公开(公告)号：US20140350901A1

公开(公告)日：2014-11-27

申请号：US14248422

申请日：2014-04-09

Applicant: FUJITSU LIMITED

Inventor： Hideaki Nagaoka ,  Taiga Fukumori ,  Daisuke Mizutani

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0005 ,  H05K2201/029

Abstract: Three-dimensional electromagnetic field analysis is performed for a plurality of positional patterns of a first wiring board internal structure model including one glass cloth on the upper side of differential lines and also for a plurality of positional patterns of a second wiring board internal structure model including one glass cloth on the lower side of differential lines to calculate skews, and the calculated skews are summed relating to a plurality of wiring board patterns configured by combining a plurality of combination patterns obtained by combining the plurality of positional patterns of the first model and a plurality of combination patterns obtained by combining the plurality of positional patterns of the second model to calculate a total skew and then a skew distribution in a wiring board having a certain line length is acquired based on the total skew.

Abstract translation: 对于在差分线路的上侧包括一个玻璃布的第一布线板内部结构模型的多个位置图案以及包括第二布线板内部结构模型的多个位置图案的多个位置图案进行三维电磁场分析，包括 在差分线路的下侧的一块玻璃布计算偏斜，计算出的倾斜与通过组合通过组合第一模型的多个位置图案而获得的多个组合图案而组合的多个布线板图案相加， 通过组合第二模型的多个位置图案而获得的多个组合图案，以计算总歪斜，然后基于总歪斜获得具有一定行长度的布线板中的歪斜分布。

公开(公告)号：US20140327299A1

公开(公告)日：2014-11-06

申请号：US14260748

申请日：2014-04-24

Applicant: ROLLS-ROYCE PLC

Inventor： Paul BROUGHTON ,  Michael Christopher WILLMOT

IPC: B60R16/03

CPC classification number: B60R16/03 ,  F02C7/00 ,  F05D2300/603 ,  H05K3/0014 ,  H05K2201/029 ,  H05K2201/10151 ,  H05K2203/1316 ,  Y02T50/672

Abstract: The present invention provides a rigid raft. The raft has an electrical system including electrical conductors embedded in the raft. The raft further has one or more sensors embedded therein for monitoring parameters, for example the temperature and/or strain of the raft itself.

Abstract translation: 本发明提供一种刚性筏。 木筏具有电气系统，包括埋在筏内的电导体。 筏还具有一个或多个嵌入其中的传感器，用于监测参数，例如筏本身的温度和/或应变。

公开(公告)号：US08871660B2

公开(公告)日：2014-10-28

申请号：US12523320

申请日：2008-02-07

Applicant: Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

Inventor： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

IPC: B32B15/14 ,  B32B27/38 ,  D03D13/00 ,  B32B5/08 ,  B32B5/26 ,  H05K1/03 ,  D04H13/00 ,  B29C65/00 ,  B32B5/28 ,  B32B5/12 ,  H05K1/02

CPC classification number: H05K1/0366 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B29/005 ,  B32B29/02 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/036 ,  H05K2201/029 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/24124 ,  Y10T442/2951 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3463 ,  Y10T442/3496

Abstract: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

Abstract translation: 提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为 所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度 以较大者为准，为2°以下。

公开(公告)号：US20140262450A1

公开(公告)日：2014-09-18

申请号：US13940144

申请日：2013-07-11

Applicant: Yun-Chao YEH

Inventor： Yun-Chao YEH ,  Han-Shiang HUAG ,  Yu-Ying MA

IPC: H05K1/02

CPC classification number: H05K1/0207 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/10106

Abstract: A multilayer printed circuit board structure is formed by stacking an aluminum foil substrate, a first pre-impregnated body, an aluminum foil middle layer, a second pre-impregnated body and a copper foil surface layer sequentially. Both the first pre-impregnated body and the second pre-impregnated body are composed by a fiber cloth impregnated with a heat conduction material in order that the heat conduction material can fill up the gaps of the fiber cloth. The heat conduction material is mixed from at least a resin and a filling material.

