公开(公告)号：US06965166B2

公开(公告)日：2005-11-15

申请号：US10373692

申请日：2003-02-27

申请人： Junichi Hikita ,  Yoshikazu Nakagawa ,  Koji Yamamoto

发明人： Junichi Hikita ,  Yoshikazu Nakagawa ,  Koji Yamamoto

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/98 ,  H01L23/31 ,  H01L23/36 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L25/065 ,  H01L29/06

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06593 ,  H01L2924/0001 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip.

摘要翻译： 一种半导体器件，包括第一半导体芯片，以堆叠关系结合到第一半导体芯片的第二半导体芯片，以及配准结构，其使得第一半导体芯片和第二半导体芯片通过其间的凹凸突起相互相对于彼此定位 。 配准结构包括例如设置在第一半导体芯片的表面上的配准凹槽以及设置在第二半导体芯片的表面上用于与配准凹槽接合的配准突起。 配准突起可以是设置在第二半导体芯片的表面上的球形部件。

公开(公告)号：US06940997B1

公开(公告)日：2005-09-06

申请号：US09493192

申请日：2000-01-28

申请人： Toshimitsu Kaneko ,  Osamu Hori ,  Takeshi Mita ,  Koji Yamamoto

发明人： Toshimitsu Kaneko ,  Osamu Hori ,  Takeshi Mita ,  Koji Yamamoto

IPC分类号： H04N5/275 ,  G06F17/30 ,  G06T13/00 ,  G06T13/80 ,  H04N19/20 ,  H04N19/25 ,  H04N19/50 ,  G06K9/00

CPC分类号： G06K9/48 ,  G06K9/6204 ,  G06K2009/484 ,  G06T7/251 ,  G06T2207/10016 ,  H04N19/20 ,  H04N19/54 ,  H04N19/543 ,  H04N19/70

摘要： A region data describing method for describing, over a plurality of frames, region data about the region of an arbitrary object in a video, the method specifying the object region in the video with at least either of an approximate figure approximating the region or characteristic points of the region, approximating a trajectory obtained by arranging position data of the representative points or the characteristic point in a direction in which frames proceed with a predetermined function and describing the parameter of the function as region data. Thus, the region of a predetermined object in the video can be described with a small quantity of data. Moreover, creation and handling of data can easily be performed.

公开(公告)号：US20050109982A1

公开(公告)日：2005-05-26

申请号：US10971307

申请日：2004-10-25

申请人： Keita Yura ,  Masaaki Matsubara ,  Yasuko Yakou ,  Hitoshi Sakuma ,  Yoshikazu Seki ,  Satoshi Furuta ,  Koji Yamamoto

发明人： Keita Yura ,  Masaaki Matsubara ,  Yasuko Yakou ,  Hitoshi Sakuma ,  Yoshikazu Seki ,  Satoshi Furuta ,  Koji Yamamoto

IPC分类号： B09C1/02 ,  B09C1/00 ,  B09C1/08 ,  C02F1/70 ,  C09K3/00

CPC分类号： B09C1/002 ,  B09C1/08 ,  C02F1/705 ,  C02F2101/36 ,  C02F2103/06

摘要： An agent for removing organic chlorine compounds which is composed of (A) an iron powder having a BET specific surface area of from 0.010 to 3 m2/g, and (B1) a powder of at least one species of metal selected from the group VIII elements (excluding Fe) in the periodic table, and/or (B2) a porous substance in powder form supporting said metal. If the agent is composed of (A) and (B1), the amount of (B1) is 0.01 to 10 parts by mass for 100 parts by mass of (A). If the agent is composed of (A) and (B2), the amount of (B2) is 0.0001 to 10 parts by mass for 100 parts by mass of (A). This agent is capable of removing organic chlorine compounds efficiently.

