Patent search ap:("Igor Y. Khandros" OR "Gaetan L. Mathieu") AND inv:"Gaetan L. Mathieu" Page 1

1.

发明授权
Multilayered probe card 有权
Title translation: 多层探针卡

公开(公告)号：US07948252B2

公开(公告)日：2011-05-24

申请号：US12173695

申请日：2008-07-15

Applicant: Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng

Inventor： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng

IPC: G01R31/02

CPC classification number: G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract translation: 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

2.

发明授权
Contact carriers (tiles) for populating larger substrates with spring contacts 失效
Title translation: 接触托架（瓷砖），用于通过弹簧触点填充较大的基板

公开(公告)号：US07714598B2

公开(公告)日：2010-05-11

申请号：US12054289

申请日：2008-03-24

Applicant: Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith

Inventor： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith

IPC: G01R31/02 , G01R31/26

CPC classification number: H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。接触结构附着在第一基底上或形成在第一基底上。第一衬底附接到比第一衬底大的第二衬底。可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

3.

发明申请
APPARATUS AND METHOD FOR MAKING AND USING A TOOLING DIE 审中-公开
Title translation: 制造和使用工具DIE的装置和方法

公开(公告)号：US20100104678A1

公开(公告)日：2010-04-29

申请号：US12259915

申请日：2008-10-28

Applicant: Igor Y. Khandros , Gaetan L. Mathieu

Inventor： Igor Y. Khandros , Gaetan L. Mathieu

IPC: B28B7/36 , C25D1/10

CPC classification number: C25D1/003 , B21D37/20 , G01R3/00 , H05K3/125 , H05K3/245 , H05K3/326 , H05K3/4092 , H05K2201/0311 , H05K2201/0329 , H05K2203/0108 , H05K2203/013 , H05K2203/0723 , H05K2203/308

Abstract: A method of making a tooling die can include depositing a plurality of layers onto a substrate using a printing process. Selected portions of the plurality of layers can be removed to expose a surface defining a desired shape of the tooling die. An electrically conductive material can be deposited to form a seed layer, and a structural material can be electrodeposited onto the seed layer to form the tooling die. The tooling die can be used to form contact structures on an electronic component.

Abstract translation: 制造模具的方法可以包括使用印刷方法将多个层沉积到基板上。可以移除多个层中的选定部分以露出限定模具的期望形状的表面。可以沉积导电材料以形成种子层，并且可以将结构材料电沉积到种子层上以形成工具模具。模具可用于在电子部件上形成接触结构。

4.

发明申请
PROBE CARD ASSEMBLY AND KIT, AND METHODS OF MAKING SAME 失效
Title translation: 探针卡组件和套件及其制造方法

公开(公告)号：US20090291573A1

公开(公告)日：2009-11-26

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , Y10T29/49222 , H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器空间变压器和探针卡之间。空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调整范围内在空间变压器和探针卡之间保持电连接。使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

5.

发明授权
Microelectronic spring contact elements 失效
Title translation: 微电子弹簧接触元件

公开(公告)号：US07579269B2

公开(公告)日：2009-08-25

申请号：US10821715

申请日：2004-04-08

Applicant: Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen

Inventor： Benjamin N. Eldridge , Igor Y. Khandros , Gaetan L. Mathieu , David V. Pedersen

IPC: H01L21/00

CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07371 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01H1/0036 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6715 , H01L21/67248 , H01L21/67253 , H01L21/67288 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13164 , H01L2224/13169 , H01L2224/1318 , H01L2224/13184 , H01L2224/45099 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2224/13099 , H01L2224/48 , H01L2224/45015 , H01L2924/207

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。每个弹簧接触元件具有基端，接触端和中心主体部分。接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

6.

发明授权
Methods of probing an electronic device 失效
Title translation: 探测电子设备的方法

公开(公告)号：US07463043B2

公开(公告)日：2008-12-09

申请号：US11748988

申请日：2007-05-15

Applicant: Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu

Inventor： Timothy E. Cooper , Benjamin N. Eldridge , Igor Y. Khandros , Rod Martens , Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2886 , G01R31/2887

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。然后电子设备水平或对角地移动，使得端子接触探针。然后通过探头将测试数据传送到电子设备和从电子设备传送。

7.