Abstract translation: 通过层叠铝箔基板，第一预浸渍体，铝箔中间层，第二预浸渍体和铜箔表面层，形成多层印刷电路板结构。 第一预浸渍体和第二预浸渍体均由浸渍有导热材料的纤维布组成，以便导热材料可以填充纤维布的间隙。 导热材料至少从树脂和填充材料混合。

公开(公告)号：US08822269B2

公开(公告)日：2014-09-02

申请号：US14044497

申请日：2013-10-02

Applicant: Renesas Electronics Corporation

Inventor： Eiji Hayashi ,  Kyo Go ,  Kozo Harada ,  Shinji Baba

IPC: H01L21/00

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/373 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/81 ,  H01L2021/6015 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81909 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/0366 ,  H05K3/4602 ,  H05K2201/029 ,  H01L2924/0132 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Abstract translation: 即使省略了加强件，也可以获得能够防止布线基板发生扭曲和变形的半导体装置。 对于具有布线基板的半导体器件，制作倒装芯片的布线基板的半导体芯片和附着在半导体芯片背面的散热器，省略了用于加强布线基板的加强板 并且保持散热器的表面平滑性，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。

公开(公告)号：US20140191211A1

公开(公告)日：2014-07-10

申请号：US14110534

申请日：2012-03-23

Applicant: Peter Chabrecek ,  Uriel Sonderegger

Inventor： Peter Chabrecek ,  Uriel Sonderegger

IPC: H05K1/02 ,  H01L51/56 ,  H01L31/0224 ,  H05K1/18 ,  H01L51/00 ,  H01L33/38

CPC classification number: H05K1/0274 ,  D03D1/0088 ,  D10B2401/16 ,  H01L31/0224 ,  H01L33/38 ,  H01L51/0037 ,  H01L51/0096 ,  H01L51/0097 ,  H01L51/442 ,  H01L51/5203 ,  H01L51/56 ,  H01L2924/0002 ,  H05K1/038 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Electrode substrate for an optoelectronic device having a fabric (10) that includes electrically conductive (14; 56) as well as non-conductive (12; 50) and transparent fibres wherein the fabric is furnished over a wide area with a transparent, electrically conductive coating (26, 28, 58) in such manner that projecting or exposed portions of the electrically conductive fibres cooperate with the conductive coating in order to produce electrical contacts, wherein the conductive coating has a layer thickness that is smaller than a mean diameter of the electrically conductive and electrically non-conductive fibres of the fabric, a fabric weave of the electrically conductive fibres of the fabric is organized in such a manner that in order to create the protruding portions, the fibres encompass at least 2 of the non-conductive fibres that extend transversely in the manner of a twill weave, the fabric is embedded in the coating in such manner that portions (20; 22; 56) of the conductive fibres protrude from a non-conducting polymer material of the coating and/or are exposed, at least on one side of the coating, and the coating is applied to a polymeric, electrically non-conductive and transparent carrier film that is situated opposite the conductive coating that is applied to one side relative to the fabric.

Abstract translation: 用于具有包括导电（14; 56）以及非导电（12,50））和透明纤维的织物（10）的光电子器件的电极基底，其中所述织物被布置在具有透明，导电 涂层（26,28,58），使得导电纤维的突出或暴露部分与导电涂层配合以产生电接触，其中导电涂层的层厚度小于 织物的导电和非导电纤维，织物的导电纤维的织物组织以这样的方式组织，即为了产生突出部分，纤维包含至少2个非导电纤维 其以斜纹织造的方式横向延伸，织物以这样的方式嵌入涂层中，使得导电纤维的部分（20; 22; 56） 从涂层的非导电聚合物材料突出和/或暴露于涂层的至少一侧，并将涂层施加到与导电涂层相对的聚合物，非导电和透明的载体膜 其被施加到相对于织物的一侧。

公开(公告)号：US08760877B2

公开(公告)日：2014-06-24

申请号：US13133411

申请日：2009-12-03

Applicant: Rabin Bhattacharya ,  Martijn Krans ,  Liesbeth Van Pieterson ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

Inventor： Rabin Bhattacharya ,  Martijn Krans ,  Liesbeth Van Pieterson ,  Thomas Schuler ,  Guido Lamerichs ,  Erwin Altewischer

IPC: H05K1/00

CPC classification number: H05K1/038 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/029 ,  H05K2201/10106

Abstract: The present invention relates to a flexible modular assembly (100) comprising at least two flexible electronic modules (110 and 111) supported by a textile support (130). The two flexible electronic modules and the textile support each comprise a set of electrical conductors. The flexible modular assembly further comprises flexible connectors (140) for interconnecting two sets of electrical conductors. The flexible modular assembly of the invention is a modular textile assembly for use in large-area applications of electronic textiles.

