Yoneyama ,  Takami Otsuki ,  Eiju Shitama

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/15 ,  H05K3/34 ,  H05K7/12 ,  H05K7/00 ,  H01L23/13 ,  H01L23/373 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L2224/32225 ,  H01L2924/19105 ,  H05K1/11 ,  H05K1/111 ,  H05K1/186 ,  H05K1/188 ,  H05K3/3442 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10 ,  H05K2201/10174 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

公开(公告)号：US20170099734A1

公开(公告)日：2017-04-06

申请号：US15052813

申请日：2016-02-24

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Masaya Hirashima ,  Takahiro Sakaguchi

IPC: H05K1/14 ,  H05K1/02 ,  H05K13/00 ,  H05K1/11

CPC classification number: H05K1/14 ,  H05K1/028 ,  H05K1/111 ,  H05K3/363 ,  H05K13/00 ,  H05K2201/04 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/167 ,  Y02P70/611

Abstract: According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.

公开(公告)号：US20170042032A1

公开(公告)日：2017-02-09

申请号：US15302769

申请日：2015-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong Joo ,  Jin Hyung Lee ,  Gil Yong Chang

IPC: H05K1/18 ,  H05K7/12

CPC classification number: H05K1/182 ,  G02F1/133308 ,  G02F1/133385 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  H01G2/06 ,  H05K3/301 ,  H05K3/306 ,  H05K7/12 ,  H05K2201/10128 ,  H05K2201/10393 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/2036

Abstract: According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part.

Abstract translation: 根据本公开的实施例，由于电子部件通过夹具固定在PCB上，因此可能不需要诸如焊接或粘合剂的后处理。 此外，由于PCB可以通过夹具与相邻配置间隔开，所以PCB的有效布局是可能的，从而提高PCB的生产率。 根据本公开的一个方面，提供了一种夹具，其包括被构造成围绕电子部件的外表面的至少一部分的固定部，从固定部延伸并且穿透印刷电路板 （PCB），设置在固定部分或连接部分中的至少一个中的干涉部分，并且被构造成被PCB干涉，以及从连接部分或固定部分中的至少一个突出的间隔部分。

公开(公告)号：US09545008B1

公开(公告)日：2017-01-10

申请号：US15079909

申请日：2016-03-24

Applicant: AVX Corporation

Inventor： Stanislav Zednicek ,  Jan Petrzilek

IPC: H05K1/16 ,  H05K1/18 ,  H01G9/15 ,  H01G9/012

CPC classification number: H01G9/012 ,  H01G9/15 ,  H05K1/184 ,  H05K2201/10015 ,  H05K2201/10651

Abstract: An electrolytic capacitor is provided that contains a capacitor element, a case, and anode and cathode terminations having first and second external components. The first external components are perpendicular to a lower surface of the case, while the second external components are parallel to the lower surface of the case and extend outwardly away from the front and rear surfaces of the case, respectively. Further, the second external components are mounted to a circuit board such that at least a portion of the capacitor is embedded in the board and such that the second external components are parallel to and in contact with a mounting surface of the circuit board. The particular arrangement of the external components of the terminations stabilizes the capacitor when it is embedded into the board to minimize flexing against the board and cracking or delamination of the capacitor.

Abstract translation: 提供一种电解电容器，其包含电容器元件，壳体以及具有第一和第二外部元件的阳极和阴极端子。 第一外部部件垂直于壳体的下表面，而第二外部部件平行于壳体的下表面并分别从壳体的前表面和后表面向外延伸。 此外，第二外部部件安装到电路板，使得电容器的至少一部分嵌入在电路板中，并且使得第二外部部件平行于电路板的安装表面并与电路板的安装表面接触。 端子的外部组件的特定布置在电容器被嵌入电路板时稳定，以最小化对电路板的弯曲和电容器的开裂或分层。

公开(公告)号：US20160242305A1

公开(公告)日：2016-08-18

申请号：US15041194

申请日：2016-02-11

Applicant: Yazaki Corporation

Inventor： Akemi MAEBASHI ,  Pharima AKANITSUK

IPC: H05K7/02

CPC classification number: B60R16/0238 ,  H05K1/116 ,  H05K1/183 ,  H05K1/184 ,  H05K3/3447 ,  H05K2201/09036 ,  H05K2201/10651

Abstract: An electronic component unit and a wire harness include a bus bar plate. The bus bar plate is equipped with a resistor that has a main body and a pair of terminals protruding from the main body, and a substrate main body in which a metallic bus bar is built in a resin material and which has a component mounting section with the resistor mounted thereon. The component mounting section includes a pair of through-holes that penetrates the resin material and the bus bar and allows the terminals to pass, and a recess that is provided between the pair of through-holes, extends in a straight line shape connecting the pair of through-holes, and is capable of supporting the main body of the resistor.

