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公开(公告)号：US20090020326A1
公开(公告)日：2009-01-22
申请号：US12146032
申请日：2008-06-25
Applicant: Michimasa TAKAHASHI , Masakazu AOYAMA
Inventor： Michimasa TAKAHASHI , Masakazu AOYAMA
CPC classification number: H05K3/4691 , H05K1/0366 , H05K3/0052 , H05K3/4602 , H05K3/4652 , H05K2201/0191 , H05K2201/0209 , H05K2201/091 , H05K2201/09563 , H05K2201/096 , H05K2201/09845 , H05K2203/1536
Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.
Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。
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公开(公告)号：US20070095471A1
公开(公告)日：2007-05-03
申请号：US11580165
申请日：2006-10-13
Applicant: Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
IPC: B32B37/00
CPC classification number: H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.
Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。
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公开(公告)号：US09271405B2
公开(公告)日：2016-02-23
申请号：US13562895
申请日：2012-07-31
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0218 , H05K3/0035 , H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K3/4664 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
Abstract: A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed.
Abstract translation: 制造柔性刚性布线板的方法包括将柔性基板和非柔性基板彼此相邻地定位，在柔性基板上形成金属层，使得形成金属层以停止激光照射到达柔性 形成绝缘层，使得绝缘层覆盖金属层，柔性板和非柔性基板，将激光照射在绝缘层上，使得覆盖金属层的绝缘层的一部分被切割; 以及从柔性板移除覆盖金属层的绝缘层的部分，使得柔性板的至少一部分露出。
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公开(公告)号：US09215811B2
公开(公告)日：2015-12-15
申请号：US13629832
申请日：2012-09-28
Applicant: Michimasa Takahashi , Nobuyuki Naganuma , Toshinobu Asai , Teruyuki Ishihara
Inventor： Michimasa Takahashi , Nobuyuki Naganuma , Toshinobu Asai , Teruyuki Ishihara
CPC classification number: H05K3/0097 , H05K3/0052 , H05K2201/2072 , H05K2203/0169 , H05K2203/107 , H05K2203/162 , H05K2203/175 , Y10T29/49126
Abstract: A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.
Abstract translation: 一种制造多片衬底的方法包括：制备具有连接第一片衬底的连接部分的第一框架，在与第二框架连接的第一片衬底的一部分上形成具有相应轮廓的导电图案 到第一框架的连接部分的周边，沿着第一框架和第二基板上的导电图案之间的边界照射激光，使得第一基板具有与第一框架的连接部分接合的接合部分 与第二框架分离，并且将第一部件基板的接合部分装配到第一框架的连接部分中，使得第一部件基板连接到第一框架。
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公开(公告)号：US09084381B2
公开(公告)日：2015-07-14
申请号：US13297311
申请日：2011-11-16
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K3/4697 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/3025 , H05K1/0218 , H05K1/183 , H05K3/4602 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/09536 , H05K2203/308 , Y10T29/49124 , Y10T29/49158 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.
Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，具备形成刚性基材的刚性基材，设置在所述刚性基材上的隔膜，以及在隔膜之后层叠在所述刚性基材上的绝缘层， 在层压绝缘层之后的绝缘层的一部分，并且形成凹部，该凹部被构造成在刚性基板的表面上根据隔板的形状容纳电子部件。
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Patent Agency Ranking
公开(公告)号：US09066439B2
公开(公告)日：2015-06-23
申请号：US13483587
申请日：2012-05-30
Applicant: Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
Inventor： Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
CPC classification number: H05K1/141 , H05K1/142 , H05K3/305 , H05K3/3452 , H05K3/368 , H05K2201/09972 , H05K2203/1189 , Y10T29/49126
Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。
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公开(公告)号：US08908377B2
公开(公告)日：2014-12-09
申请号：US13483830
申请日：2012-05-30
Applicant: Nobuyuki Naganuma , Michimasa Takahashi
Inventor： Nobuyuki Naganuma , Michimasa Takahashi
CPC classification number: H05K3/4694 , H05K3/42 , H05K3/4697 , H05K2201/048 , H05K2201/09145 , H05K2201/2072 , Y10T29/49126
Abstract: A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board.
Abstract translation: 布线基板具有容纳部的第一刚性布线板，容纳在容纳部中的第二刚性布线基板，形成在第一刚性布线基板和第二刚性布线基板上的绝缘层，以及沿着方向 从第一刚性布线板的第一表面到第一刚性布线板的与第一刚性布线板的第一表面相反的一侧的第二表面，使得接合导体穿过第一刚性布线板 和第二刚性布线板，并且连接第一刚性布线板和第二刚性布线板。
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公开(公告)号：US08705248B2
公开(公告)日：2014-04-22
申请号：US13647698
申请日：2012-10-09
Applicant: Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
IPC: H05K1/16
CPC classification number: H05K1/0218 , H01L23/49822 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/2402 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15331 , H01L2924/15788 , H01L2924/3025 , H01L2924/3511 , H05K1/183 , H05K1/185 , H05K3/4652 , H05K2201/09981 , H05K2203/0733 , Y10T29/49155 , H01L2924/00
Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.
Abstract translation: 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层上，另一树脂绝缘层和导体电路形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。
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公开(公告)号：US08692132B2
公开(公告)日：2014-04-08
申请号：US13242488
申请日：2011-09-23
Applicant: Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
IPC: H05K1/16
CPC classification number: H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.
Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，包括形成具有与半导体装置的尺寸基本对应的金属层的第一绝缘性树脂基板，形成第二绝缘树脂基板，形成延伸到第一绝缘树脂基板的金属层的凹部 使得金属层的表面露出，将半导体器件容纳在凹部中，使得半导体器件安装在金属层的表面上，并且在第一绝缘树脂基板上形成树脂绝缘层，使得半导体器件 容纳在凹处被覆盖。
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公开(公告)号：US08677612B2
公开(公告)日：2014-03-25
申请号：US13291134
申请日：2011-11-08
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K3/4691 , H05K1/028 , H05K1/142 , H05K3/0032 , H05K3/4602 , H05K3/4652 , H05K2201/055 , H05K2201/0715 , H05K2201/0909 , H05K2201/09127 , H05K2201/09263 , H05K2201/09509 , H05K2201/096
Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.
Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，在柔性基材上形成具有柔性基材的柔性布线基板，并且在柔性基材上形成导电层，在柔性布线基板上切断，形成切断部， 使用所述切割部分的所述柔性布线板的至少一部分形成一个或多个折叠部分，使得所述柔性布线板的长度延伸，并且将所述柔性布线板连接到包括刚性基底材料并具有导电性的刚性布线板 层叠在刚性基材上。
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