公开(公告)号：US5492266A

公开(公告)日：1996-02-20

申请号：US298983

申请日：1994-08-31

Applicant: Karl G. Hoebener ,  Eric M. Hubacher ,  Julian P. Partridge

Inventor： Karl G. Hoebener ,  Eric M. Hubacher ,  Julian P. Partridge

IPC: B41F15/08 ,  B23K3/06 ,  B41M1/12 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H05K3/12 ,  H05K3/34 ,  B23K1/00

CPC classification number: H05K3/3484 ,  B23K3/06 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H05K3/1225 ,  B23K2201/36 ,  H01L2224/11 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/0557 ,  H05K2203/1476 ,  H05K3/1216

Abstract: A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select contacts of a printed circuit board. The method is particularly suited to the fabrication of populated printed circuit board having fine pitch devices including flip-chip devices, connected on a board including conventional coarse pitch surface mounted components. The fine pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. With the stencil fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board. Thereafter, according to a preferred practice of the invention, the stencil is removed from the board and the board is subject to previously practiced depositions of flux and paste in preparation for fine and coarse pitch component placement and ensuing solder reflow. Alternate practices of the invention involve concurrent deposition of fine and coarse pitch solder and retention of the stencil following fine pitch solder fellow.

Abstract translation: 一种由此制造的产品，通过这种方法，在印刷电路板的选择的触点上形成适用于部件回流连接的低熔点焊料。 该方法特别适用于制造具有细间距器件的填充印刷电路板，其中包括倒装芯片器件，其连接在包括常规粗节距表面安装部件的板上。 板的细间距触点通过模板中的孔露出，其特征在于其能够承受焊料回流温度，不能被焊料润湿，并且具有与印刷电路板相对匹配的热膨胀系数。 低温焊膏被屏幕沉积在模板孔中。 当模板固定在板上时，由模板图案保持的焊膏被回流以选择性地形成在印刷电路板的下面的触点上。 此后，根据本发明的优选实践，将模板从板上移除，并且板经历先前实践的焊剂和浆料沉积，以准备精细和粗略的沥青组分放置以及随后的回流焊。 本发明的替代实践涉及精细和粗沥青焊料的同时沉积以及在细间距焊料之后保留模板。

公开(公告)号：US5367124A

公开(公告)日：1994-11-22

申请号：US84643

申请日：1993-06-28

Applicant: Herman S. Hoffman ,  Richard W. Noth

Inventor： Herman S. Hoffman ,  Richard W. Noth

IPC: H01L23/50 ,  B23K1/00 ,  H01L23/495 ,  H01R4/02 ,  H05K1/02 ,  H05K3/34 ,  H01H9/02

CPC classification number: B23K1/0016 ,  H01L23/495 ,  H01L23/4951 ,  H01L23/49582 ,  H05K3/3426 ,  B23K2201/36 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/14 ,  H01R12/57 ,  H01R4/028 ,  H05K1/0271 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10848 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: A compliant lead for electromechanically surface mounting an integrated circuit chip package to a substrate. The compliant lead extends from the package and includes at least two regions of different lead thickness. In a first region, a standard lead thickness is employed to ensure the applicability of existing package fabrication techniques. A second region, having a reduced thickness, then extends from the first region and is predefined to encompass an area of the lead expected to undergo greatest stress during thermal cycling. Compliancy is further guaranteed by providing a solder dam within the region of reduced thickness to limit wicking of solder when the package is solder mounted to the substrate. Lead frame fabrication is also discussed.