发明授权
Composite microelectronic spring structure and method for making same 失效
Title translation: 复合微电子弹簧结构及其制作方法

公开(公告)号：US07063541B2

公开(公告)日：2006-06-20

申请号：US09746716

申请日：2000-12-22

Applicant: Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

Inventor： Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: G01R1/06727 , G01R1/06744 , G01R1/07342 , G01R3/00 , H01H1/0036 , H01L23/49811 , H01L24/06 , H01L24/10 , H01L24/72 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/30105 , H05K3/20 , H05K3/3421 , H01L2224/13099 , H01L2224/29099 , H01L2924/00

Abstract: An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam attached to a post, of replacing the post with a plurality of column elements. The beam component is thus provided with one or more column elements which both structurally support and electrically connect one end of the beam to an electronic component. The column elements are preferably comprised of relatively straight segments of wire elements that are ball-bonded to a substrate and are over-coated with suitable structural and/or conducting materials. In the alternative, the improvement comprises a single column element comprised of a relatively straight segment of wire that is ball-bonded to a substrate and over-coated with suitable structural and conducting materials, wherein the column element is essentially rigid. The improved spring structures are especially useful for use as spring contacts on substrates such as probe cards, interposers, semiconductor devices, and other electronic components.

Abstract translation: 公开了一种改进的微电子弹簧结构及其制造方法。该改进包括在包括附接到柱的梁的类型的弹簧接触中，用多个柱元件替换柱。因此，梁部件设置有一个或多个列元件，其两个结构上支撑并将电子束的一端电连接到电子部件。柱元件优选地由相对直的线元件组成，其被球形结合到基底并且被适当的结构和/或导电材料覆盖。在替代方案中，改进包括单柱元件，其由相对直的导线段组成，其与球体结合到基底上并用适当的结构和导电材料涂覆，其中柱元件基本上是刚性的。改进的弹簧结构特别适用于诸如探针卡，插入件，半导体器件和其它电子部件的基板上的弹簧触点。

8.

发明授权
Methods for making plated through holes usable as interconnection wire or probe attachments 有权

公开(公告)号：US07024763B2

公开(公告)日：2006-04-11

申请号：US10723269

申请日：2003-11-26

Applicant: Gaetan L. Mathieu , Igor Y. Khandros , Carl Reynolds

Inventor： Gaetan L. Mathieu , Igor Y. Khandros , Carl Reynolds

IPC: H05K3/30

CPC classification number: H05K3/42 , G01R1/06711 , G01R1/07307 , G01R3/00 , H05K3/308 , H05K2201/09836 , H05K2203/0338 , Y10T29/49117 , Y10T29/49139 , Y10T29/49147 , Y10T29/49149 , Y10T29/49156 , Y10T29/49162 , Y10T29/49165 , Y10T29/49169 , Y10T29/49194

Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.

9.

发明授权
Apparatus and method for cleaning test probes 失效
Title translation: 测试探针清洗装置及方法

公开(公告)号：US06840374B2

公开(公告)日：2005-01-11

申请号：US10050908

申请日：2002-01-18

Applicant: Igor Y. Khandros , Benjamin N. Eldridge , Treliant Fang , Gaetan L. Mathieu , Gary W. Grube , Michael A. Drush , Christopher C. Buckholtz

Inventor： Igor Y. Khandros , Benjamin N. Eldridge , Treliant Fang , Gaetan L. Mathieu , Gary W. Grube , Michael A. Drush , Christopher C. Buckholtz

IPC: A47L25/00 , B08B1/00 , B08B7/00 , C08L83/05 , C08L83/07 , C08L83/08 , G01R1/067 , G01R3/00 , H01L21/304 , H01L21/66 , B65D69/00 , B32B5/00 , B32B9/04

CPC classification number: C08G77/48 , B08B1/00 , B08B7/0028 , G01R1/06711 , G01R3/00 , Y10T428/24388 , Y10T428/31663

Abstract: A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Abstract translation: 用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的层的清洁装置。探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。