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    Electroless deposition of continuous platinum layer
    31.
    发明授权
    Electroless deposition of continuous platinum layer 有权
    无电沉积连续铂层

    公开(公告)号：US09469902B2

    公开(公告)日：2016-10-18

    申请号：US14182987

    申请日：2014-02-18

    Applicant: Lam Research Corporation

    Inventor： Eugenijus Norkus ,  Aldona Jagminiene ,  Albina Zieliene ,  Ina Stankeviciene ,  Loreta Tamasauskaite-Tamasiunaite ,  Aniruddha Joi ,  Yezdi Dordi

    IPC: C23C18/44 ,  C23C18/16

    CPC classification number: C23C18/44 ,  C23C18/1617 ,  C23C18/1675

    Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.

    Abstract translation: 提供了一种提供含铂层的无电镀的方法。 提供Ti3 +稳定溶液。 提供Pt4 +稳定溶液。 将来自Ti 3+稳定溶液的流与来自Pt 4+稳定溶液和水的流合并，以提供Ti 3+稳定溶液和Pt 4+稳定溶液的稀释混合物。 将底物暴露于Ti3 +稳定溶液和Pt4 +稳定溶液的稀释混合物中。

    METHOD TO PRODUCE NOBLE METAL NANOCOMPOSITES
    32.
    发明申请
    METHOD TO PRODUCE NOBLE METAL NANOCOMPOSITES 审中-公开
    生产金属纳米复合材料的方法

    公开(公告)号：US20160281239A1

    公开(公告)日：2016-09-29

    申请号：US14666307

    申请日：2015-03-24

    Applicant: KING SAUD UNIVERSITY

    Inventor： ALI A. ALSHATWI ,  JEGAN ATHINARAYANAN ,  VAIYAPURI SUBBARAYAN PERIASAMY

    IPC: C23C18/44 ,  C23C18/16

    CPC classification number: C23C18/44 ,  C23C18/1635 ,  C23C18/1658 ,  C23C18/1882 ,  C23C18/31

    Abstract: The method for producing noble metal nanocomposites involves reducing noble metal ions (Ag, Au and Pt) on graphene oxide (GO) or carbon nanotubes (CNT) by using Artocarpus integrifolia leaves extract as a reducing agent. As synthesized MNPs/GO and MNPs/CNT composites have been characterized using X-ray diffraction (XRD), transmission electron microscope (TEM) imaging, and energy dispersive X-ray spectroscopy (EDX). The TEM images of prepared materials showed that the nanocomposites were 1-30 nm in size with spherical nanoparticles embedded on the surface of GO and CNT. This synthetic route is easy and rapid for preparing a variety of nanocomposites. The method avoids use of toxic chemicals, and the prepared nanocomposites can be used for biosensor, fuel cell, and biomedical applications.

    Abstract translation: 制备贵金属纳米复合材料的方法包括通过使用Artocarpus integrifolia叶提取物作为还原剂来还原氧化石墨烯（GO）或碳纳米管（CNT）上的贵金属离子（Ag，Au和Pt）。 使用X射线衍射（XRD），透射电子显微镜（TEM）成像和能量色散X射线光谱（EDX），对合成的MNPs / GO和MNPs / CNT复合材料进行了表征。 制备材料的TEM图像显示纳米复合材料的尺寸为1-30nm，球形纳米颗粒嵌入在GO和CNT的表面上。 这种合成路线对于制备各种纳米复合材料是容易和快速的。 该方法避免使用有毒化学物质，制备的纳米复合材料可用于生物传感器，燃料电池和生物医学应用。

    Electroless gold plating liquid
    33.
    发明授权
    Electroless gold plating liquid 有权
    化学镀金液

    公开(公告)号：US09416453B2

    公开(公告)日：2016-08-16

    申请号：US14578987

    申请日：2014-12-22

    Applicant: MK CHEM & TECH

    Inventor： Tae-Ho Lee ,  Deok-Gon Han ,  Tae-Hyun Sung

    IPC: C23C18/44

    CPC classification number: C23C18/44 ,  C23C18/54

    Abstract: The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained.

