公开(公告)号：US20080003023A1

公开(公告)日：2008-01-03

申请号：US11820584

申请日：2007-06-19

申请人： Kenichi Kawabata

发明人： Kenichi Kawabata

IPC分类号： G03G13/00 ,  F16C13/00

CPC分类号： G03G15/0131 ,  B41J11/007 ,  B65H5/004 ,  B65H5/224 ,  B65H2402/10 ,  B65H2404/255 ,  B65H2404/2693 ,  G03G21/1695 ,  G03G2221/1642

摘要： An image forming apparatus includes an image forming member and a belt conveying device. The image forming member is configured to form an image on a sheet. The belt conveying device is configured to convey the sheet. The belt conveying device includes first and second rollers, a conveying belt, a platen guide, a support, and an adjuster. The conveying belt has an endless belt-like shape and is looped over at least the first and second rollers. The platen guide is provided between the first and second rollers in a sheet conveyance direction and is configured to guide the conveying belt in a manner that the conveying belt forms a flat plane surface. The support is configured to support at least one end of the second roller in an axial direction of the second roller. The adjuster is configured to adjust a position of the support.

摘要翻译： 图像形成装置包括图像形成部件和带传送装置。 图像形成构件被配置为在片材上形成图像。 皮带输送装置构造成输送片材。 带式输送装置包括第一和第二辊，输送带，压板引导件，支撑件和调节器。 传送带具有环形带状形状，并且至少环绕第一和第二辊。 压板引导件在纸张输送方向上设置在第一辊和第二辊之间，并且构造成以使得输送带形成平坦表面的方式引导输送带。 支撑构造成在第二辊的轴向方向上支撑第二辊的至少一端。 调节器被配置为调节支撑件的位置。

公开(公告)号：US20070119541A1

公开(公告)日：2007-05-31

申请号：US11603884

申请日：2006-11-22

申请人： Kenichi Kawabata ,  Takaaki Morita

发明人： Kenichi Kawabata ,  Takaaki Morita

IPC分类号： B32B3/00

CPC分类号： H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

摘要翻译： 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140。 芯层101和102的厚度为100μm或更小，由此整个板可以显着地变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：US20070035083A1

公开(公告)日：2007-02-15

申请号：US11503346

申请日：2006-08-10

申请人： Kenichi Kawabata

发明人： Kenichi Kawabata

IPC分类号： B65H7/02

CPC分类号： B41J11/007 ,  B41J11/0005

摘要： An image forming apparatus includes a sheet feeding device that feeds a sheet, and a conveyance belt that conveys the sheet toward a printing region while attracting the sheet with electrostatic force. The printing region is disposed in a vicinity of the conveyance belt. A printing device is provided in the printing region to form an image on the sheet. A controller is provided to control the conveyance belt to stop conveying the sheet toward the printing region for a prescribed period after the tip of the sheet arrives at the conveyance belt and raised from the conveyance belt unit the tip of the sheet settles to the surface of the conveyance belt.

摘要翻译： 图像形成装置包括供纸片材和在静电力吸引片材的同时将片材朝向打印区域传送的传送带。 打印区域设置在传送带附近。 打印装置设置在打印区域中以在纸张上形成图像。 一种控制器，用于控制传送带在片材的尖端到达传送带之后停止将片材朝向打印区域传送到打印区域，并且从传送带单元升起，片材的尖端沉淀到 输送带。

公开(公告)号：US20060237131A1

公开(公告)日：2006-10-26

申请号：US11407057

申请日：2006-04-20

申请人： Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

发明人： Masashi Gotoh ,  Hajime Kuwajima ,  Kenichi Kawabata

IPC分类号： B32B37/00

CPC分类号： H05K3/4611 ,  B32B37/0007 ,  B32B37/0046 ,  B32B2457/08 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/068

摘要： In a press process, a buffer member is placed on an RCC with a stainless steel plate between in such a way that the long sides and the short sides of the buffer member are aligned with the long sides and the short sides of the RCC respectively. The length of the long sides and the length of the short sides of the buffer member are designed to be smaller than the lengths of the long sides and the length of the short sides of the RCC respectively. With this feature, it is possible to reduce convexity on the RCC that is created in the peripheral region upon pressing the RCC to a core member.

公开(公告)号：US20060132574A1

公开(公告)日：2006-06-22

申请号：US11303794

申请日：2005-12-15

申请人： Kenichi Kawabata

发明人： Kenichi Kawabata

IPC分类号： B41J2/01

CPC分类号： B41J11/007

摘要： An electrostatic attraction device is disclosed that attracts and transports a recording medium by applying an electric field to a surface of an endless belt member with use of a charger while rotating the belt member. The electrostatic attraction device comprises a separation claw holding unit separately provided from the charger.