Abstract translation: 用于将集成电路芯片封装机械地表面安装到衬底的柔性引线。 柔性引线从封装延伸并且包括不同引线厚度的至少两个区域。 在第一区域中，使用标准铅厚度来确保现有封装制造技术的适用性。 具有减小的厚度的第二区域然后从第一区域延伸并且被预定义以包含期望在热循环期间经受最大应力的引线的区域。 通过在厚度较小的区域内提供焊锡坝，以便在封装焊接到基板上时限制焊料的芯吸，进一步保证了兼容性。 引线框架制造也被讨论。

公开(公告)号：US5358169A

公开(公告)日：1994-10-25

申请号：US182215

申请日：1994-01-14

Applicant: Richard E. Caddock ,  Robert C. Bowen

Inventor： Richard E. Caddock ,  Robert C. Bowen

IPC: B23K1/00 ,  H05K3/34 ,  B23K31/02 ,  H01L21/60

CPC classification number: B23K1/0016 ,  H01L24/97 ,  H05K3/3405 ,  H05K3/3478 ,  B23K2201/36 ,  H01L2924/15787 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/0405 ,  H05K3/3421 ,  H05K3/3494 ,  Y10S228/902

Abstract: A method of soldering leads to electrical elements, such as resistors, in which a ribbon of solder, having a coating of flux, is sandwiched between a plurality of electrical elements and a plurality of leads. Hydrogen flames then cut the ribbon at points between the electrical elements and also between the leads. The hydrogen flames are then directed at the leads to melt the solder and cause extending portions of the ribbons to be drawn towards the leads.

Abstract translation: 一种焊接电线的方法，例如电阻器，其中具有焊剂涂层的焊料带被夹在多个电气元件和多个引线之间。 氢气火焰然后在电元件之间以及引线之间的点处切割色带。 然后将氢火焰引导到引线上以熔化焊料，并使带状物的延伸部分被拉向引线。

公开(公告)号：US5358166A

公开(公告)日：1994-10-25

申请号：US43908

申请日：1993-04-07

Applicant: Haruo Mishina ,  Masato Itagaki

Inventor： Haruo Mishina ,  Masato Itagaki

IPC: B23K1/008 ,  B23K3/04 ,  B23K101/42 ,  H05K3/34 ,  B23K1/012

CPC classification number: B23K1/008 ,  B23K2201/36

Abstract: A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer.A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.

Abstract translation: 回流焊接装置包括预热室和回流室，它们都配备有多个用于循环由横流鼓风机，发散喷嘴，加热器，温度传感器，温度控制器 和动力调节器等。输送机上方的交叉流动鼓风机以背靠背的方式布置，输送机下面的鼓风机以面对面的方式布置，并且通过将热气体撞击在电路上来进行焊接 基板由输送机传送。 提供了一种在预热室和回流室中具有小的温度波动的回流焊接装置，通过保持期望的温度曲线在焊接中的高可靠性以及优选的经济性。

公开(公告)号：US5316788A

公开(公告)日：1994-05-31

申请号：US736380

申请日：1991-07-26

Applicant: Eric P. Dibble ,  Steven L. Hanakovic ,  Voya R. Markovich ,  Daniel S. Niedrich ,  Gary P. Vlasak ,  Richard S. Zarr ,  Richard C. Senger

Inventor： Eric P. Dibble ,  Steven L. Hanakovic ,  Voya R. Markovich ,  Daniel S. Niedrich ,  Gary P. Vlasak ,  Richard S. Zarr ,  Richard C. Senger

IPC: H01L21/52 ,  B23K1/00 ,  B23K1/08 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  B05D1/00

CPC classification number: B23K1/085 ,  B23K1/0016 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/243 ,  H05K3/3468 ,  B23K2201/36 ,  H01L2924/0002 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/044 ,  H05K2203/054 ,  H05K3/067 ,  H05K3/3452

Abstract: Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.

Abstract translation: 描述了用于将大量焊料应用于小面积，例如高密度卡片的焊盘，其旨在表面安装电子器件或直接附接电路化芯片。 通过在陆地周边沉积相对较薄的金属层，波峰焊接，将多余的焊料沉积在延伸的焊盘区域上，并回流焊接，由此金属薄层溶解到焊料中，引起焊料的临时扩展。 缩小到原始土地的尺寸。 因为焊料的体积增加，焊点的强度和可靠性大大提高。

公开(公告)号：US5274911A

公开(公告)日：1994-01-04

申请号：US780111

申请日：1991-10-21

Applicant: Joseph A. Toro

Inventor： Joseph A. Toro

IPC: H01L21/48 ,  H01L23/495 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H01R43/00

