公开(公告)号：US07808259B2

公开(公告)日：2010-10-05

申请号：US11861559

申请日：2007-09-26

Applicant: Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Eric D. Hobbs ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/06716 ,  G01R1/07342 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L21/682 ,  Y10T29/49002

Abstract: A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.

Abstract translation: 用于对准多个结构的方法或设备可以包括将第一平面中的第一力施加到第一结构。 该方法还可以包括在第一平面中约束相对于第二结构的第一结构，使得第一结构相对于将第一结构上的第一特征与第二结构上的第二特征对准的第二结构处于相对位置。 第二特征可以在通常平行于第一平面的第二平面中。 第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

公开(公告)号：US20100154861A1

公开(公告)日：2010-06-24

申请号：US12343135

申请日：2008-12-23

Applicant: John K. Gritters

Inventor： John K. Gritters

IPC: H01L31/052 ,  H01L31/042 ,  H01L31/18

CPC classification number: H01L31/0392 ,  H01L31/0352 ,  H01L31/035281 ,  H01L31/0543 ,  H01L31/0547 ,  Y02B10/12 ,  Y02E10/52

Abstract: A solar panel can include a substrate with layers of droplets of different materials disposed on a surface of the substrate. An outer layer can be disposed away from the surface and can comprise a face of the solar panel. The layers can comprise a cathode electrode and an anode electrode disposed between the outer layer and the surface of the substrate. The layers can further comprise a P region and an N region. The P region can be disposed at least partially around the anode electrode. The N region can be disposed at least partially around the P region and at least partially around the cathode electrode. The P region and the N region can comprise droplets of a P material comprising P-doped semiconductor particles and an N material comprising N-doped semiconductor particles respectively.

Abstract translation: 太阳能电池板可以包括具有设置在基板的表面上的具有不同材料的液滴层的基板。 外层可以远离表面设置并且可以包括太阳能面板的面。 这些层可以包括阴极电极和设置在衬底的外层和表面之间的阳极电极。 这些层可进一步包括P区和N区。 P区可以至少部分地布置在阳极电极周围。 N区域可以至少部分地围绕P区域设置，并且至少部分地围绕阴极电极设置。 P区域和N区域可以包括分别包含P掺杂半导体颗粒的P材料和包含N掺杂半导体颗粒的N材料的液滴。

公开(公告)号：US20100141290A1

公开(公告)日：2010-06-10

申请号：US12339919

申请日：2008-12-19

Applicant: John K. Gritters

Inventor： John K. Gritters

IPC: G01R31/02

CPC classification number: G01R3/00 ,  G01R1/06711 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region.

Abstract translation: 本发明提供了微管阵列及其制造和使用方法的实施例。 在一些实施例中，微弹簧阵列可以包括至少两个光刻形成的弹性接触元件，每个弹性接触元件具有梁和用于接触待测试装置的尖端，其中所述梁相对于第一端基本相同的方向延伸 并且其中所述至少两个光束的端部被分开限定中心区域的距离，并且其中所述至少两个光束的各个尖端在非零非垂直方向上远离所述光束延伸成 中部地区。

公开(公告)号：US20100134127A1

公开(公告)日：2010-06-03

申请号：US12478117

申请日：2009-06-04

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/02

CPC classification number: G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。

公开(公告)号：US07729878B2

公开(公告)日：2010-06-01

申请号：US12259791

申请日：2008-10-28

Applicant: Gaetan L. Mathieu

Inventor： Gaetan L. Mathieu

IPC: G06F11/30 ,  G06F17/40 ,  G06F19/00

CPC classification number: G06F11/30 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y70/00 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

Abstract: A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.

Abstract translation: 根据本发明的一些实施例的探针卡组件可以包括测试器接口，其被配置为与测试控制器进行电连接，多个导电探针被设置成接触要测试的电子设备的端子，以及多个 连接测试仪接口和探头的导电数据路径。 数据路径中的至少一个可以包括空气桥结构迹线，其包括通过多个塔架与导电板间隔开的导电迹线。

公开(公告)号：US07714598B2

公开(公告)日：2010-05-11

申请号：US12054289

申请日：2008-03-24

Applicant: Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

Inventor： Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

IPC: G01R31/02 ,  G01R31/26

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07714235B1

公开(公告)日：2010-05-11

申请号：US09539287

申请日：2000-03-30

Applicant: David V. Pedersen ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Igor Y. Khandros

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4092 ,  G01R1/06727 ,  G01R1/06761 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/0311 ,  H05K2201/0347 ,  H01L2924/00

Abstract: Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, 322, 422) in the masking layer, depositing a conductive trace of a seed layer (250, 350, 450) onto the masking layer and into the openings, and building up a mass of conductive material on the conductive trace. The sidewalls of the opening can be sloped (tapered). The conductive trace can be patterned by depositing material through a stencil or shadow mask (240, 340, 440). A protruding feature (230, 430) may be disposed on the masking layer so that a tip end (264, 364, 464) of the contact structure acquires a topography. All of these elements can be constructed as a group to form a plurality of precisely positioned resilient contact structures.

