摘要:
A flip chip structure of a light-emitting device comprising a UV/blue light emitting diode (LED) is disclosed. The flip chip structure is optimized to produce unique light focusing and phosphor illumination out the bottom of the structure. The flip chip structure includes a substrate, a gallium nitride layer epitaxially grown on a top surface of the substrate, and one or more layers of lensing material deposited on a bottom surface of the substrate. The lensing material is preferably a polymer lensing material, an index matching material, or a mixture thereof. The gallium nitride layer is deposited in the form of one or more odd-sided polygons, for enhanced light extraction.
摘要:
High power LED lamps for use in lighting products, such as flashlights and the like, are formed of a plurality of LED die arranged in a multi-dimensional array, each of the LED die having a gallium nitride semiconductor layer and phosphor material for creation of white light. Each of the LED die emits light from the top, bottom and sides of the die and is arranged on the multi-dimensional array so that the emitted light from each of the die does not contact another die. A reflector gathers and focuses the light from each of the die to approximate a high power LED lamp. A thermally conducting, electrically insulating material or phase change material is incorporated into the lamp to act as a source of heat removal.
摘要:
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
摘要:
A method for processing a low dielectric constant material includes dispersing an additive material in a porous low dielectric constant layer, fabricating a desired electronic structure, and then removing the additive material from the pores of the low dielectric constant layer. The removal of the additive material from the pores can be accomplished by sublimation, evaporation, and diffusion. Applications for the low dielectric constant layer include the use as an overlay layer for interconnecting a circuit chip supported by a substrate and the use as printed circuit board material.
摘要:
Mispositioning of chips in a high density interconnect structure is compensated for by including a layer having alignment conductor in the high density interconnect structure without requiring adaptation of the signal conductor metallization levels of the high density interconnect structure. One level, two levels or more of alignment conductor may be employed. The alignment levels of the high density interconnect structure are preferably a ground plane, and if two layers of alignment conductors are provided, a power plane.
摘要:
The ultraviolet absorption characteristics of a polymer material are modified by the addition of an ultraviolet absorbing dye to render it laser ablatable at a frequency at which the unmodified material is substantially non-laser ablatable.
摘要:
A dual layer resist configuration is employed for photopatterning high resolution conductive patterns on underlying polymeric or ceramic substrates, particularly substrates exhibiting surface roughness and non-planar design features such as channels, bosses and ridges. More particularly, a thin underlayer of ablatable photoabsorptive polymer is disposed on a metal coated substrate, after which a thicker layer of substantially transparent material is disposed over the polymer. A beam of laser energy, such as that produced by an ultraviolet excimer laser, is directed through the upper layer and is absorbed by the lower layer which is ablated and simultaneously removes the thick layer above it. This results in the ability to etch high resolution features on polymeric and other substrates, particularly copper coated polyetherimide circuit boards. The resist system is also applicable to VLSI wafers even though such wafers usually do not exhibit surface roughness on the scale generally considered herein. It is also equally applicable in various high density interconnect systems used for the direct connection of chip devices. A mask for patterning and a method for making it are also seen to be desirable because of the high laser energy densities generally desired for thorough ablation.
摘要:
Circuitry for enhancing the sharpness of bandwidth compressed television signals provides equalization in only the transmitter with no equalization required in the receiver. The transmitter includes a linear phase delay and edge peaking circuit, a low pass filter and an equalization circuit. The linear phase delay and edge peaking circuit includes a tapped delay line which provides weighted output signals for differential phase delays. The weighted output signals of the tapped delay line are differentially combined to provide a combined output signal. This combined output signal and a signal from the tapped delay line are supplied to a peaking circuit. A clamping circuit is connected to limit the amplitude of high level signals in the combined output signal so that small transitions are peaked to a greater degree than large transitions.
摘要:
An improved television bandwidth compression system allows two television programs to simultaneously utilize the bandwidth normally allowed for one television program. The basic bandwidth compression system comprises a transmitter which receives composite video signals from two program sources. The video processing circuitry of the transmitter provides an output signal wherein time-compressed chrominance information for the two program sources is sent on alternate lines during the normal horizontal retrace time and the luminance information for both program sources is sent during the active video time for each line. The receiver synthesizes a composite video signal of a selected program from the output signal transmitted from the transmitter. This basic system is improved by interlacing high and low bandwidth-limited luminance signals for alternating fields of each program in a manner such that when a high bandwidth-limited luminance signal is transmitted for one program, a low bandwidth-limited luminance signal is transmitted for the other program so that the total bandwidth allocated for the luminance signals is not exceeded.
摘要:
A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.