公开(公告)号：US06192213B1

公开(公告)日：2001-02-20

申请号：US09422858

申请日：1999-10-25

申请人： Yoshinori Wada ,  Katsumi Adachi

发明人： Yoshinori Wada ,  Katsumi Adachi

IPC分类号： B41J360

CPC分类号： G03G15/231 ,  G03G15/2021 ,  G03G2215/00413 ,  G03G2215/00459 ,  G03G2215/00654 ,  G03G2215/2083

摘要： A double-side printing apparatus for printing on double surfaces of a recording medium is constructed to prevent both an adverse influence on an image forming unit from a fixing unit and an offset of a toner image on the recording medium. The double-side printing apparatus includes a first image forming unit for forming the toner image on one surface of the recording medium, a second image forming unit, provided downstream of the first image forming unit, for forming a toner image on the other surface of the recording medium, a first fixing unit for fixing the toner image on one surface of the recording medium by a light, a second fixing unit, provided downstream of the first fixing unit, for fixing the toner image on the other surface of the recording medium, and a preventing member, provided between the first fixing unit and the second image forming unit, for preventing the light from the first fixing unit from reaching a photo sensitive body of the second image forming unit. The double-side printing apparatus further includes a guide member for guiding the recording medium, and a charger for charging the recording medium to prevent an offset of an unfixed image to the guide member.

摘要翻译： 构造用于在记录介质的双面打印的双面打印设备，以防止来自定影单元的图像形成单元的不利影响和记录介质上的调色剂图像的偏移。 双面打印设备包括用于在记录介质的一个表面上形成调色剂图像的第一图像形成单元，设置在第一图像形成单元的下游的第二图像形成单元，用于在第二图像形成单元的另一个表面上形成调色剂图像 所述记录介质，用于通过光将所述调色剂图像定影在所述记录介质的一个表面上的第一定影单元，设置在所述第一定影单元的下游的第二定影单元，用于将所述调色剂图像定影在所述记录介质的另一表面上 以及设置在第一定影单元和第二图像形成单元之间的防止构件，用于防止来自第一定影单元的光到达第二图像形成单元的感光体。 双面打印设备还包括用于引导记录介质的引导构件和用于对记录介质充电以防止未定影图像偏移到引导构件的充电器。

公开(公告)号：US4321626A

公开(公告)日：1982-03-23

申请号：US140375

申请日：1980-04-14

申请人： Yoshinori Wada

发明人： Yoshinori Wada

IPC分类号： H04N1/00 ,  H04N1/32 ,  H04N1/387 ,  H04M1/00

CPC分类号： H04N1/3871 ,  H04N2201/3205 ,  H04N2201/3271

摘要： Character codes having underline bits are read out of a memory (22). A character generator (18) generates character video signals in the form of horizontal scan lines corresponding to the codes. A line generator (30) generates line video signals corresponding to the underline bits. Where the apparatus is provided in a facsimile transmitter, the codes correspond to an identification of the station or the like and are entered into the memory (22) manually. Where the apparatus is provided in a facsimile receiver, the codes are received by a low speed modem (43) and stored in the memory (22). In either case, the receiver reproduces an original document in response to facsimile video signals with the identification characters, underlined where desired, superimposed on the document pattern.

摘要翻译： 从存储器（22）中读出具有下划线位的字符代码。 字符发生器（18）产生与代码对应的水平扫描线形式的字符视频信号。 行发生器（30）产生对应于下划线位的行视频信号。 当设备设置在传真发送机中时，代码对应于车站等的标识，并且手动输入到存储器（22）中。 在设备设置在传真接收机中的情况下，代码由低速调制解调器（43）接收并存储在存储器（22）中。 在任一种情况下，接收机响应于具有识别字符的传真视频信号再现原始文档，其中在需要时下划线叠加在文档图案上。

