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公开(公告)号：US09484549B2
公开(公告)日：2016-11-01
申请号：US14447436
申请日：2014-07-30
发明人： Hae-Goo Jung , Do-Hyung Ryu , Jae-Woo Song , Jae-Hoon Lee
CPC分类号： H01L51/5243 , H01L27/3246 , H01L27/3276 , H01L51/525
摘要： A display device includes a first substrate including a display area and a non-display area, the display area including a pixel including a first electrode, a light emission layer, and a second electrode; a sealing member facing the first substrate; and a first conducting member in the display area, the first conducting member being coupled to the first electrode, where the sealing member includes: a first conductive layer coupled to the first conducting member; an insulating layer on the first conductive layer; and a second conductive layer on the insulating layer, the second conductive layer being coupled to the second electrode.
摘要翻译： 显示装置包括包括显示区域和非显示区域的第一基板，所述显示区域包括包括第一电极，发光层和第二电极的像素; 面对所述第一基板的密封构件; 以及在所述显示区域中的第一导电构件，所述第一导电构件联接到所述第一电极，其中所述密封构件包括：耦合到所述第一导电构件的第一导电层; 第一导电层上的绝缘层; 以及在所述绝缘层上的第二导电层，所述第二导电层耦合到所述第二电极。
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公开(公告)号：US09484503B2
公开(公告)日：2016-11-01
申请号：US15098975
申请日：2016-04-14
申请人： NICHIA CORPORATION
发明人： Masaki Hayashi , Yuki Shiota
CPC分类号： H01L33/502 , H01L25/0753 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device includes a first lead, a second lead, an insulating member, a diffusing agent-containing portion, a wavelength conversion portion and a lens portion. The insulating member is configured to fix the first lead and the second lead. A thickness of the insulating member is equal to the thickness of the first and second leads. A groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region formed in the first lead. A second groove portion or recessed portion is formed in a first lead inner side of the groove portion or the recessed portion, which is filled with the diffusing agent-containing portion.
摘要翻译： 发光装置包括第一引线，第二引线，绝缘构件，扩散剂容纳部，波长转换部和透镜部。 绝缘构件被构造成固定第一引线和第二引线。 绝缘构件的厚度等于第一和第二引线的厚度。 提供凹槽或凹部以将波长转换部分保持在形成在第一引线中的特定区域中。 第二槽部或凹部形成在槽部或凹部的第一引线内侧，填充有扩散剂容纳部。
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公开(公告)号：US09468052B2
公开(公告)日：2016-10-11
申请号：US14847819
申请日：2015-09-08
申请人： Bridgelux, Inc.
IPC分类号： H01L29/18 , H01L33/00 , H05B33/08 , H01L25/16 , F21V23/02 , H05B37/02 , F21V23/00 , F21V29/70 , H01L25/075 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/62 , H05K1/14 , H05K3/00 , F21Y101/00
CPC分类号： H05B33/0815 , F21K9/20 , F21V23/006 , F21V23/02 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/181 , H05B33/0824 , H05B33/0827 , H05B33/083 , H05B33/0842 , H05B33/0845 , H05B33/0884 , H05B33/089 , H05B37/0272 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H01L2924/00014 , H01L2924/00012
摘要： An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.
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公开(公告)号：US09436036B2
公开(公告)日：2016-09-06
申请号：US14749962
申请日：2015-06-25
IPC分类号： H01L29/18 , H01L33/00 , G02F1/1335 , H01L27/12 , H01L27/15 , H01L33/62 , G02F1/1333
CPC分类号： H01L27/1266 , G02F1/133305 , G02F1/133603 , H01L21/6835 , H01L27/1214 , H01L27/153 , H01L33/0079 , H01L33/62 , H01L51/003 , H01L2221/68318 , H01L2221/68386
摘要： The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.
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公开(公告)号：US09406664B2
公开(公告)日：2016-08-02
申请号：US14097778
申请日：2013-12-05
发明人： Xi Chen , Jianfeng Yuan , Qiang Zheng , Seungmoo Rim
CPC分类号： H01L27/0251 , H01L27/0288 , H01L27/1214 , H01L27/124 , H01L27/1288
摘要： An array substrate, a method for fabricating the same and a display device are disclosed. The array substrate comprises a display region, at least two common electrode blocks are disposed at a periphery of the display region and conducted via a pixel electrode bridge line pattern.
