公开(公告)号：US08102027B2

公开(公告)日：2012-01-24

申请号：US12073450

申请日：2008-03-05

申请人： Sam Ziqun Zhao ,  Chonghua Zhong ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Chonghua Zhong ,  Rezaur Rahman Khan

IPC分类号： H01L23/544

CPC分类号： H01L21/78 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/09681 ,  H05K2201/09781 ,  H01L2924/00

摘要： Systems and methods for preventing damage to a unit with preventive structures are presented. In an embodiment, a unit of a collection of units includes a functional area and a preventive structure configured to prevent cracks from propagating into the functional area.

摘要翻译： 介绍了防止结构损坏装置的系统和方法。 在一个实施例中，单元集合的单元包括功能区域和预防结构，其被配置为防止裂纹传播到功能区域。

公开(公告)号：US20110183630A1

公开(公告)日：2011-07-28

申请号：US12877706

申请日：2010-09-08

申请人： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H04B1/38 ,  H02J3/00 ,  H04B10/00

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

摘要翻译： 本发明的实施例涉及一种能够使无线总线进行片内和芯片间通信的无线使能分量（WEC）。 WEC包括IC（例如处理单元的处理核心）的功能块，整个IC（例如，处理单元）或包括多个IC的设备（ 例如手持设备）。 根据实施例，WEC可以与IC，单个IC或多个IC的一个或多个子块相关联。

公开(公告)号：US20090243054A1

公开(公告)日：2009-10-01

申请号：US12059526

申请日：2008-03-31

申请人： Fan Yeung ,  Sam Ziqun Zhao ,  Nir Matalon ,  Victor Fong

发明人： Fan Yeung ,  Sam Ziqun Zhao ,  Nir Matalon ,  Victor Fong

IPC分类号： H01L23/495 ,  H05K7/18 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Methods, systems, and apparatuses for integrated circuit packages and lead frames are provided. A quad flat no-lead (QFN) package includes a plurality of peripherally positioned pins, a die-attach paddle, an integrated circuit die, and an encapsulating material. The die-attach paddle is positioned within a periphery formed by the pins. The die is attached to the die-attach paddle. The encapsulating material encapsulates the die on the die-attach paddle, encapsulates bond wires connected between the die and the pins, and fills a space between the pins and the die-attach paddle. One or more of the pins are extended. An extended pin may be elongated, L shaped, T shaped, or “wishbone” shaped. The extended pin(s) enable wire bonding of additional ground, power, and I/O (input/output) pads of the die in a manner that does not significantly increase QFN package cost.

摘要翻译： 提供了集成电路封装和引线框架的方法，系统和装置。 四平面无引线（QFN）封装包括多个外围定位的引脚，管芯附着的焊盘，集成电路管芯和封装材料。 管芯附着板定位在由销形成的周边内。 模具连接到管芯附接板上。 封装材料将管芯封装在管芯附着的焊盘上，封装连接在管芯和引脚之间的接合线，并且填充管脚和管芯附接焊盘之间的空间。 一个或多个引脚被扩展。 延伸的销可以是细长的，L形的，T形的或“叉形”的形状。 扩展引脚可以以不显着增加QFN封装成本的方式实现管芯附加接地，电源和I / O（输入/输出）焊盘的引线接合。

公开(公告)号：US07462933B2

公开(公告)日：2008-12-09

申请号：US11475118

申请日：2006-06-27

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/10

CPC分类号： H01L23/3735 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/182 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Electrically, mechanically, and thermally enhanced ball grid array (BGA) packages are described. A substrate has a surface, wherein the surface has an opening therein. A stiffener has a surface coupled to the surface of the substrate. An area of the surface of the stiffener can be greater than, equal to, or less than an area of the surface of the substrate. A thermal connector is coupled to the surface of the stiffener through the opening. A surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. The thermal connector can have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. Alternatively, the stiffener and thermal connector may be combined into a single piece stiffener, wherein the stiffener has a protruding portion. The protruding portion extends through the opening when the stiffener is coupled to the substrate, and is capable of attachment to the PCB.