公开(公告)号：US20100243772A1

公开(公告)日：2010-09-30

申请号：US12282188

申请日：2008-02-28

申请人： Tamao Kojima ,  Kazutaka Nishikawa ,  Masatoshi Miyasaka ,  Akira Isomi ,  Daisuke Tabata ,  Hiroyuki Naka ,  Yoshinori Wada ,  Yasuyuki Sato

发明人： Tamao Kojima ,  Kazutaka Nishikawa ,  Masatoshi Miyasaka ,  Akira Isomi ,  Daisuke Tabata ,  Hiroyuki Naka ,  Yoshinori Wada ,  Yasuyuki Sato

IPC分类号： B29B17/02 ,  B29B13/02

CPC分类号： B29B17/02 ,  B29B2017/0203 ,  B29B2017/0255 ,  B29B2017/0258 ,  B29K2023/12 ,  B29K2025/00 ,  B29K2025/06 ,  B29K2055/02 ,  B29L2031/3044 ,  B29L2031/3061 ,  Y02W30/622

摘要： A sorting member with an optimized surface shape is adopted to pressurize a mixture heated on the sorting member to allow a melted resin mixed in the mixture to adhere to the sorting member to sort the resin from an unmelted resin. Thus, resin materials are sorted and recovered from unwanted home electric appliances and the like at a high purity.

摘要翻译： 采用具有优化的表面形状的分选部件对加热到分选部件上的混合物加压，使混合物中混合的熔融树脂粘附到分选部件上，以从未熔化的树脂分类树脂。 因此，树脂材料以高纯度从不想要的家用电器等中分类和回收。

公开(公告)号：US20070013067A1

公开(公告)日：2007-01-18

申请号：US11527461

申请日：2006-09-27

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45118 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

公开(公告)号：US06926796B1

公开(公告)日：2005-08-09

申请号：US09890066

申请日：2000-01-26

申请人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

发明人： Kazuto Nishida ,  Hidenobu Nishikawa ,  Yoshinori Wada ,  Hiroyuki Otani

IPC分类号： H01L21/60 ,  H05K3/32

CPC分类号： H01L24/31 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/78301 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/323 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

摘要翻译： 芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。 利用工具，以每个凸起不超过20gf的压力将芯片压靠在板上，同时校正芯片和板的翘曲，凸块被压缩，绝缘树脂硬化。

公开(公告)号：US06708401B2

公开(公告)日：2004-03-23

申请号：US09818899

申请日：2001-03-28

申请人： Hidenori Miyakawa ,  Yoshio Maruyama ,  Hiroshi Yamauchi ,  Mikiya Nakata ,  Takashi Akiguchi ,  Yoshinori Wada ,  Kazuhiro Mori

发明人： Hidenori Miyakawa ,  Yoshio Maruyama ,  Hiroshi Yamauchi ,  Mikiya Nakata ,  Takashi Akiguchi ,  Yoshinori Wada ,  Kazuhiro Mori

IPC分类号： H05K330

CPC分类号： H05K5/068 ,  H05K3/284 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

摘要翻译： 通过用热塑性薄膜覆盖电路板形成封装。 圆柱形或片状热塑性薄膜被减压并用于覆盖电路板以保护安装在板上的板和组件。

公开(公告)号：US06332268B1

公开(公告)日：2001-12-25

申请号：US09254687

申请日：1999-03-16

申请人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

发明人： Makoto Imanishi ,  Yoshifumi Kitayama ,  Koichi Kumagai ,  Shinji Kanayama ,  Yoshinori Wada ,  Takahiro Yonezawa ,  Kazushi Higashi

IPC分类号： H05K330

CPC分类号： H01L21/67132 ,  H01L24/11 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