CPC classification number: H01L21/4821 ,  H01L23/49582 ,  H01R4/028 ,  H01R43/0235 ,  H05K3/3447 ,  B23K2201/36 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/1147 ,  H05K2203/304 ,  Y10T29/49121 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material. Leads having a center region devoid of solder plating may be formed by providing a lead frame, with selectively plated and punched regions of the lead frame to form the internal and external lead portions, plating the internal and external lead portions with solder and thereafter punching the center unplatted region to provide a plurality of leads having a center unplatted region. Components are thereafter electrically coupled to the solder plated internal portions of the leads on the lead frame with the leads and attached electrical components encased in an encasement material so that the encasement material is in direct contact with the unplatted center region of the leads.

Abstract translation: 电气设备包括封装在封装材料中的电气部件，引线电耦合到部件并延伸穿过封装材料以附接到电路。 引线包括镀有用于附接到部件的焊料的内部区域，镀有用于将部件电耦合到电路板的焊料的外部区域，以及在内部和外部区域之间的中间区域，其中没有焊料并且被定位 与包装材料接触以限定铅和包装材料之间的未镀层界面。 具有不具有焊料镀层的中心区域的引线可以通过提供引线框架，引线框架的选择性镀覆和冲压区域形成内部和外部引线部分，用焊料电镀内部和外部引线部分，然后冲压 中心未平坦区域以提供具有中心未平坦区域的多个引线。 然后，元件电连接到引线框架上的引线的焊接镀层内部，引线和附接的电气部件封装在封装材料中，使得封装材料与引线的未平坦的中心区域直接接触。

公开(公告)号：US5272310A

公开(公告)日：1993-12-21

申请号：US852050

申请日：1992-03-16

Applicant: Norio Daikuzono

Inventor： Norio Daikuzono

IPC: B23K1/00 ,  B23K1/005 ,  B23K26/04 ,  B23K26/06 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K26/00

CPC classification number: B23K26/0676 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/0056 ,  B23K26/06 ,  B23K26/0604 ,  B23K26/064 ,  H01L24/80 ,  H01R43/0221 ,  H05K3/3494 ,  B23K2201/36 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2203/107 ,  H05K3/3421 ,  H05K3/3447

Abstract: The present invention relates to a method of soldering electronic components to each other. When a member to be bonded is soldered to a base material by irradiating the member to be bonded with laser lights, the laser lights are incident upon a laser light transmittable probe and are emitted from the front end of the probe and the front end of the probe is in substantial contact with a solder or the member to be bonded.

公开(公告)号：US3915546A

公开(公告)日：1975-10-28

申请号：US48750574

申请日：1974-07-11

Applicant: AMP INC

Inventor： COBAUGH ROBERT FRANKLIN ,  PARMER KENNETH RONALD

IPC: B23K3/06 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H01R9/06

CPC classification number: H01R4/028 ,  B23K3/0676 ,  B23K2201/36 ,  H01R43/0235 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081

Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shapes of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

Abstract translation: 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的扁平化有助于通过改变焊接带的形状并且通过减少它们的结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。

公开(公告)号：US3627192A

公开(公告)日：1971-12-14

申请号：US3627192D

申请日：1969-02-03

Applicant: BEARINGS SEALE & GEARS INC

Inventor： KILLINGSWORTH WILLIAM A

IPC: B23K20/00 ,  B29C65/08 ,  H01L21/00 ,  B23K3/02

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K2201/36 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A bonding tool for wire lead bonding including a relatively stiff shank, a wire guide and a bonding tip of relatively hard, slightly ductile, inert material.

公开(公告)号：US3172387A

公开(公告)日：1965-03-09

申请号：US2756260

申请日：1960-05-09

Applicant: SPRAGUE ELECTRIC CO

Inventor： BURKE EARL J

IPC: B23K3/06

CPC classification number: B23K3/0692 ,  B23K2201/36