公开(公告)号：US20050003199A1

公开(公告)日：2005-01-06

申请号：US10745587

申请日：2003-12-29

申请人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

发明人： Minoru Takaya ,  Toshikazu Endo ,  Kenichi Kawabata

IPC分类号： B32B15/08 ,  C08G59/42 ,  C08J5/24 ,  C08L63/00 ,  C08L67/03 ,  H01F17/00 ,  H01F27/32 ,  H01L23/498 ,  H01L25/16 ,  H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K3/46 ,  B32B27/38 ,  B32B27/04

CPC分类号： B32B15/08 ,  B32B9/005 ,  B32B27/08 ,  B32B2305/076 ,  B32B2305/08 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  C08G59/4223 ,  C08J5/10 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L67/03 ,  H01F17/0006 ,  H01F27/323 ,  H01F27/327 ,  H01F2017/048 ,  H01L23/49894 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/4626 ,  H05K3/4676 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/09672 ,  Y10T428/2971 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/18 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention provides electronic parts which comprise a composite dielectric layer composed of an organic insulating material and a dielectric ceramic powder having a larger relative dielectric constant than the organic insulating material, and which also comprise conductive element sections forming inductor elements, etc., wherein the organic insulating material comprises a cured resin obtained by curing reaction of an epoxy resin with an active ester compound obtained by reaction between a compound with two or more carboxyl groups and a compound with a phenolic hydroxyl group. The dielectric ceramic powders of the described electronic parts have larger relative dielectric constants than the organic insulating materials, and the organic insulating materials have low dielectric loss tangents. It is possible to adequately reduce time-dependent dielectric constant changes in the high-frequency range of 100 MHz and above even with prolonged use at high temperatures of 100° C. and higher, while it is also possible to satisfactorily prevent deformation and other damage to the electronic parts during their handling.

摘要翻译： 本发明提供的电子部件包括由有机绝缘材料构成的复合电介质层和具有比有机绝缘材料更大的相对介电常数的介电陶瓷粉末，并且还包括形成电感元件的导电元件等，其中， 有机绝缘材料包括通过使环氧树脂与通过具有两个或更多个羧基的化合物和具有酚羟基的化合物之间的反应获得的活性酯化合物的反应固化而获得的固化树脂。 所述电子部件的介电陶瓷粉末具有比有机绝缘材料更大的相对介电常数，有机绝缘材料具有低的介电损耗角正切。 即使长时间在100℃以上的高温下使用也可以充分降低100MHz以上的高频范围的时间依赖介电常数的变化，同时也可以令人满意地防止变形等损伤 在处理电子零件时。

公开(公告)号：US09078594B2

公开(公告)日：2015-07-14

申请号：US13639109

申请日：2011-04-05

申请人： Kenichi Kawabata ,  Rei Asami

发明人： Kenichi Kawabata ,  Rei Asami

IPC分类号： A61B8/00 ,  A61B8/08 ,  A61N7/02 ,  A61B8/13 ,  A61B17/00 ,  A61B19/00 ,  A61N7/00

CPC分类号： A61B8/08 ,  A61B8/13 ,  A61B8/481 ,  A61B2017/00106 ,  A61B2090/378 ,  A61B2503/40 ,  A61N7/02 ,  A61N2007/0039 ,  A61N2007/0052 ,  A61N2007/0065 ,  A61N2007/027

摘要： Provided is an ultrasound diagnostic and treatment device for tumors which is used in combination with a phase-shift ultrasound contrast agent. By using a phase-shift ultrasound contrast agent, irradiating phase-shift ultrasonic waves from a phase-shift ultrasonic wave transmitter (18), irradiating ultrasonic waves for holding microbubbles from an ultrasonic wave transmitter (29) for holding microbubbles, and using a phase-shift detecting ultrasonic wave transceiver (19) to observe the phase shift, the ultrasound diagnostic and treatment device generates and holds the microbubbles in advance on the entire site (16) requiring treatment, and irradiates ultrasonic waves for treatment having a moderate intensity of 1 kW/cm2 or lower on the entire site (16) requiring treatment with the microbubbles as the target from a ultrasonic wave transmitter (20) for treatment.