    Abstract translation: 本发明涉及一种化学镀金液体，其可以通过在同一槽中进行取代和还原反应而形成镀金而不腐蚀贱金属，同时满足无铅焊接的可焊性和引线接合特性，并且具有优异的 稳定性可以连续地保持金沉积速率。

    ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER
    37.
    发明申请
    ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER 有权
    连续沉积层的电沉积

    公开(公告)号：US20150232995A1

    公开(公告)日：2015-08-20

    申请号：US14182987

    申请日：2014-02-18

    Applicant: Lam Research Corporation

    Inventor： Eugenijus NORKUS ,  Aldona JAGMINIENE ,  Albina ZIELIENE ,  Ina STANKEVICIENE ,  Loreta TAMASAUSKAITE-TAMASIUNAITE ,  Aniruddha JOI ,  Yezdi DORDI

    IPC: C23C18/44 ,  C23C18/16

    CPC classification number: C23C18/44 ,  C23C18/1617 ,  C23C18/1675

    Abstract: A method for providing an electroless plating of a platinum containing layer is provided. A Ti3+ stabilization solution is provided. A Pt4+ stabilization solution is provided. A flow from the Ti3+ stabilization solution is combined with a flow from the Pt4+ stabilization solution and water to provide a diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution. A substrate is exposed to the diluted mixture of the Ti3+ stabilization solution and the Pt4+ stabilization solution.

    Abstract translation: 提供了一种提供含铂层的无电镀的方法。 提供Ti3 +稳定溶液。 提供Pt4 +稳定溶液。 将来自Ti 3+稳定溶液的流与来自Pt 4+稳定溶液和水的流合并，以提供Ti 3+稳定溶液和Pt 4+稳定溶液的稀释混合物。 将底物暴露于Ti3 +稳定溶液和Pt4 +稳定溶液的稀释混合物中。

    USE OF TITANIA PRECURSOR COMPOSITION PATTERN
    38.
    发明申请
    USE OF TITANIA PRECURSOR COMPOSITION PATTERN 有权
    泰坦尼亚前驱体组合物图案的使用

    公开(公告)号：US20150197856A1

    公开(公告)日：2015-07-16

    申请号：US14153332

    申请日：2014-01-13

    Applicant: Maria Celeste Rellamas Tria

    Inventor： Maria Celeste Rellamas Tria

    IPC: C23C18/34 ,  H05K3/18 ,  C23C18/31 ,  C23C18/44 ,  C23C18/18 ,  C23C18/16

    CPC classification number: C23C18/34 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1646 ,  C23C18/1648 ,  C23C18/166 ,  C23C18/1667 ,  C23C18/18 ,  C23C18/182 ,  C23C18/1844 ,  C23C18/1851 ,  C23C18/1879 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  C23C18/405 ,  C23C18/44 ,  H05K3/182 ,  H05K3/187 ,  H05K3/389 ,  H05K2203/013 ,  Y10T428/24851 ,  Y10T428/24893

    Abstract: A conductive metal pattern can be formed using a titania sol-gel obtained from a titania precursor composition having (a) a titanium alkoxide or titanium aryloxide, (b) a R(O)mCOCH2CO(O)nR′ compound wherein R and R′ are independently alkyl and m and n are independently 0 or 1, (c) water, (d) either an acid having a pKa less than 1 or a source of a halogen, and (e) a water-miscible organic solvent, on a substrate, wherein the molar amounts of (a) through (d) are sufficient to form a pattern of a titania sol-gel upon drying on the substrate. This pattern is contacted with electroless seed metal ions to form a pattern of electroless seed metal ions deposited within the pattern of titania sol-gel on the substrate, which electroless seed metal ions are exposed to electromagnetic radiation to reduce the electroless seed metal. The article is then subjected to electroless metal plating.

    Abstract translation: 导电金属图案可以使用由二氧化钛前体组合物获得的二氧化钛溶胶凝胶，所述二氧化钛前体组合物具有（a）钛醇盐或芳基氧化钛，（b）R（O）mCOCH 2 CO（O）n R'化合物，其中R和R' 独立地为烷基，m和n独立地为0或1，（c）水，（d）pKa小于1的酸或卤素源，和（e）水混溶性有机溶剂， 底物，其中（a）至（d）的摩尔量足以在基材上干燥后形成二氧化钛溶胶 - 凝胶图案。 这种图案与无电子种子金属离子接触以形成沉积在基底上的二氧化钛溶胶 - 凝胶图案内的无电子种子金属离子的图案，其中无电子种子金属离子暴露于电磁辐射以减少无电子种子金属。 然后将该制品进行化学镀金属。