摘要翻译： 描述了电，机械和热增强球栅阵列（BGA）封装。 衬底具有表面，其中表面在其中具有开口。 加强件具有连接到基底表面的表面。 加强件的表面的面积可以大于，等于或小于衬底表面的面积。 热连接器通过开口连接到加强件的表面。 当BGA封装安装到PCB时，热连接器的表面能够连接到印刷电路板（PCB）。 热连接器可以具有这样的高度，使得当BGA封装安装到PCB时，热连接器延伸到形成在PCB的表面中的空腔中。 或者，加强件和热连接器可以组合成单件加强件，其中加强件具有突出部分。 当加强件联接到基板上时，突出部分延伸穿过开口，并且能够附接到PCB。

公开(公告)号：US20080211089A1

公开(公告)日：2008-09-04

申请号：US11707026

申请日：2007-02-16

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49531 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Methods and apparatus for improved electrical, mechanical and thermal performance of stacked IC packages are described. An IC package comprises a substrate, a first die, a second die, and an interposer with an opening in a first surface of the interposer configured to accommodate the first die. The first IC die is attached a first surface of the substrate. The interposer is mounted on the first surface of the substrate such that the first IC die is placed within the opening in the interposer. The second die is mounted on a second surface of the interposer. Wire bonds couple bond pads on the first surfaces of IC die are coupled to the first surface of the substrate. A mold compound encapsulates the first IC die, the second IC die, the interposer and the wire bonds.

摘要翻译： 描述了用于改进堆叠IC封装的电气，机械和热性能的方法和装置。 IC封装包括衬底，第一裸片，第二裸片和插入器，其中插入器的第一表面中的开口被配置成容纳第一裸片。 第一IC芯片附着在基板的第一表面上。 插入器安装在基板的第一表面上，使得第一IC芯片放置在插入件的开口内。 第二管芯安装在插入件的第二表面上。 将IC芯片的第一表面上的引线接合连接焊盘耦合到衬底的第一表面。 模具化合物封装第一IC芯片，第二IC芯片，插入器和引线键合。

公开(公告)号：US20070290322A1

公开(公告)日：2007-12-20

申请号：US11514916

申请日：2006-09-05

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/48

CPC分类号： H01L23/3675 ,  H01L21/565 ,  H01L22/10 ,  H01L23/315 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/16113 ,  H01L2224/16245 ,  H01L2224/17519 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81897 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is located on a hotspot of the IC die. The hotspot is thermally coupled to a thermal interconnect member. In an aspect, the package is encapsulated in a mold compound. In a further aspect, a heat spreader is attached to the mold compound, and is thermally coupled to the thermal interconnect member. In another aspect, a thermal interconnect member thermally is coupled between the heat spreader and the substrate.

摘要翻译： 本文描述了用于改进的集成电路（IC）封装的方法和装置。 一方面，IC器件封装包括具有接触焊盘的IC管芯，其中接触焊盘位于IC管芯的热点上。 热点热耦合到热互连构件。 在一方面，包装被包封在模具化合物中。 在另一方面，散热器附接到模具化合物，并且热耦合到热互连构件。 在另一方面，热互连构件热耦合在散热器和衬底之间。

公开(公告)号：US20070278632A1

公开(公告)日：2007-12-06

申请号：US11527573

申请日：2006-09-27

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes first and second caps defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located die attach pad, a plurality of leads, and a plurality of tie bars that couple the die attach pad to the leads. The IC die is mounted to the die attach pad. Planar rim portions of the first and second caps that surround the cavity are coupled to the leadframe. The first and second caps and the leadframe form an enclosure structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

摘要翻译： 描述了用于改善集成电路（IC）封装中的热性能和电磁干扰（EMI）屏蔽的方法和装置。 芯片或芯片封装包括限定空腔的第一和第二盖，IC芯片和引线框架。 引线框架包括位于中心的管芯附接垫，多个引线和将管芯附接垫耦合到引线的多个连接条。 IC芯片安装在管芯附着垫上。 围绕空腔的第一和第二盖的平面轮缘部分联接到引线框架。 第一和第二盖子和引线框架形成基本上封装IC管芯的外壳结构，并且屏蔽从IC管芯发出并向IC裸片辐射的EMI。 外壳结构还在运行期间消散IC芯片产生的热量。