摘要翻译： 一种除去有机氯化合物的试剂，其由（A）BET比表面积为0.010〜3m 2 / g的铁粉和（B1）至少一种 选自周期表中VIII族元素（不包括Fe）的金属和/或（B2）支撑所述金属的粉末形式的多孔物质。 如果试剂由（A）和（B1）组成，则（B1）的量为（A）100质量份时为0.01〜10质量份。 如果试剂由（A）和（B2）组成，则对（100）（A）100质量份，（B2）的量为0.0001〜10质量份。 该试剂能有效去除有机氯化合物。

公开(公告)号：US20050107717A1

公开(公告)日：2005-05-19

申请号：US10954640

申请日：2004-10-01

申请人： Koji Yamamoto ,  Tatsuya Kobayashi

发明人： Koji Yamamoto ,  Tatsuya Kobayashi

IPC分类号： A61B5/05 ,  A61B5/0408 ,  A61B5/0478 ,  A61B5/0492 ,  A61B5/053

CPC分类号： A61B5/4872 ,  A61B5/0537

摘要： A visceral fat area of a subject is calculated based on an equation using as variables a sex of the subject, and an electric impedance ratio between the longitudinal width of the abdomen and the transversal width of the abdomen of the subject. As an example of the equation, let the visceral fat area (cm2) be VFA and the longitudinal-transversal impedance ratio of the abdomen be R1, then VFA=a1+b1×R1 (where a1 and b1 are constants). A visceral fat area of the subject is also calculated based on an equation using abdomen circumference as an additional variable. As an example of the equation, let the abdomen circumference (cm) be W and the longitudinal-transversal impedance ratio of the abdomen be R4, then VFA=W×(a4+b4×R4)+c4 (where a4, b4 and c4 are constants) or VFA=W2×(α4+β4×R4)+γ4 (where α4, β4 and γ4 are constants). The calculated visceral fat area is compared with the reference value, and the comparison results are outputted. In the same manner, visceral fat weight and visceral fat volume can be calculated.

摘要翻译： 基于作为受试者的性别的变量的方程，以及对象的腹部的纵向宽度与横向宽度之间的电阻抗比计算受试者的内脏脂肪面积。 作为该方程的例子，使内脏脂肪面积（cm 2）为VFA，腹部的纵向横向阻抗比为R1，则VFA = a1 + b1xR1（其中a1和b1为 常数）。 也可以基于使用腹部周长作为附加变量的方程来计算受试者的内脏脂肪面积。 作为该等式的例子，使腹部周长（cm）为W，腹部的纵向横向阻抗比为R4，则VFA = Wx（a4 + b4xR4）+ c4（其中a4，b4和c4为常数） 或VFA = W 2 x（α4 +β4 x R 4）+γ4（其中α4，β4和γ4是常数）。 将计算的内脏脂肪面积与参考值进行比较，并输出比较结果。 以同样的方式，可以计算出内脏脂肪重量和内脏脂肪量。

公开(公告)号：US06869829B2

公开(公告)日：2005-03-22

申请号：US10211308

申请日：2002-08-05

申请人： Junichi Hikita ,  Koji Yamamoto ,  Isamu Nishimura ,  Nobuhisa Kumamoto

发明人： Junichi Hikita ,  Koji Yamamoto ,  Isamu Nishimura ,  Nobuhisa Kumamoto

IPC分类号： H01L23/544 ,  H01L21/60

CPC分类号： H01L23/544 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15151 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor chip (3) to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks (35) provided on a back face (34) thereof. The electrode marks (35) are respectively provided in association with a plurality of electrodes (33) provided on the front face (31) of the semiconductor chip in the same arrangement as the arrangement of the electrodes (33). The arrangement of the electrode marks (35) represents the arrangement of the electrodes (33) on the front face (31) when viewed from the side of the back face (34) of the semiconductor chip 3. Therefore, the semiconductor chip (3) can easily be positioned with the front face downward on the basis of the electrode marks (35).

摘要翻译： 为了形成片上芯片结构，其前表面向下定位的半导体芯片（3）具有设置在其背面（34）上的电极标记（35）。 电极标记（35）与设置在半导体芯片的正面（31）上的多个电极（33）分别设置成与电极（33）的布置相同的布置。 电极标记（35）的布置表示从半导体芯片3的背面（34）的侧面观察时的正面（31）上的电极（33）的配置。因此，半导体芯片（3） ）可以根据电极标记（35）容易地将前表面向下定位。

公开(公告)号：US20050031205A1

公开(公告)日：2005-02-10

申请号：US10939700

申请日：2004-09-14

申请人： Toshimitsu Kaneko ,  Osamu Hori ,  Takeshi Mita ,  Koji Yamamoto

发明人： Toshimitsu Kaneko ,  Osamu Hori ,  Takeshi Mita ,  Koji Yamamoto

IPC分类号： H04N5/275 ,  G06F17/30 ,  G06T13/00 ,  G06T13/80 ,  H04N19/20 ,  H04N19/25 ,  H04N19/50 ,  G06K9/46 ,  G06K9/36

CPC分类号： G06K9/48 ,  G06K9/6204 ,  G06K2009/484 ,  G06T7/251 ,  G06T2207/10016 ,  H04N19/20 ,  H04N19/54 ,  H04N19/543 ,  H04N19/70