摘要翻译： IC芯片（2）可以在被保持在带状支撑构件（5）的同时被提供到预安装工艺，而不从带状支撑构件（5）取出。

公开(公告)号：US06322298B1

公开(公告)日：2001-11-27

申请号：US09422054

申请日：1999-10-21

申请人： Yoshinori Wada

发明人： Yoshinori Wada

IPC分类号： B23G116

CPC分类号： B23G1/16 ,  B23Q5/045 ,  Y10T408/665 ,  Y10T408/6793 ,  Y10T408/68

摘要： Within the hermetically sealed interior of a housing 9, a driving bevel gear 15 is fixedly secured to an input shaft 12 coupled via a rotation transmission cable 5 to an output shaft of a drive unit. A spindle 19 rotates jointly and coaxially with the driving bevel gear 15, which meshes with a driven bevel gear 17 coupled in such a manner as to allow a relative displacement in the axial direction. The spindle 19 has an externally threaded portion 19A screwed in an internally threaded portion 20A of a master metal 20. The spindle 19 has one end protruding from the housing 9 to the exterior, the one end being provided with a spindle chuck 21 for retaining a tap T.

摘要翻译： 在壳体9的气密密封的内部，驱动锥齿轮15固定地固定到经由旋转传动缆线5连接到驱动单元的输出轴的输入轴12上。 主轴19与驱动锥齿轮15共同旋转并同轴地旋转，主动锥齿轮15与从动锥齿轮啮合，从动锥齿轮17以允许轴向相对移位的方式联接。 主轴19具有螺纹连接在主金属20的内螺纹部分20A中的外螺纹部分19.主轴19具有从壳体9向外部突出的一端，其一端设置有主轴卡盘21，用于保持 点击T.

公开(公告)号：US06232998B1

公开(公告)日：2001-05-15

申请号：US09286468

申请日：1999-04-06

申请人： Motohiro Tokairin ,  Amiko Chihara ,  Yoshinori Wada

发明人： Motohiro Tokairin ,  Amiko Chihara ,  Yoshinori Wada

IPC分类号： B41J2435

CPC分类号： G03G15/238 ,  G03G2215/00021 ,  G03G2215/00459 ,  G06K15/02 ,  G06K2215/0088

摘要： A printing apparatus for printing on double-sides of a recording medium has a first print control unit for controlling an one-line exposure for the right or reverse side by a horizontal synchronous signal, and a second print control unit for controlling the one-line exposure for the reverse or right side by using this horizontal synchronous signal. A print start timing for the right side can be synchronized with a timing for the reverse side, and is capable of preventing a deviation in print position between the right side and the reverse side of the recording medium even by providing the print control units for the right side and the reverse side, individually.

摘要翻译： 用于在记录介质的双面打印的打印装置具有用于通过水平同步信号控制右侧或反面的单线曝光的第一打印控制单元，以及用于控制单行的第二打印控制单元 通过使用该水平同步信号来反向或右侧曝光。 右侧的打印开始定时可以与反面的定时同步，并且即使通过提供打印控制单元也能够防止记录介质的右侧和背面之间的打印位置的偏差 右侧和反面，单独。

公开(公告)号：US6165595A

公开(公告)日：2000-12-26

申请号：US973209

申请日：1998-02-09

申请人： Koichi Kumagai ,  Yoshinori Wada ,  Teruki Edahiro

发明人： Koichi Kumagai ,  Yoshinori Wada ,  Teruki Edahiro

IPC分类号： H05K1/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  B32B3/00

CPC分类号： H05K3/202 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/10575 ,  H05K2203/0264 ,  H05K2203/063 ,  Y10S428/901 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T428/24917

摘要： A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.

摘要翻译： PCT No.PCT / JP97 / 01189 Sec。 371日期：1998年2月9日 102（e）1998年2月9日PCT PCT 1997年4月7日提交PCT公布。 出版物WO97 / 38562 日期1997年10月16日一种包括具有在其表面上涂覆有多个开口的掩模的金属布线板的部件包装基板。 这种结构消除了对现有技术基板所需的绝缘体和抗蚀剂层形成的厚基底的需要。 通过弯曲金属布线板的端子以形成连接端子，可以消除用于连接到另一个基板的连接器，从而降低了制造成本。