Abstract translation: 本发明涉及一种柔性模块化组件（100），其包括由纺织品支撑件（130）支撑的至少两个柔性电子模块（110和111）。 两个柔性电子模块和纺织支撑件各自包括一组电导体。 柔性模块化组件还包括用于互连两组电导体的柔性连接器（140）。 本发明的柔性模块化组件是用于电子纺织品的大面积应用的模块化纺织组件。

公开(公告)号：US20140158406A1

公开(公告)日：2014-06-12

申请号：US14232595

申请日：2012-07-19

Applicant: Hiroaki Kato ,  Kiyotaka Komori

Inventor： Hiroaki Kato ,  Kiyotaka Komori

IPC: H05K1/03

CPC classification number: H05K1/03 ,  H01P3/026 ,  H01P3/082 ,  H01P3/085 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/029

Abstract: An object of the present invention is to provide a printed wiring board which does not require arranging signal lines oblique to the warp or weft threads constituting a substrate and is capable of reducing a difference in transmission rates between the signal lines. The present invention relates to a printed wiring board including: an insulating layer; and a signal layer including a set of at least two signal lines and disposed on one side of the insulating layer. A substrate is embedded inside the insulating layer in such a manner to be further from the signal layer than a center of the insulating layer in a thickness direction of the insulating layer is. The insulating layer has a laminated structure of a thick layer, the substrate, and a thin layer. A ratio of a thickness of the thick layer to a thickness of the thin layer is greater than five.

Abstract translation: 本发明的目的是提供一种印刷线路板，其不需要将信号线布置成构成基板的经线或纬线倾斜，并且能够减小信号线之间的传输速率的差异。 印刷电路板技术领域本发明涉及一种印刷电路板，包括：绝缘层; 以及包括一组至少两条信号线并设置在绝缘层的一侧上的信号层。 在绝缘层的内部，绝缘层的厚度方向的绝缘层的绝缘层的中心以外的信号层被埋设在绝缘层的内部。 绝缘层具有厚层，基板和薄层的叠层结构。 厚层的厚度与薄层的厚度之比大于5。

公开(公告)号：US20140127483A1

公开(公告)日：2014-05-08

申请号：US13761613

申请日：2013-02-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Seok Moon ,  Sa Yong Lee ,  Seong Hyun Yoo

IPC: H05K3/00 ,  B32B3/10 ,  B32B17/04 ,  H05K1/03 ,  B32B7/02 ,  B32B15/08

CPC classification number: B32B7/02 ,  B32B15/20 ,  B32B17/04 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T428/24917 ,  Y10T428/2495

Abstract: Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate.

Abstract translation: 本发明公开了一种制造用于印刷电路板的覆铜层压板（CCL），通过该方法制造的CCL以及具有CCL的印刷电路板的方法，该方法包括：将第一树脂涂覆的铜箔 （第一RCC箔）和第二树脂涂覆铜箔（第二RCC箔），通过在两个铜箔的每一个的一个表面上涂覆绝缘组合物以分别形成绝缘层，然后干燥第一和第二RCC箔; 通过层压和压制第一RCC箔和第二RCC箔，同时第一和第二RCC箔的绝缘层彼此面对并且在其间放置玻璃纤维来形成覆铜层压板（CCL）; 并硬化覆铜层压板。

公开(公告)号：US20140124249A1

公开(公告)日：2014-05-08

申请号：US13790724

申请日：2013-03-08

Applicant: NVIDIA CORPORATION

Inventor： Bing Ai ,  Biao Hu

IPC: H05K1/03 ,  H05K3/06

CPC classification number: H05K3/06 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/029 ,  Y10T442/3415

Abstract: The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout.

Abstract translation: 本发明提供一种印刷电路板（PCB）板，用于制造PCB板的芯和用于制造PCB板的方法。 所述PCB板为矩形形状，包括由交错编织的纤维束形成的纤维层，固定在所述纤维层的表面上的金属层和形成在所述金属层上的一对差动信号迹线， 纤维镜相对于矩形的长度方向呈锐角，并且一对差动信号迹线沿矩形的宽度方向或长度方向延伸。 PCB板可以通过在不调整或重新设计原始电路布局的情况下调节光纤和芯的边缘之间的角度来有效降低差分信号发送过程中的偏斜失真的可能性。