摘要： A region data describing method for describing, over a plurality of frames, region data about the region of an arbitrary object in a video, the method specifying the object region in the video with at least either of an approximate figure approximating the region or characteristic points of the region, approximating a trajectory obtained by arranging position data of the representative points or the characteristic point in a direction in which frames proceed with a predetermined function and describing the parameter of the function as region data. Thus, the region of a predetermined object in the video can be described with a small quantity of data. Moreover, creation and handling of data can easily be performed.

公开(公告)号：US06851846B2

公开(公告)日：2005-02-08

申请号：US10171920

申请日：2002-06-14

申请人： Yasuhisa Fujii ,  Shigeo Yamashita ,  Yasuhiro Sando ,  Koji Yamamoto ,  Shunichi Hayamizu

发明人： Yasuhisa Fujii ,  Shigeo Yamashita ,  Yasuhiro Sando ,  Koji Yamamoto ,  Shunichi Hayamizu

IPC分类号： G01N37/00 ,  B01F3/08 ,  B01F5/00 ,  B01F5/04 ,  B01F13/00 ,  B01L3/00 ,  B01F15/02 ,  B81B7/04

CPC分类号： B01F13/0062 ,  B01F5/0453 ,  B01F5/0458 ,  B01F13/0066 ,  B01F13/0093 ,  B01F2215/0431 ,  B01L3/5027 ,  Y10T137/87652

摘要： Disclosed herewith is a microchip having a micromixer therein. The mixromixer employs a mixing or extracting structure having (1) a first flow pass provided at a first level of the microchip; (2) a second flow pass provided at a second level of the microchip, which is different from the first level; (3) a third flow pass having a plurality of sub flow passes separately layered at the first level and each having a first end and second end thereof, each sub flow pass being connected to one of the first and second flow passes at the first end thereof; and (4) a fourth flow pass, provided at the first level, connected to the second ends of the sub flow passes so that, at least connecting portions between the fourth flow pass and the sub flow passes of the third flow pass, an extending direction of the fourth flow pass is substantially identical to those of the sub flow passes. By allowing the first liquid to flow from the first flow pass to the fourth flow pass through the third flow pass while the second liquid to flow from the second flow pass to the fourth flow pass through the third flow pass, the first and second liquids are mixed at the fourth flow pass.

摘要翻译： 本文公开的是其中具有微混合器的微芯片。 混合混合器采用混合或提取结构，其具有（1）设置在微芯片的第一级的第一流动通道; （2）设置在不同于第一级的微芯片的第二级的第二流程; （3）第三流程，其具有在第一水平处分开层叠的多个子流通道，每个具有第一端和第二端，每个子流通道在第一端连接到第一和第二流动通道之一 的; 和（4）设置在第一级的第四流道，连接到副流通道的第二端，使得至少第四流通和次流之间的连接部分通过第三流道，延伸 第四流程的方向基本上与副流程相同。 通过使第一液体从第一流通流动到第三流动通道，而第二液体从第二流量流动到第四流动通过第三流动通道，第一和第二液体是 在第四个流程中混合。

公开(公告)号：US06812197B2

公开(公告)日：2004-11-02

申请号：US10606232

申请日：2003-06-26

申请人： Hitoshi Sakuma ,  Kenji Kawai ,  Yoshikazu Seki ,  Masaaki Matsubara ,  Yasuko Yakou ,  Koji Yamamoto

发明人： Hitoshi Sakuma ,  Kenji Kawai ,  Yoshikazu Seki ,  Masaaki Matsubara ,  Yasuko Yakou ,  Koji Yamamoto

IPC分类号： C11D1700

CPC分类号： C22C38/04 ,  B09C1/002 ,  B09C1/08 ,  B22F2998/00 ,  C11D7/02 ,  C22C33/0207 ,  C22C33/0257 ,  C22C33/0264 ,  C22C38/004 ,  C22C38/08 ,  B22F9/082