摘要翻译： 提供了一种与移相超声对比剂组合使用的用于肿瘤的超声诊断和治疗装置。 通过使用移相超声造影剂，从相移超声波发射器（18）照射相移超声波，从用于保持微泡的超声波发射器（29）照射用于保持微泡的超声波，并使用相位 检测超声波收发器（19）观察相位偏移，超声诊断和治疗装置预先在需要治疗的整个部位（16）上产生并保持微泡，并照射超声波治疗中等强度1 需要以微泡作为靶的处理的整个部位（16）的超声波发射器（20）进行处理。

公开(公告)号：US08742589B2

公开(公告)日：2014-06-03

申请号：US12458636

申请日：2009-07-17

申请人： Kenichi Kawabata ,  Toshikazu Endo

发明人： Kenichi Kawabata ,  Toshikazu Endo

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/3107 ,  H01L23/3171 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/82047 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043

摘要： A semiconductor embedded module 1 of the present invention has a configuration in which a semiconductor device 20, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer 10 (second insulating layer). In the semiconductor device 20, a redistribution layer 22 is connected to land electrodes. A protective layer 24 (first insulating layer) is provided on the redistribution layer 22, and is provided with openings such that external connection pads P of the redistribution layer 22 are exposed. Also, the resin layer 10 is formed to cover the protective layer 24, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer 22. The grinding rate of the resin layer 10 is larger than that of the protective layer 24.

摘要翻译： 本发明的半导体嵌入式模块1具有将裸片状态的半导体IC（裸片）等电子部件的半导体装置20嵌入树脂层10（第二绝缘层）内的结构， 。 在半导体器件20中，再分布层22连接到接地电极。 在再分配层22上设置有保护层24（第一绝缘层），并且设置有使再分布层22的外部连接焊盘P露出的开口。 此外，形成树脂层10以覆盖保护层24，并且在再分布层22的各个外部连接焊盘P的位置处形成通孔V.树脂层10的研磨速度大于 保护层24。

公开(公告)号：US20120285013A1

公开(公告)日：2012-11-15

申请号：US13533176

申请日：2012-06-26

申请人： Yoshikazu Kanemaru ,  Takaaki Morita ,  Kenichi Kawabata

发明人： Yoshikazu Kanemaru ,  Takaaki Morita ,  Kenichi Kawabata

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/2009 ,  H05K2203/0169 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): α1

摘要翻译： 提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。 工作表包括在近似矩形基板的一个表面上的绝缘层，以及嵌入在绝缘层内部的电子部件和板状框架部件（部件），其中满足由下列公式表示的关系的板状框架部件 1）：将α1<α3和α2<α3（1）安装在基板上的电子部件的未安装部分上。 在该式中，α1，α2和α3分别表示电子部件，板状框架部件和基板，各个布线层或各绝缘层的线性热膨胀系数（ppm / K）。

公开(公告)号：US08303752B2

公开(公告)日：2012-11-06

申请号：US12461818

申请日：2009-08-25

申请人： Kenichi Kawabata ,  Hiroshige Ohkawa

发明人： Kenichi Kawabata ,  Hiroshige Ohkawa

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B37/12 ,  B32B2038/0084 ,  B32B2457/08 ,  H05K3/007 ,  H05K3/025 ,  H05K3/386 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T156/11 ,  Y10T156/1142

摘要： Provided is a method of manufacturing a wiring board, in which: a composite adhesive sheet 20 is attached to one of the surfaces of a support substrate 10, and a double-sided CCL 30 is attached to the other surface. Then, in an integrated state of the above components, a multilayer wiring structure including a conductive layer and a resin insulating layer is formed on a metal layer 33 of the double-sided CCL 30 by a known build-up method. A thermally foamable adhesive layer 22 of the composite adhesive sheet 20 is then heated, thereby thermally decomposing a thermal foaming agent to generate gas, and the support substrate 10 is separated from the remaining bonded body. Thereafter, a carrier foil layer 32b and a copper foil layer 32a of a carrier-foil coated copper foil 32 are mechanically peeled from each other at a boundary between both the layers, thereby obtaining a wiring board 1.

摘要翻译： 提供了一种制造布线板的方法，其中：复合粘合片20附着到支撑基板10的一个表面上，并且双面CCL 30附接到另一表面。 然后，在上述部件的集成状态下，通过已知的堆积方法在双面CCL 30的金属层33上形成包括导电层和树脂绝缘层的多层布线结构。 然后将复合粘合片20的热发泡性粘合剂层22加热，由此热分解热发泡剂以产生气体，并且将支撑基板10与剩余的粘合体分离。 此后，在两层之间的边界处机械地剥离载体箔层32b和载体箔涂覆铜箔32的铜箔层32a，从而获得布线板1。