公开(公告)号：US20060157191A1

公开(公告)日：2006-07-20

申请号：US11331465

申请日：2006-01-13

申请人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

发明人： Naoyuki Matsuo ,  Masakatsu Urairi ,  Atsushi Hino

IPC分类号： B32B38/00 ,  B32B38/04 ,  B26D1/00 ,  H01L21/301 ,  H01L21/78

CPC分类号： B23K26/40 ,  B23K26/38 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/02 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/34 ,  B23K2103/38 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  H05K3/0026 ,  Y10T83/04 ,  Y10T83/0405 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T156/1082

摘要： Providing a method of manufacturing a laser processed part capable of processing at high speed and high precision when processing a workpiece by optical absorption ablation of laser beam, effectively suppressing contamination of a workpiece surface by decomposition products, and recovering the workpiece easily after processing. Another object is to present an adhesive sheet for laser processing preferably used in the method of manufacturing a laser processed part.

摘要翻译： 提供一种制造激光加工部件的方法，其能够通过激光束的光吸收消融处理工件时以高速和高精度进行处理，有效地抑制了分解产物对工件表面的污染，并且在加工后容易地回收工件。 另一个目的是提出一种用于激光加工的粘合片，优选用于制造激光加工部件的方法。

公开(公告)号：US06373709B1

公开(公告)日：2002-04-16

申请号：US09556123

申请日：2000-04-20

申请人： Atsushi Hino ,  Hitoshi Ishizaka

发明人： Atsushi Hino ,  Hitoshi Ishizaka

IPC分类号： H05K100

CPC分类号： B82Y25/00 ,  B82Y10/00 ,  G11B5/3903 ,  G11B5/40 ,  G11B5/455 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B2005/3996 ,  H05K1/0256 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2203/175

摘要： A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

摘要翻译： 可以桥接电线的柔性布线板，也可以防止使用中导电异物的生产，以确保磁头的良好性能。 用于通过其安装有硬盘驱动器的磁头和用于致动磁头的控制电路基板的悬置基板的柔性布线板包括短路形成部分，用于形成用于桥接电线的短路部分以防止静电破坏 的磁头; 以及用于去除短路部的切口。 当沿着切口切割柔性布线板时，可以去除短路部分而不会由于短路部分的切断而产生导电异物。

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US5188702A

公开(公告)日：1993-02-23

申请号：US872504

申请日：1992-04-23

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

申请人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

发明人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

摘要： A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US4955900A

公开(公告)日：1990-09-11

申请号：US363694

申请日：1989-06-09

申请人： Kazumi Higashi ,  Toshio Nakajima ,  Atsushi Hino ,  Sunao Inoue

发明人： Kazumi Higashi ,  Toshio Nakajima ,  Atsushi Hino ,  Sunao Inoue

IPC分类号： A61L27/00 ,  A61L27/18 ,  C08G73/10 ,  G02B1/04

CPC分类号： C08G73/1064 ,  A61F2/16 ,  A61L27/18 ,  C08G73/105 ,  G02B1/041 ,  A61F2002/1681 ,  A61F2002/16965 ,  A61L2430/16

摘要： An intra-ocular lens comprising a lens part and a fixing part is disclosed, said lens part comprising a colorless transparent polyimide consisting mainly of a repeating unit represented by formula (I): ##STR1## The intra-ocular lens exhibits compatibility with the organism, chemical inactivity, and insusceptibility to modification or deterioration by the organism, has a refractive index of 1.6 or higher, completely absorbs ultraviolet rays while exhibiting substantial transparency to visible rays, and possesses heat resistance enough to withstand autoclaving.