摘要： The invention provides an iron-based cleaning powder capable of efficiently decomposing organic halides. The iron-based cleaning powder is made of iron alloy powder or iron powder produced with an atomization process. The iron alloy powder passes a 300 &mgr;m-mesh sieve at a proportion of not less than 90% and has an H2-reduction mass loss of 0.1 to 0.8% when it contains 0.3 to 1.1% of Mn. When the iron alloy powder contains 0.2 to 12% of Ni, it has an H2-reduction mass loss of 0.1 to 1.0%. The iron powder is used as mixed powder or partially alloyed powder together with Ni-containing powder. The iron powder passes a 300 &mgr;m-mesh sieve at a proportion of not less than 90% and has an H2-reduction mass loss of 0.1 to 1.0%. The Ni-containing powder has a Ni content of not less than 40% and passes a 45 &mgr;m-mesh sieve at a proportion of not less than 90%. The iron alloy powder and the iron powder have a martensite structure or a tempered martensite structure.

公开(公告)号：US06797442B2

公开(公告)日：2004-09-28

申请号：US10614789

申请日：2003-07-09

申请人： Kazuyuki Tokorozuki ,  Tetsuji Yokouchi ,  Yoshiyuki Miyamoto ,  Koji Yamamoto

发明人： Kazuyuki Tokorozuki ,  Tetsuji Yokouchi ,  Yoshiyuki Miyamoto ,  Koji Yamamoto

IPC分类号： G03F900

CPC分类号： G03F7/70558

摘要： An average value of dimensions of resist patterns formed each time exposure processing is effected on semiconductor substrates of a predetermined number of lots, is compared with a target dimension. When a drift between each of the dimensions of the formed resist patterns and the target dimension is larger than a first value, exposure energy is corrected with a relatively large correction value &agr;1. When the drift between each of the dimensions of the formed resist patterns and the target dimension is smaller than the first value and larger than a second value, exposure energy is corrected with a relatively small correction value &agr;2. When the drift between each of the dimensions of the formed resist patterns and the target dimension is smaller than the second value, no exposure energy is corrected. Exposure processing is effected on a semiconductor substrate of the next lot by using the calculated exposure energy.

摘要翻译： 将在预定批次的半导体衬底上进行每次曝光处理形成的抗蚀剂图案的尺寸的平均值与目标尺寸进行比较。 当形成的抗蚀剂图案的每个尺寸和目标尺寸之间的漂移大于第一值时，以相对大的校正值α1校正曝光能量。 当形成的抗蚀剂图案的每个尺寸与目标尺寸之间的漂移小于第一值并且大于第二值时，以相对较小的校正值α2校正曝光能量。 当形成的抗蚀剂图案的每个尺寸和目标尺寸之间的漂移小于第二值时，不会校正曝光能量。 通过使用计算出的曝光能量对下一批次的半导体衬底进行曝光处理。

公开(公告)号：US06532397B1

公开(公告)日：2003-03-11

申请号：US09577480

申请日：2000-05-25

申请人： Koji Yamamoto

发明人： Koji Yamamoto

IPC分类号： G06F1900

CPC分类号： B29C45/7626 ,  B29C37/0007 ,  B29C2045/7633 ,  Y10T29/49158 ,  Y10T29/4916

摘要： An object is to reduce damage to the mechanical parts of a moving mechanism unit 5 for moving a retaining mechanism unit 7 and electric power consumption in an apparatus for taking out a molded product. The apparatus comprises a time measuring unit 4 for measuring a return time elapsing between a start of the returning operation of the retaining mechanism unit 7 in a preceding process and the next start of the penetrating operation for taking out a molded product; an arithmetic operation unit 11 for calculating a return moving speed distribution for a process succeeding the preceding process such that the returning operation terminates upon elapse of the return time measured by the time measuring means 4; and a control unit 12 for activating the moving mechanism unit 5 in such a way that the returning operation is carried out according to the return moving speed distribution in the succeeding process.

摘要翻译： 目的是减少用于移动保持机构单元7的移动机构单元5的机械部件和用于取出模制产品的设备中的电力消耗的损坏。 该装置包括时间测量单元4，用于测量在前一过程中保持机构单元7的返回操作的开始和下一次开始用于取出模制产品的穿透操作之间经过的返回时间; 算术运算单元11，用于计算在前一处理之后的处理的返回移动速度分布，使得返回操作在由时间测量装置4测量的返回时间经过时终止; 以及控制单元12，用于启动移动机构单元5，使得根据后续处理中的返回移动速度分布执行返回操作。