公开(公告)号：US20100038761A1

公开(公告)日：2010-02-18

申请号：US12193540

申请日：2008-08-18

申请人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.

摘要翻译： 集成电路封装系统包括：将第一集成电路安装在载体上; 在所述第一集成电路和所述载体上安装具有开口的插入件，所述插入件在所述载体上具有突出端; 通过开口在载体和插入件之间连接内部互连件; 以及在第一集成电路，内部互连和载体上形成封装。

公开(公告)号：US20090121335A1

公开(公告)日：2009-05-14

申请号：US11938371

申请日：2007-11-12

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/02

CPC分类号： H01L25/03 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.

摘要翻译： 一种集成电路封装系统，包括：提供具有空腔的衬底; 将封装密封在衬底的空腔上; 以及在所述封装上形成密封剂，并且所述衬底的一部分基本上防止所述密封剂在所述空腔中形成。

公开(公告)号：US20090072412A1

公开(公告)日：2009-03-19

申请号：US11855114

申请日：2007-09-13

申请人： Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Abelardo Jr Advincula

发明人： Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Abelardo Jr Advincula

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3135 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.

摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。

公开(公告)号：US08129827B2

公开(公告)日：2012-03-06

申请号：US11855114

申请日：2007-09-13

申请人： Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Abelardo Jr Hadap Advincula

发明人： Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Abelardo Jr Hadap Advincula

IPC分类号： H01L23/02

CPC分类号： H01L23/3135 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.

摘要翻译： 集成电路封装系统包括：形成外部互连; 连接集成电路管芯和外部互连; 形成具有凹部的封装封装，用所述凹部暴露的外部互连部分覆盖所述集成电路管芯; 并将集成电路器件和外部互连件连接在凹槽中。

公开(公告)号：US20090243064A1

公开(公告)日：2009-10-01

申请号：US12060115

申请日：2008-03-31

申请人： Zigmund R. Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry D. Bathan

发明人： Zigmund R. Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry D. Bathan

IPC分类号： H01L23/28 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1515 ,  H01L2924/15311 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4826

摘要： A method of manufacturing a semiconductor package involves providing a substrate having a window. The substrate may include a leadframe having half-etched leads. First and second semiconductor devices are mounted to a top surface of the substrate on either side of the window using an adhesive. A third semiconductor device is mounted to the first and second semiconductor devices using an adhesive. The third semiconductor device is disposed over the window of the substrate. A wirebond or other electrical interconnect is formed between the third semiconductor device and a contact pad formed over a bottom surface of the substrate opposite the top surface of the substrate. The wirebond or other electrical interconnect passes through the window of the substrate. An encapsulant is deposited over the first, second, and third semiconductor devices.

摘要翻译： 制造半导体封装的方法包括提供具有窗口的基板。 衬底可以包括具有半蚀刻引线的引线框架。 使用粘合剂将第一和第二半导体器件安装到窗口两侧的基板的顶表面。 使用粘合剂将第三半导体器件安装到第一和第二半导体器件。 第三半导体器件设置在衬底的窗口之上。 在第三半导体器件和形成在衬底的与衬底的顶表面相对的底表面上的接触焊盘之间形成引线接合或其它电互连。 引线键或其他电互连通过基板的窗口。 密封剂沉积在第一，第二和第三半导体器件上。

公开(公告)号：US20120241983A1

公开(公告)日：2012-09-27

申请号：US13052816

申请日：2011-03-21

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 将具有外部连接器的集成电路器件放置在与引线相邻并与之电隔离的位置; 将集成电路安装在引线和集成电路器件上，使集成电路与集成电路器件电隔离; 以及在所述引线，所述集成电路和所述集成电路器件之间形成具有封装基底的封装封装，所述引线和所述外部连接器从所述封装基座暴露。

公开(公告)号：US20100078831A1

公开(公告)日：2010-04-01

申请号：US12239707

申请日：2008-09-26

申请人： Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

发明人： Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/568 ,  H01L23/24 ,  H01L24/48 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a die attach pad; forming a package contact pad adjacent the die attach pad; attaching an integrated circuit over the die attach pad; attaching a die connector to the integrated circuit and the package contact pad; and forming an encapsulant over the die connector and the integrated circuit, the encapsulant having an encapsulant edge from a sawless singulation process.

摘要翻译： 集成电路封装系统包括：提供管芯附接垫; 形成邻近管芯附接垫的封装接触垫; 将集成电路连接在芯片附着垫上; 将管芯连接器附接到集成电路和封装接触焊盘; 以及在所述管芯连接器和所述集成电路上形成密封剂，所述密封剂具有来自无锯末切割工艺的密封剂边缘。

公开(公告)号：US20110140287A1

公开(公告)日：2011-06-16

申请号：US12637746

申请日：2009-12-14

申请人： Henry Descalzo Bathan ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Henry Descalzo Bathan ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上形成器件，该衬底包括位于衬底周边与器件之间的接合线焊盘排; 配置接合线焊盘行包括水平重叠的三面接合线焊盘; 以及在所述器件和所述接合线焊盘排之间形成互连。

公开(公告)号：US20110127661A1

公开(公告)日：2011-06-02

申请号：US12629879

申请日：2009-12-02

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/1011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.

摘要翻译： 一种制造集成电路封装系统的方法包括：形成具有第一厚度的底部和具有向内彼此向内延伸的第二厚度的尖端的外部互连; 在尖端之间连接第一电路装置; 将所述第一电路装置和所述第二电路装置的组合厚度小于所述第一厚度的第二电路装置附接到所述第一电路装置; 以及在基底之间和尖端上形成第一厚度的封装。

公开(公告)号：US07691674B1

公开(公告)日：2010-04-06

申请号：US12488557

申请日：2009-06-20

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan

IPC分类号： H01L21/44 ,  H01L23/02

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion; forming a second lead having a second body and a second tip adjacent to the paddle; attaching a device, having a device active side, to the paddle and adjacent to the protrusion; mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip; connecting the component and the second body; and forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有第一主体和第一端头的第一引线以及在所述桨的一侧具有突起的桨，所述第一主体与所述突起相邻; 形成具有第二主体和邻近所述桨的第二末端的第二引线; 将具有装置活动侧的装置附接到所述桨并且邻近所述突起; 将具有部件活动侧的部件安装到所述装置，其中所述部件活动侧面向所述装置主动侧，并且在所述第二主体和所述第一末端之间; 连接部件和第二主体; 以及形成覆盖所述装置的封装，以及部分覆盖所述板，所述部件，所述第一引线和所述第二引线。