公开(公告)号：US20070273049A1

公开(公告)日：2007-11-29

申请号：US11652007

申请日：2007-01-11

申请人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

发明人： Rezaur Rahman Khan ,  Sam Ziqun Zhao

IPC分类号： H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L21/561 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Apparatuses, methods, and systems for improved integrated circuit packages are described. An integrated circuit (IC) package includes a substrate having opposing first and second surfaces, an IC die, a plurality of conductive elements, and an encapsulating material. The substrate has a plurality of contact pads on the first surface that are electrically coupled to a plurality of electrically conductive features on the second surface. The plurality of conductive elements is formed on the first surface of the substrate. The IC die is located on the first surface of the substrate. The encapsulating material encapsulates the IC die and a portion of each element of the plurality of conductive elements.

摘要翻译： 描述了用于改进的集成电路封装的装置，方法和系统。 集成电路（IC）封装包括具有相对的第一和第二表面的基板，IC管芯，多个导电元件和封装材料。 衬底具有在第一表面上与第二表面上的多个导电特征电耦合的多个接触焊盘。 多个导电元件形成在基板的第一表面上。 IC芯片位于基板的第一表面上。 封装材料封装IC芯片和多个导电元件的每个元件的一部分。

公开(公告)号：US20070273023A1

公开(公告)日：2007-11-29

申请号：US11583718

申请日：2006-10-20

申请人： Sam Ziqun Zhao ,  Edward Law ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Edward Law ,  Rezaur Rahman Khan

IPC分类号： H01L23/34

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An apparatus and method for a wire-bond die-up area array package is described. The package includes an integrated circuit (IC) die, a substrate, and a thermally conducting body. A bottom surface of the IC die is exposed through an opening in a central region of the substrate. The die is mounted to the thermally conducting body. A bottom surface of the thermally conducting body is configured to be connected to a circuit board, such as a PWB, when the package is mounted to the circuit board. The bottom surface of the thermally conducting body may be connected directly to the circuit board, or may be coupled to the circuit board via solder balls or other mechanism. One or more wirebonds are used to electrically connect the die to a top surface of the substrate. A mold compound encapsulates the die, the wirebonds, and at least a portion of the top surface of the substrate, and fills a gap between peripheral edges of the IC die and inner walls of the substrate central window opening. A matrix of solder balls is attached to a bottom surface of the substrate.

摘要翻译： 描述了一种用于引线键合区域阵列封装的装置和方法。 封装包括集成电路（IC）管芯，衬底和导热体。 IC芯片的底表面通过衬底的中心区域中的开口露出。 模具安装到导热体上。 当封装安装到电路板时，导热体的底表面被配置为连接到电路板，例如PWB。 导热体的底表面可以直接连接到电路板，或者可以通过焊球或其它机构与电路板耦合。 一个或多个引线用于将管芯电连接到衬底的顶表面。 模具化合物封装模具，引线键和衬底的顶表面的至少一部分，并且填充IC模具的周边边缘和衬底中心窗口的内壁之间的间隙。 焊球的基体附着在基板的底面上。

公开(公告)号：US09153507B2

公开(公告)日：2015-10-06

申请号：US13362344

申请日：2012-01-31

申请人： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

发明人： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

IPC分类号： G01R31/02 ,  H01L21/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L22/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1533 ,  H01L2924/15331 ,  H01L2224/81 ,  H01L2924/014

摘要： An exemplary implementation of the present disclosure includes a testable semiconductor package that includes an active die having interface contacts and dedicated testing contacts. An interposer is situated adjacent a bottom surface of the active die, the interposer providing electrical connections between the interface contacts and a bottom surface of the testable semiconductor package. At least one conductive medium provides electrical connection between at least one of the dedicated testing contacts and a top surface of the testable semiconductor package. The at least one conductive medium can be coupled to a package-top testing connection, which may include a solder ball.

摘要翻译： 本公开的示例性实现包括可测试的半导体封装，其包括具有接口触点和专用测试触点的有源裸片。 插入器位于有源裸片的底表面附近，插入器提供接口触点之间的电连接和可测试的半导体封装的底表面。 至少一个导电介质提供至少一个专用测试触点和可测半导体封装的顶表面之间的电连接。 所述至少一个导电介质可以耦合到封装顶部测试连接，其可以包括焊球。