摘要翻译： 公开了阵列基板，其制造方法和显示装置。 阵列基板包括显示区域，至少两个公共电极块设置在显示区域的周围并通过像素电极桥接线图案传导。
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公开(公告)号：US09373763B2
公开(公告)日：2016-06-21
申请号：US13985444
申请日：2012-02-08
申请人： Temmo Pitkänen
发明人： Temmo Pitkänen
IPC分类号： H01L29/18 , H01L33/56 , H01L25/075 , H01L33/58 , F21Y101/02 , F21Y103/00
CPC分类号： H01L33/56 , F21S4/22 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/45147 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： LED light source having at least one light-emitting component. The light-emitting component is at least partly protected with a transparent protective material, which contains aliphatic thermoplastic polyurethane (TPU). A light-source band also includes at least one light-emitting component.
摘要翻译： LED光源具有至少一个发光部件。 发光组分至少部分地被含有脂族热塑性聚氨酯（TPU）的透明保护材料保护。 光源带还包括至少一个发光部件。
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公开(公告)号：US09373608B2
公开(公告)日：2016-06-21
申请号：US14727592
申请日：2015-06-01
申请人： Nichia Corporation
发明人： Toshiyuki Yagi , Yohei Minoda , Kazunori Watanabe
IPC分类号： H01L29/18 , H01L25/16 , H01L25/04 , H01L25/075 , F21V5/04 , H01L29/866 , H01L33/36 , H01L33/62 , F21Y101/02
CPC分类号： H01L25/167 , F21V5/043 , F21Y2115/10 , H01L25/042 , H01L25/0753 , H01L25/165 , H01L29/866 , H01L33/36 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes a substrate; a first metal film formed on the substrate; a plurality of light emitting elements arranged in a line, each comprising a second metal film on a lower face thereof, each having a quadrilateral outline; and a die bond placed between the first metal film and the second metal films to fix the second metal film on the first metal film. The substrate includes low wettability areas having wettability to the die bond lower than the first metal film. Each of the low wettability areas is disposed between two of the light emitting elements, and each of four sides of the quadrilateral outline is adjacent to the low wettability area different from the low wettability areas adjacent to one of the other three sides.
摘要翻译： 发光装置包括：基板; 形成在所述基板上的第一金属膜; 多个排列成一行的发光元件，每个包括在其下表面上的第二金属膜，每个具有四边形轮廓; 以及放置在第一金属膜和第二金属膜之间的管芯接合，以将第二金属膜固定在第一金属膜上。 该基板包括对芯片接合的润湿性低于第一金属膜的低润湿性区域。 低湿润性区域中的每一个设置在两个发光元件之间，并且四边形轮廓的四个边中的每一个与不同于其它三个侧面之一的低润湿性区域的低润湿性区域相邻。
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公开(公告)号：US09368690B2
公开(公告)日：2016-06-14
申请号：US14163992
申请日：2014-01-24
发明人： Kosaburo Ito
CPC分类号： H01L33/60 , B60Q1/0088 , F21Y2103/10 , F21Y2105/10 , F21Y2105/12 , H01L25/0753 , H01L27/156 , H01L33/0075 , H01L33/44 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2224/16225 , H01L2933/0041 , H01L2933/0058
摘要： A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The semiconductor light-emitting device can include a substrate, a frame located on the substrate, the chip mounted on the substrate, a transparent material layer located on the wavelength converting layer so as to reduce from the wavelength converting layer toward a light-emitting surface thereof, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the transparent material layer. The semiconductor light-emitting device can be configured to improve light-emitting efficiency and a color variation by using the surrounding portion and an inclined side surface of transparent material layer, and therefore can emit various colored lights including white light having a high light-emitting efficiency from a small light-emitting surface.
