公开(公告)号：US07960816B2

公开(公告)日：2011-06-14

申请号：US11306354

申请日：2005-12-23

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/202 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

摘要翻译： 提供了一种用于集成电路封装的系统，其包括具有引线指的引线框架。 凹槽位于用于导电粘合剂的引线指中，并且无源器件位于沟槽中以由导电粘合剂保持。

公开(公告)号：US20110121449A1

公开(公告)日：2011-05-26

申请号：US12625975

申请日：2009-11-25

申请人： Yaojian Lin ,  Il Kwon Shim ,  Seng Guan Chow

发明人： Yaojian Lin ,  Il Kwon Shim ,  Seng Guan Chow

IPC分类号： H01L23/52 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/11 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a stress relief buffer mounted to a temporary substrate in locations designated for bump formation. The stress relief buffer can be a multi-layer composite material such as a first compliant layer, a silicon layer formed over the first compliant layer, and a second compliant layer formed over the silicon layer. A semiconductor die is also mounted to the temporary substrate. The stress relief buffer can be thinner than the semiconductor die. An encapsulant is deposited between the semiconductor die and stress relief buffer. The temporary substrate is removed. An interconnect structure is formed over the semiconductor die, encapsulant, and stress relief buffer. The interconnect structure is electrically connected to the semiconductor die. A stiffener layer can be formed over the stress relief buffer and encapsulant. A circuit layer containing active devices, passive devices, conductive layers, and dielectric layers can be formed within the stress relief buffer.

摘要翻译： 半导体器件具有在指定用于凸块形成的位置中安装到临时衬底的应力释放缓冲器。 应力消除缓冲器可以是多层复合材料，例如第一顺应层，在第一柔性层上形成的硅层，以及形成在硅层上的第二柔性层。 半导体管芯也安装在临时衬底上。 应力消除缓冲器可以比半导体管芯更薄。 密封剂沉积在半导体管芯和应力释放缓冲器之间。 移除临时衬底。 在半导体管芯，密封剂和应力释放缓冲器上形成互连结构。 互连结构电连接到半导体管芯。 可以在应力消除缓冲器和密封剂上形成加强层。 可以在应力消除缓冲器内形成包含有源器件，无源器件，导电层和电介质层的电路层。

公开(公告)号：US07923295B2

公开(公告)日：2011-04-12

申请号：US12615428

申请日：2009-11-10

申请人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L21/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is made by forming a photoresist layer over a metal carrier. A plurality of openings is formed in the photoresist layer extending to the metal carrier. A conductive material is selectively plated in the openings of the photoresist layer using the metal carrier as an electroplating current path to form wettable contact pads. A semiconductor die has bumps formed on its surface. The bumps are directly mounted to the wettable contact pads to align the die with respect to the wettable contact pads. An encapsulant is deposited over the die. The metal carrier is removed. An interconnect structure is formed over the encapsulant and electrically connected to the wettable contact pads. A plurality of conductive vias is formed through the encapsulant and extends to the contact pads. The conductive vias are aligned by the wettable contact pads with respect to the die to reduce interconnect pitch.

摘要翻译： 通过在金属载体上形成光致抗蚀剂层制成半导体器件。 在延伸到金属载体的光致抗蚀剂层中形成多个开口。 使用金属载体作为电镀电流路径，将导电材料选择性地电镀在光致抗蚀剂层的开口中，以形成可湿性接触焊盘。 半导体管芯在其表面上形成凸点。 凸块直接安装到可湿性接触垫上，以相对于可湿性接触垫对准模具。 密封剂沉积在模具上。 去除金属载体。 互连结构形成在密封剂上并电连接到可湿性接触垫上。 通过密封剂形成多个导电通孔并延伸到接触垫。 导电通孔相对于管芯可湿接触焊盘对齐，以减少互连间距。

公开(公告)号：US20110037154A1

公开(公告)日：2011-02-17

申请号：US12912467

申请日：2010-10-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/495

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An embedded semiconductor die package is made by mounting a frame carrier to a temporary carrier with an adhesive. The frame carrier includes die mounting sites each having a leadframe interconnect structure around a cavity. A semiconductor die is disposed in each cavity. An encapsulant is deposited in the cavity over the die. A package interconnect structure is formed over the leadframe interconnect structure and encapsulant. The package interconnect structure and leadframe interconnect structure are electrically connected to the die. The frame carrier is singulated into individual embedded die packages. The semiconductor die can be vertically stacked or placed side-by-side within the cavity. The embedded die packages can be stacked and electrically interconnected through the leadframe interconnect structure. A semiconductor device can be mounted to the embedded die package and electrically connected to the die through the leadframe interconnect structure.

摘要翻译： 嵌入式半导体管芯封装通过使用粘合剂将框架载体安装到临时载体上而制成。 框架架包括每个具有围绕腔的引线框架互连结构的管芯安装位置。 半导体管芯设置在每个腔中。 将密封剂沉积在模具上的空腔中。 封装互连结构形成在引线框架互连结构和密封剂上。 封装互连结构和引线框互连结构电连接到管芯。 帧载体被分成单独的嵌入式芯片封装。 半导体管芯可以垂直堆叠或并排放置在腔内。 嵌入式管芯封装可以通过引线框互连结构堆叠并电互连。 半导体器件可以安装到嵌入式裸片封装并且通过引线框互连结构电连接到裸片。

公开(公告)号：US07855100B2

公开(公告)日：2010-12-21

申请号：US12057299

申请日：2008-03-27

申请人： Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna ,  Seng Guan Chow

IPC分类号： H01L21/00 ,  H01L23/02 ,  H05K5/00

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.