    Preparation of Modified Organic Core Materials and Metallic Shell Composite Microspheres
    39.
    发明申请
    Preparation of Modified Organic Core Materials and Metallic Shell Composite Microspheres 审中-公开
    改性有机核材料和金属壳复合微球的制备

    公开(公告)号：US20150152560A1

    公开(公告)日：2015-06-04

    申请号：US14095746

    申请日：2013-12-03

    Applicant: Chung-Shan Institute of Science and Technology

    Inventor： Yi-Hsiuan Yu ,  Kuan-Ju Lin ,  Hong-Mao Wu ,  Chan-Yuan Ho ,  Wenjea J. Tseng

    IPC: C23C18/34 ,  C23C18/44 ,  C23C18/16

    CPC classification number: C23C18/1658 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/2086 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54

    Abstract: The present invention relates to a preparation of modified organic core materials and metallic shell composite microspheres, in which, the surface zeta potential of an organic core materials can attract the opposite zeta potential of the polyelectrolyte and form a polyelectrolyte layer so as to modify the surface of organic core materials. Moreover, the polyelectrolyte layer could attract a first metal ions, particles or complexes added later in suitable condition such that the surface of organic core materials could be metallized and covered with a first metal layer. Furthermore, the organic core materials could be covered with at least one surface metal layer. The first metal layer can be modified by second metal layer with redox-transmetalation® technology to obtain multi-metal layers organic-metallic composite structure.

    Abstract translation: 本发明涉及改性有机芯材料和金属壳复合微球的制备方法，其中有机芯材的表面ζ电位可以吸引聚电解质的相反的ζ电位并形成聚电解质层，以便改变表面 的有机核心材料。 此外，聚电解质层可以吸引稍后在合适条件下加入的第一金属离子，颗粒或络合物，使得有机芯材料的表面可被金属化并被第一金属层覆盖。 此外，有机芯材料可以被至少一个表面金属层覆盖。 第一金属层可以通过第二金属层用氧化还原 - 转移技术进行改性，以获得多金属层有机金属复合结构。

    Composite material, method for producing the same, and apparatus for producing the same
    40.
    发明授权
    Composite material, method for producing the same, and apparatus for producing the same 有权
    复合材料及其制造方法及其制造方法

    公开(公告)号：US09028982B2

    公开(公告)日：2015-05-12

    申请号：US12991902

    申请日：2009-03-02

    Applicant: Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

    Inventor： Shinji Yae ,  Tatsuya Hirano ,  Hitoshi Matsuda

    IPC: B32B9/00 ,  B32B19/00 ,  B32B9/04 ,  B32B9/06 ,  H01L21/02 ,  C23C18/16 ,  C23C18/44 ,  C23C18/54

    CPC classification number: H01L21/02697 ,  C23C18/1651 ,  C23C18/1658 ,  C23C18/44 ,  C23C18/54 ,  Y10S977/721 ,  Y10S977/779

    Abstract: Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/allocation step wherein the surface of a silicon substrate (102), which is a matrix provided with a silicon layer at least as the outermost layer, is immersed into a first solution containing gold (Au) ions, so that particulate or island-shaped gold (Au) serving as a first metal and substituted with a part of the silicon layer are dispersed/allocated on the matrix surface, and a plating step wherein the silicon substrate (102) is immersed into a second solution (24), which contains a reducing agent to which gold (Au) exhibits catalyst activity and metal ions which can be reduced by the reducing agent, so that the surface of the silicon substrate (102) is covered with the metal or an alloy of the metal (108) which is formed by autocatalytic electroless plating using gold (Au) as a starting point.

    Abstract translation: 公开了一种复合材料，其中硅表面和电镀材料之间的粘附性增强。 还公开了一种用于生产复合材料的方法和装置。 复合材料的制造方法包括：分散/分配步骤，其中将作为至少具有最外层的硅层的基体的硅基板（102）的表面浸入含有金（Au ）离子，使得用作第一金属并被硅层的一部分取代的颗粒状或岛状金（Au）分散/分配在基体表面上，以及电镀步骤，其中硅基板（102）浸没 进入第二溶液（24），其含有金（Au）表现出催化剂活性的还原剂和可被还原剂还原的金属离子，使得硅衬底（102）的表面被金属覆盖 或通过使用金（Au）作为起点的自催化无电镀形成的金属（108）的合金。

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