Abstract translation: 微电子接触结构（260,360,460）通过在诸如电子部件的基板（202,302,402）的表面上施加掩模层（220,320,420）而光刻地限定和制造，从而产生开口 222,322,422），将掩蔽层上的种子层（250,350,450）的导电迹线沉积到所述开口中，并在所述导电迹线上建立一块导电材料。 开口的侧壁可以是倾斜的（渐缩的）。 导电迹线可以通过沉积材料通过模板或荫罩（240,340,440）进行图案化。 可以在掩蔽层上设置突出特征（230,430），使得接触结构的末端（264,364,464）获取形貌。 所有这些元件可以被构造成一组以形成多个精确定位的弹性接触结构。

公开(公告)号：US20100104678A1

公开(公告)日：2010-04-29

申请号：US12259915

申请日：2008-10-28

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B28B7/36 ,  C25D1/10

CPC classification number: C25D1/003 ,  B21D37/20 ,  G01R3/00 ,  H05K3/125 ,  H05K3/245 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0329 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0723 ,  H05K2203/308

Abstract: A method of making a tooling die can include depositing a plurality of layers onto a substrate using a printing process. Selected portions of the plurality of layers can be removed to expose a surface defining a desired shape of the tooling die. An electrically conductive material can be deposited to form a seed layer, and a structural material can be electrodeposited onto the seed layer to form the tooling die. The tooling die can be used to form contact structures on an electronic component.

Abstract translation: 制造模具的方法可以包括使用印刷方法将多个层沉积到基板上。 可以移除多个层中的选定部分以露出限定模具的期望形状的表面。 可以沉积导电材料以形成种子层，并且可以将结构材料电沉积到种子层上以形成工具模具。 模具可用于在电子部件上形成接触结构。

公开(公告)号：US07688090B2

公开(公告)日：2010-03-30

申请号：US12050857

申请日：2008-03-18

Applicant: Igor Y. Khandros ,  David V. Pedersen

Inventor： Igor Y. Khandros ,  David V. Pedersen

IPC: G01R31/02 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/287 ,  G01R31/2874 ,  G01R31/318511 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller and promulgating these signals over the relatively many interconnections between the ASICs and the DUTs. The ASICs can also generate at least a portion of these signals in response to control signals from the host controller. Physical alignment techniques are also described. Micromachined indentations on the front surface of the ASICs ensure capturing free ends of the spring contact elements. Micromachined features on the back surface of the ASICs and the front surface of the interconnection substrate to which they are mounted facilitate precise alignment of a plurality of ASICs on the support substrate.

Abstract translation: 用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件的测试基板，例如安装到互连基板或并入其中的ASIC，实现ASIC和多个器件之间的互连的金属弹簧接触元件 在测试晶片（WUT）上的测试（DUT）都被置于真空容器中，使得ASIC可以在与DUT的老化温度无关并且显着低于DUT的老化温度的温度下工作。 弹簧接触元件可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。 由于ASIC能够通过相对较少的来自主机控制器的信号线接收用于测试DUT的多个信号，并且在这些信号之间的相对多的互连上发布这些信号，因此实现了互连计数的显着减少和互连基板的随后简化。 ASIC和DUT。 ASIC还可以响应于来自主机控制器的控制信号而产生这些信号的至少一部分。 还描述了物理对准技术。 ASIC的前表面上的微加工凹口确保捕获弹簧接触元件的自由端。 ASIC的后表面上的微加工特征和它们所安装的互连基板的前表面有助于精确地对准支撑基板上的多个ASIC。

公开(公告)号：US07688063B2

公开(公告)日：2010-03-30

申请号：US12165325

申请日：2008-06-30

Applicant: Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

Inventor： Andrew W. McFarland ,  Kevin Youl Yasumura ,  Eric D. Hobbs ,  Keith J. Breinlinger

IPC: G01R31/02

CPC classification number: G01R1/44 ,  G01R1/07307 ,  G01R31/2891

Abstract: A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.

Abstract translation: 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。