摘要翻译： 一种密封腔集成电路封装系统，包括形成第一集成电路封装，其具有具有封装空腔和插入件的反向底部端子，并将组件附接在封装腔中的插入件上。

公开(公告)号：US07598606B2

公开(公告)日：2009-10-06

申请号：US11164453

申请日：2005-11-22

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/552 ,  H01L21/4828 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

摘要翻译： 一种具有管芯和封装组合的集成封装系统，包括形成具有内部引线和外部引线的引线框架，在引线框上封装第一集成电路，并在第一集成电路上封装第二集成电路。

公开(公告)号：US20090236686A1

公开(公告)日：2009-09-24

申请号：US12476447

申请日：2009-06-02

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Yaojian Lin ,  Rui Huang

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Yaojian Lin ,  Rui Huang

IPC分类号： H01L29/86 ,  H01L21/98

CPC分类号： H01L25/105 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0655 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1902 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is made by forming a first conductive layer over a temporary carrier. A UBM layer is formed over the temporary carrier and fixed in position relative to the first conductive layer. A conductive pillar is formed over the first conductive layer. A semiconductor die is mounted to the UBM layer to align the die relative to the conductive pillar. An encapsulant is deposited over the die and around the conductive pillar. The UBM layer prevents shifting of the semiconductor die while depositing the encapsulant. The temporary carrier is removed. A first interconnect structure is formed over a first surface of the encapsulant. A second interconnect structure is formed over a second surface of the encapsulant. The first and second interconnect structures are electrically connected through the conductive pillar. The first or second interconnect structure includes an integrated passive device electrically connected to the conductive pillar.

摘要翻译： 通过在临时载体上形成第一导电层制成半导体器件。 UBM层形成在临时载体上并相对于第一导电层固定在适当位置。 在第一导电层上形成导电柱。 将半导体管芯安装到UBM层上以相对于导电柱对准管芯。 密封剂沉积在模具上并且围绕导电柱。 UBM层防止半导体管芯移动，同时沉积密封剂。 移除临时载体。 在密封剂的第一表面上形成第一互连结构。 在密封剂的第二表面上形成第二互连结构。 第一和第二互连结构通过导电柱电连接。 第一或第二互连结构包括电连接到导电柱的集成无源器件。

公开(公告)号：US07435619B2

公开(公告)日：2008-10-14

申请号：US11307615

申请日：2006-02-14

申请人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

IPC分类号： H01L21/00 ,  H01L23/02 ,  H05K7/00

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a system for 3D package stacking system, comprising providing a substrate, attaching a ball grid array package, in an inverted position, to the substrate, forming a lower package, the lower package having the ball grid array package and the substrate encapsulated by a molding compound and attaching a second integrated circuit package over the lower package.

摘要翻译： 本发明提供了一种用于3D封装堆叠系统的系统，包括提供衬底，将反向位置的球栅阵列封装连接到衬底，形成下封装，下封装具有球栅阵列封装和衬底 通过模制化合物封装并且将下一个封装上的第二集成电路封装。

公开(公告)号：US20080211084A1

公开(公告)日：2008-09-04

申请号：US12040558

申请日：2008-02-29

申请人： Seng Guan Chow ,  Il Kwon Shim

发明人： Seng Guan Chow ,  Il Kwon Shim

IPC分类号： H01L23/498

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system includes: providing a mountable integrated circuit system having an encapsulation with a cavity therein and a first interposer exposed by the cavity; mounting a second interposer over the first interposer for only stacking a discrete device thereover, and with the second interposer over the encapsulation and the cavity; and mounting an electrical component over the second interposer.

摘要翻译： 集成电路封装系统包括：提供具有其中具有空腔的封装的可安装集成电路系统和由腔暴露的第一插入器; 在第一插入器上安装第二插入件，仅在其上堆叠分立器件，并且第二插入器穿过封装和空腔; 并将电气部件安装在第二插入件上。

公开(公告)号：US20070093000A1

公开(公告)日：2007-04-26

申请号：US11163547

申请日：2005-10-21

申请人： Il Kwon Shim ,  Diane Sahakian ,  Kambhampati Ramakrishna ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Diane Sahakian ,  Kambhampati Ramakrishna ,  Seng Guan Chow

IPC分类号： H01L21/00

CPC分类号： H01L25/16 ,  H01L23/3675 ,  H01L23/49861 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of terminal leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of terminal leads. A die is connected to die pad and the plurality of terminal leads.

摘要翻译： 制造用于半导体封装的预成型引线框架的方法包括提供具有管芯焊盘和多个端子引线的引线框架。 第一成型材料形成在引线框架中以暴露管芯焊盘的上表面和多个端子引线的上表面。 芯片连接到管芯焊盘和多个端子引线。