Abstract translation: 电子部件单元和线束包括汇流条板。 母线板配备有具有主体和从主体突出的一对端子的电阻器，以及基板主体，其中金属汇流条内置在树脂材料中，并且具有部件安装部分 安装在其上的电阻器。 部件安装部分包括穿过树脂材料和母线并允许端子通过的一对通孔，并且设置在该对通孔之间的凹部以连接该对的直线形状延伸 的通孔，并且能够支撑电阻器的主体。

公开(公告)号：US20150257274A1

公开(公告)日：2015-09-10

申请号：US14625809

申请日：2015-02-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yasuhiko KUSAMA ,  Hideyuki TAKO ,  Kenji KAWAI ,  Fumihisa MIYASAKA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15313 ,  H05K3/0011 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/301 ,  H05K3/4602 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/1105 ,  H05K2203/1316 ,  H05K2203/167 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part, and a resin layer filling the hole and supporting the electronic components.

Abstract translation: 布线基板包括芯层，该芯层具有贯穿其的厚度方向的孔，并且具有从孔的内壁向孔的内部空间突出的突出部，设置在孔中的多个电子部件， 在平面图中以间隔间隔并排配置，电子部件具有侧部，侧部与突出部接合，树脂层填充孔并支撑电子部件。

公开(公告)号：US08987770B2

公开(公告)日：2015-03-24

申请号：US13095059

申请日：2011-04-27

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/36 ,  H05K3/32 ,  H01L33/62 ,  H05K3/20

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.

Abstract translation: 提供发光二极管的结构。 在一个方面，发光二极管结构包括发光二极管，导电框架和基板。 导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。 固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。 基板具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

公开(公告)号：US20140313682A1

公开(公告)日：2014-10-23

申请号：US14257006

申请日：2014-04-21

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： HIROYUKI MITOME

IPC: H05K1/02

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

公开(公告)号：US20140204544A1

公开(公告)日：2014-07-24

申请号：US14158331

申请日：2014-01-17

Applicant: Hitachi Metals, Ltd.

Inventor： Kotaro Tanaka ,  Toshiyuki Horikoshi ,  Takumi Sato ,  Kenichi Murakami

IPC: H05K1/11 ,  H05K3/30

CPC classification number: H05K1/187 ,  H05K1/118 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/052 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/10651 ,  H05K2203/175 ,  Y10T29/49117

Abstract: A flat wiring member and a manufacturing method thereof are provided which are capable of suppressing an increase in thickness of the flat wiring member even if a circuit element is connected to the flat wiring member and simplifying a manufacturing process of the flat wiring member. A flat wiring member includes a plurality of conductors disposed on a plane to be spaced from one another and one or more circuit elements connected to one or more of the plurality of conductors. Each of the conductors connected to the circuit elements includes electrically separated branch portions. Each of the circuit elements includes a body portion disposed on the plane not to overlap the conductors and a pair of terminals extending from the body portion and electrically connected to the branch portions.

Abstract translation: 提供一种扁平布线构件及其制造方法，即使电路元件连接到扁平布线构件并且简化扁平布线构件的制造工艺，也能够抑制扁平布线构件的厚度增加。 平面布线构件包括布置在彼此间隔开的平面上的多个导体以及连接到多个导体中的一个或多个的一个或多个电路元件。 连接到电路元件的每个导体包括电分离的分支部分。 每个电路元件包括设置在不与导体重叠的平面上的主体部分和从主体部分延伸并电连接到分支部分的一对端子。

公开(公告)号：US08325005B2

公开(公告)日：2012-12-04

申请号：US13164315

申请日：2011-06-20

Applicant: Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

Inventor： Joseph Szwarc ,  Dany Mazliah ,  Makio Sato ,  Toru Okamoto

IPC: H01C7/10

CPC classification number: H01C1/14 ,  H01C1/144 ,  H01C7/003 ,  H01C17/006 ,  H01C17/28 ,  H05K3/3426 ,  H05K2201/10651 ,  H05K2201/10848 ,  Y02P70/613 ,  Y10T29/49082

Abstract: A chip resistor having first and second opposite ends includes a rigid insulated substrate having a top surface and an opposite bottom surface, a first electrically conductive termination pad and a second electrically conductive termination pad, both termination pads on the top surface of the rigid insulated substrate, a layer of resistive material between the first and second electrically conductive termination pads, and a first and a second flexible lead, each made of an electrically conductive metal with a solder enhancing coating. The first flexible lead attached and electrically connected to the first electrically conductive termination pad and the second flexible lead attached and electrically connected to the second electrically conductive termination pad. Each of the flexible leads has a plurality of lead sections facilitating bending around the end of the chip resistor.

Abstract translation: 具有第一和第二相对端的芯片电阻器包括具有顶表面和相对底表面的刚性绝缘基板，第一导电终端焊盘和第二导电终端焊盘，刚性绝缘基板的顶表面上的两个端接焊盘 ，在第一和第二导电终端焊盘之间的电阻材料层，以及每个由具有焊料增强涂层的导电金属制成的第一和第二柔性引线。 第一柔性引线附接并电连接到第一导电终端焊盘和第二柔性引线，并且电连接到第二导电终端焊盘。 每个柔性引线具有多个引线部分，便于围绕芯片电阻器的端部弯曲。