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    SEMICONDUCTOR PACKAGE ASSEMBLY
    43.
    发明申请
    SEMICONDUCTOR PACKAGE ASSEMBLY 审中-公开

    公开(公告)号：US20160079205A1

    公开(公告)日：2016-03-17

    申请号：US14932147

    申请日：2015-11-04

    Applicant: MediaTek Inc.

    Inventor： Tzu-Hung LIN ,  I-Hsuan PENG ,  Ching-Wen HSIAO

    IPC: H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/12

    Abstract: The invention provides a semiconductor package, a semiconductor package assembly and a method for fabricating a semiconductor package. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first semiconductor die having first pads thereon. A first redistribution layer (RDL) structure is coupled to the first semiconductor die. Conductive pillar structures are disposed on a surface of the first RDL structure away from the first semiconductor die, wherein the conductive pillar structures are coupled to the first RDL structure.

    Abstract translation: 本发明提供半导体封装，半导体封装组件和用于制造半导体封装的方法。 半导体封装组件包括第一半导体封装。 第一半导体封装包括其上具有第一焊盘的第一半导体管芯。 第一再分配层（RDL）结构耦合到第一半导体管芯。 导电柱结构设置在远离第一半导体管芯的第一RDL结构的表面上，其中导电柱结构耦合到第一RDL结构。

    SEMICONDUCTOR PACKAGE STRUCTURE
    47.
    发明公开
    SEMICONDUCTOR PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20240274518A1

    公开(公告)日：2024-08-15

    申请号：US18645786

    申请日：2024-04-25

    Applicant: MEDIATEK INC.

    Inventor： Tzu-Hung LIN ,  Yuan-Chin LIU

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

    CPC classification number: H01L23/49816 ,  H01L23/3192 ,  H01L24/13 ,  H01L24/45 ,  H01L24/73 ,  H01L25/0655

    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first substrate having a first wiring structure; and a second substrate having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side, and the first substrate and the second substrate are surrounded and separated by a molding material. The semiconductor package structure also includes a redistribution layer disposed over the first substrate and the second substrate, wherein the redistribution layer is electrically coupled to the first wiring structure and the second wiring structure; and a frame surrounding the first substrate and the second substrate.

    SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA
    48.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA 有权

    公开(公告)号：US20230056550A1

    公开(公告)日：2023-02-23

    申请号：US18046218

    申请日：2022-10-13

    Applicant: MEDIATEK INC.

    Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Tzu-Hung LIN

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/38

    Abstract: An electronic device that has an antenna device that includes a conductive pattern layer comprising a first antenna element, the conductive pattern layer formed in an insulating substrate and adjacent to a first surface of the insulating substrate, and a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The electronic device further has a semiconductor package that includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer, a first electronic component electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first electronic component.

    SEMICONDUCTOR PACKAGE STRUCTURE
    49.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE 有权

    公开(公告)号：US20220336374A1

    公开(公告)日：2022-10-20

    申请号：US17810625

    申请日：2022-07-04

    Applicant: MEDIATEK INC.

    Inventor： Tzu-Hung LIN ,  Chia-Cheng CHANG ,  I-Hsuan PENG ,  Nai-Wei LIU

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/043 ,  H01L23/13 ,  H01L23/538

    Abstract: A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. A hole is formed on a surface of the substrate, wherein the hole is located within projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material, surrounding the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate, are exposed by the molding material.

    SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCATED CORNERS
    50.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCATED CORNERS 有权

    公开(公告)号：US20220020726A1

    公开(公告)日：2022-01-20

    申请号：US17488921

    申请日：2021-09-29

    Applicant: MEDIATEK INC.

    Inventor： Chia-Cheng CHANG ,  Tzu-Hung LIN ,  I-Hsuan PENG ,  Yi-Jou LIN

    IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498

    Abstract: A semiconductor package structure includes a substrate having a substrate having a first surface and second surface opposite thereto, wherein the substrate comprises a wiring structure. The structure also has a first semiconductor die disposed on the first surface of the substrate and electrically coupled to the wiring structure, and a second semiconductor die disposed on the first surface and electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged in a side-by-side manner. A molding material surrounds the first semiconductor die and the second semiconductor die, wherein the first semiconductor die is separated from the second semiconductor die by the molding material. Finally, an annular frame mounted on the first surface of the substrate, wherein the annular frame surrounds the first semiconductor die and the second semiconductor die.

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