摘要翻译： 半导体发光器件可以包括包括周围部分的波长转换层，其覆盖至少一个半导体发光芯片，以便发射包括白光的各种彩色光。 半导体发光装置可以包括基板，位于基板上的框架，安装在基板上的芯片，位于波长转换层上的透明材料层，以便从波长转换层朝向发光表面 以及至少设置在所述波长转换层和所述透明材料层的框架与两侧面之间的反射材料层。 半导体发光器件可以通过使用透明材料层的周围部分和倾斜侧表面来提高发光效率和颜色变化，因此可以发射包括具有高发光度的白光的各种彩色光 效率来自小型发光面。
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公开(公告)号：US09343643B2
公开(公告)日：2016-05-17
申请号：US14247891
申请日：2014-04-08
申请人： NICHIA CORPORATION
发明人： Masaki Hayashi , Yuki Shiota
CPC分类号： H01L33/502 , H01L25/0753 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device has: a first lead which is mounted a light emitting element, a second lead separated by an interval from the first lead, an insulating member configured to fix the first lead and the second lead, a wavelength conversion portion configured to cover the light emitting element, and a lens portion configured to cover the wavelength conversion portion, a thickness of the insulating member is equal to the thickness of the first lead and the second lead, a groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region is formed in the first lead, and a lower surface of the first lead that forms an opposite side of a region formed on the wavelength conversion portion is not covered by the insulating member and is exposed to the outside.
摘要翻译： 一种发光器件具有：安装有发光元件的第一引线，与第一引线隔开间隔的第二引线，被配置为固定第一引线和第二引线的绝缘构件，被配置为覆盖 发光元件和被配置为覆盖波长转换部分的透镜部分，绝缘构件的厚度等于第一引线和第二引线的厚度，设置槽或凹部以保持波长转换 特定区域中的部分形成在第一引线中，并且形成在波长转换部分上形成的区域的相对侧的第一引线的下表面不被绝缘构件覆盖并暴露于外部。
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50.发明授权公开(公告)号：US09306142B2
公开(公告)日：2016-04-05
申请号：US14129731
申请日：2011-11-23
申请人： Ki Myung Nam , Tae Hwan Song , Young Chul Jun
发明人： Ki Myung Nam , Tae Hwan Song , Young Chul Jun
IPC分类号： B29C65/00 , B32B3/00 , B32B5/00 , B32B5/18 , B32B37/00 , H05K3/46 , B32B38/04 , C09J5/02 , B32B27/00 , B32B7/00 , B32B9/00 , B32B15/04 , B32B15/08 , B32B27/38 , H01L29/18 , H01L33/00 , H01L33/64 , H01L23/00 , H01L33/48 , H01L25/00 , B32B15/092 , B32B15/20 , B32B27/04 , B29C65/48 , H01L33/62
CPC分类号： H01L33/641 , B29C65/4835 , B32B15/092 , B32B15/20 , B32B27/04 , B32B2255/06 , B32B2255/26 , B32B2260/046 , H01L24/97 , H01L25/50 , H01L33/005 , H01L33/483 , H01L33/486 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/73265 , H01L2924/12041 , H01L2933/0066 , H01L2933/0075 , Y10T428/24612 , Y10T428/31522 , Y10T428/31678
摘要： The manufacturing of an optical device substrate is achieved by anodizing the surface of a metal plate, coating an insulative liquid bonding agent, having a viscosity which can permeate into an anodized film of the metal plate, on the metal plate, and alternately layering, pressing, and heat treating the metal plate coated with the liquid bonding agent and an insulative film bonding agent before the liquid bonding agent becomes solid so that bonding force between the metal plate and an insulation layer is strengthened, bubbles formation in the liquid bonding agent is inhibited, the fragile nature of the liquid bonding agent after the solidification is reduced producing an optical device substrate with improved mechanical strength and an insulation layer of precisely controlled thickness.
摘要翻译： 光学器件衬底的制造通过对金属板的表面进行阳极氧化，在金属板上涂覆具有可渗透到金属板的阳极氧化膜中的粘度的绝缘液体粘合剂，并且交替地层压，压制 在液体粘合剂变为固体之前对涂有液体粘合剂的金属板和绝缘膜粘合剂进行热处理，使得金属板和绝缘层之间的结合力增强，液体粘合剂中的气泡形成被抑制 固化后液体粘合剂的脆弱性降低，从而产生具有改善的机械强度的光学器件衬底和精确控制厚度的绝缘层。
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