Light emitting device and method of manufacturing the same
    32.
    发明授权
    Light emitting device and method of manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US07858418B2

    公开(公告)日:2010-12-28

    申请号:US11873763

    申请日:2007-10-17

    IPC分类号: H01L21/00

    CPC分类号: H01L33/44 H01L33/38

    摘要: Herein disclosed a method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.

    摘要翻译: 本文公开了一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第二导电类型不同的第二化合物半导体层 第一导电类型,在基板上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。

    LIGHT-EMITTING DEVICE
    34.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20080105885A1

    公开(公告)日:2008-05-08

    申请号:US11876909

    申请日:2007-10-23

    IPC分类号: H01L33/00

    摘要: A light-emitting device includes a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; a second electrode formed on the second compound semiconductor layer; an insulating layer covering the second electrode; a first opening provided to pass through the insulating layer, the second electrode, the second compound semiconductor layer, and the active layer; a second opening provided to pass through the insulating layer; a first electrode formed on an exposed portion of the first compound semiconductor layer at the bottom of the first opening; a first electrode extension extending from the first electrode to the insulating layer through the first opening and a first pad portion including a portion of the first electrode extension on the insulating layer; and a second pad portion connected to an exposed portion of the second electrode at the bottom of the second opening.

    摘要翻译: 发光器件包括第一化合物半导体层,有源层和第二化合物半导体层; 形成在第二化合物半导体层上的第二电极; 覆盖所述第二电极的绝缘层; 设置成穿过绝缘层,第二电极,第二化合物半导体层和有源层的第一开口; 设置成穿过绝缘层的第二开口; 形成在第一开口底部的第一化合物半导体层的露出部分上的第一电极; 通过所述第一开口从所述第一电极延伸到所述绝缘层的第一电极延伸部和包括所述绝缘层上的所述第一电极延伸部的一部分的第一焊盘部分; 以及第二焊盘部分,其连接到第二开口的底部处的第二电极的暴露部分。

    Method for making semiconductor device
    39.
    发明授权
    Method for making semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US6036772A

    公开(公告)日:2000-03-14

    申请号:US999446

    申请日:1997-12-29

    IPC分类号: H01L21/363 C30B25/18

    摘要: A method for making a semiconductor device comprises: depositing at least one Group II-VI compound semiconductor layer comprising at least one Group II element selected from the group consisting of zinc, magnesium, manganese, beryllium, cadmium and mercury and at least one Group VI element selected from the group consisting of oxygen, sulfur, selenium and tellurium onto a Group III-V compound semiconductor layer comprising at least one Group III element selected from the group consisting of gallium, aluminum, boron and indium and at least one Group V element selected from the group consisting of nitrogen, phosphorus, arsenic, antimony and bismuth; whereinbefore depositing the Group II-VI compound semiconductor layer, a particle beam composed of at least one Group II element selected from the group consisting of zinc, magnesium, beryllium, cadmium and mercury is radiated onto the Group III-V compound semiconductor layer in a dose of 8.times.10.sup.-4 Torr.multidot.sec or more.

    摘要翻译: 一种制造半导体器件的方法包括:沉积至少一种包含至少一种选自锌,镁,锰,铍,镉和汞的II族元素的II-VI族化合物半导体层和至少一种VI族 选自氧,硫,硒和碲的元素至III-V族化合物半导体层,该III-V族化合物半导体层包含至少一种选自镓,铝,硼和铟的III族元素和至少一种V族元素 选自氮,磷,砷,锑和铋; 其中在沉积II-VI族化合物半导体层之前,将由选自锌,镁,铍,镉和汞的至少一种II族元素组成的粒子束辐射到III-V族化合物半导体层上 剂量为8x10-4 Torrxsec或更高。

    Luminescent semiconductor device with antidiffusion layer on active
layer surface
    40.
    发明授权
    Luminescent semiconductor device with antidiffusion layer on active layer surface 失效
    在有源层表面具有防扩散层的发光半导体器件

    公开(公告)号:US6031244A

    公开(公告)日:2000-02-29

    申请号:US987105

    申请日:1997-12-08

    IPC分类号: H01L33/28 H01L33/00

    CPC分类号: H01L33/28

    摘要: A luminescent semiconductor device comprises: an active layer composed of a Group II-VI semiconductor device which comprises at least one Group II element selected from the group consisting of zinc, magnesium, beryllium, cadmium, manganese and mercury, and at least one Group VI element selected from the group consisting of oxygen, sulfur, selenium and tellurium. the Group II-VI compound semiconductor forming said active layer contains at least one element selected from the group consisting of magnesium, beryllium and cadmium as the Group II element and tellurium as the Group VI element. At least one antidiffusion layer preventing diffusion of these elements from the active layer is provided on at least one surface of the active layer.

    摘要翻译: 发光半导体器件包括:由II-VI族半导体器件组成的有源层,其包含选自锌,镁,铍,镉,锰和汞中的至少一种II族元素,以及至少一种VI族 元素选自氧,硫,硒和碲。 形成所述活性层的II-VI族化合物半导体含有选自镁,铍和镉中的至少一种元素作为第II族元素,碲作为VI族元素。 至少一个防扩散层防止这些元件从活性层扩散到活性层的至少一个表面上。