公开(公告)号：US20180076113A1

公开(公告)日：2018-03-15

申请号：US15266786

申请日：2016-09-15

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Timothy Joseph Chainer ,  Evan George Colgan ,  Michael Anthony Gaynes ,  Jeffrey Donald Gelorme ,  Gerard McVicker ,  Ozgur Ozsun ,  Pritish Ranjan Parida ,  Mark Delorman Schultz ,  Bucknell C. Webb

IPC: H01L23/427 ,  H01L23/433 ,  H01L23/10 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065

CPC classification number: H01L25/0655 ,  H01L21/4803 ,  H01L23/433 ,  H01L23/473 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83201

Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.

公开(公告)号：US20170346097A1

公开(公告)日：2017-11-30

申请号：US15168330

申请日：2016-05-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Bucknell C. Webb

IPC: H01M4/62 ,  H01M2/26 ,  H01M4/02

CPC classification number: H01M4/624 ,  H01M2/08 ,  H01M2/26 ,  H01M6/40 ,  H01M2004/021 ,  H01M2220/30

Abstract: Batteries and methods of forming the same include an anode structure, a cathode structure, and a conductive overcoat. The anode structure includes an anode substrate, an anode formed on the anode substrate, and an anode conductive liner that is in contact with the anode. The cathode structure includes a cathode substrate, a cathode formed on the cathode substrate, and a cathode conductive liner that is in contact with the cathode. The conductive overcoat is formed over the anode structure and the cathode structure to seal a cavity formed by the anode structure and the cathode structure. At least one of the anode substrate and the cathode substrate is pierced by through vias that are in contact with the respective anode conductive liner or cathode conductive liner.

公开(公告)号：US20170200766A1

公开(公告)日：2017-07-13

申请号：US15414997

申请日：2017-01-25

Applicant: International Business Machines Corporation

Inventor： Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01L27/22 ,  H01F27/24 ,  H01F1/147 ,  H01L43/10 ,  H01L49/02 ,  H01L43/12 ,  H01L43/02 ,  H01F27/28 ,  H01F10/14

CPC classification number: H01L27/22 ,  G11B5/3163 ,  H01F1/14708 ,  H01F7/021 ,  H01F10/14 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L27/0641 ,  H01L27/224 ,  H01L28/10 ,  H01L43/02 ,  H01L43/10 ,  H01L43/12

Abstract: A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure.

公开(公告)号：US20170194270A1

公开(公告)日：2017-07-06

申请号：US14985839

申请日：2015-12-31

Applicant: International Business Machines Corporation

Inventor： Bucknell C. Webb

IPC: H01L23/66 ,  H01L21/31 ,  H01L21/48 ,  H01L21/306 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q1/405 ,  H01Q9/065

Abstract: An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.

公开(公告)号：US09601134B2

公开(公告)日：2017-03-21

申请号：US14996119

申请日：2016-01-14

Applicant: International Business Machines Corporation

Inventor： Robert G. Biskeborn ,  Philipp Herget ,  Bucknell C. Webb

IPC: G11B5/265 ,  G11B5/31 ,  G11B5/23 ,  G11B5/17 ,  G11B5/596

CPC classification number: G11B5/3116 ,  G11B5/17 ,  G11B5/23 ,  G11B5/265 ,  G11B5/2652 ,  G11B5/59638

Abstract: A magnetic device according to one embodiment includes a source of flux and a magnetic yoke coupled to the source of flux. The source of flux includes a thin film coil having multiple turns. The magnetic yoke has a pole with two or more gaps, wherein the coil turns have a non-uniform placement in the magnetic yoke for creating a higher magnetic field at one of the gaps than another of the gaps during writing. A magnetic device according to another embodiment includes a source of flux. A geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux.

公开(公告)号：US20170062111A1

公开(公告)日：2017-03-02

申请号：US15348015

申请日：2016-11-10

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, JR. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01F10/32 ,  H01F41/02 ,  C25D17/00 ,  C25D7/00 ,  C25D7/12 ,  H01F3/02 ,  C25D9/08

CPC classification number: H01F10/3231 ,  C25D3/54 ,  C25D3/58 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D5/50 ,  C25D7/001 ,  C25D7/123 ,  C25D9/08 ,  C25D9/10 ,  C25D17/001 ,  G11B5/66 ,  H01F3/02 ,  H01F10/3236 ,  H01F10/324 ,  H01F10/325 ,  H01F10/3254 ,  H01F41/02

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Abstract translation: 层叠结构包括第一磁性层，第二磁性层，设置在第一和第二磁性层之间的第一间隔件和设置在第二磁性层上的第二间隔件。

公开(公告)号：US09472789B2

公开(公告)日：2016-10-18

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01L21/336 ,  H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A microsystem with an integrated energy source serves as a platform and ecosystem for a variety of microsystems for implanting into human tissue. The microsystem includes a flexible battery located in an enclosed void. The enclosed void is formed by joining a first dielectric element with a second dielectric element.

Abstract translation: 具有综合能源的微系统作为植入人体组织的各种微系统的平台和生态系统。 微系统包括位于封闭空隙中的柔性电池。 封闭的空隙通过将第一介电元件与第二介电元件接合而形成。

公开(公告)号：US20160260451A1

公开(公告)日：2016-09-08

申请号：US15149727

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, JR. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: G11B5/66

CPC classification number: H01F10/3231 ,  C25D3/54 ,  C25D3/58 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D5/50 ,  C25D7/001 ,  C25D7/123 ,  C25D9/08 ,  C25D9/10 ,  C25D17/001 ,  G11B5/66 ,  H01F3/02 ,  H01F10/3236 ,  H01F10/324 ,  H01F10/325 ,  H01F10/3254 ,  H01F41/02

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Abstract translation: 层叠结构包括第一磁性层，第二磁性层，设置在第一和第二磁性层之间的第一间隔件和设置在第二磁性层上的第二间隔件。

公开(公告)号：US20160254744A1

公开(公告)日：2016-09-01

申请号：US15072675

申请日：2016-03-17

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H02M3/156 ,  G06F1/26 ,  H01L25/065 ,  H01L23/64 ,  H01L23/00

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US20160133497A1

公开(公告)日：2016-05-12

申请号：US14535909

申请日：2014-11-07

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Jeffrey D. Gelorme ,  Cornelia Kang-I Tsang ,  Bucknell C. Webb

IPC: H01L21/683 ,  B32B7/12

CPC classification number: H01L21/6835 ,  B32B7/12 ,  B32B2307/4026 ,  B32B2457/14 ,  H01L21/6836 ,  H01L21/76898 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.