公开(公告)号：US20240213950A1

公开(公告)日：2024-06-27

申请号：US18526616

申请日：2023-12-01

申请人： Skyworks Solutions, Inc.

发明人： Hironori Fukuhara ,  Rei Goto ,  Keiichi Maki

IPC分类号： H03H9/02 ,  H03H3/10 ,  H03H9/05 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64 ,  H03H9/72 ,  H10N30/072

CPC分类号： H03H9/02574 ,  H03H3/10 ,  H03H9/02031 ,  H03H9/02559 ,  H03H9/02834 ,  H03H9/0585 ,  H03H9/14502 ,  H03H9/25 ,  H03H9/6406 ,  H03H9/725 ,  H10N30/072

摘要： An acoustic wave device is disclosed. The acoustic wave device includes a support layer, a ceramic layer positioned over the support layer, a piezoelectric layer positioned over the ceramic layer, and an interdigital transducer electrode positioned over the piezoelectric layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The acoustic wave device can be a surface acoustic wave device configured to generate a surface acoustic wave.

公开(公告)号：US11876501B2

公开(公告)日：2024-01-16

申请号：US16800248

申请日：2020-02-25

申请人： Skyworks Solutions, Inc.

发明人： Hironori Fukuhara ,  Rei Goto ,  Keiichi Maki

IPC分类号： H03H9/02 ,  H03H9/25 ,  H03H9/145 ,  H03H9/72 ,  H03H9/64 ,  H03H9/05 ,  H03H3/10 ,  H10N30/072

CPC分类号： H03H9/02574 ,  H03H3/10 ,  H03H9/02031 ,  H03H9/02559 ,  H03H9/02834 ,  H03H9/0585 ,  H03H9/14502 ,  H03H9/25 ,  H03H9/6406 ,  H03H9/725 ,  H10N30/072

摘要： An acoustic wave device is disclosed. The acoustic wave device includes a support layer, a ceramic layer positioned over the support layer, a piezoelectric layer positioned over the ceramic layer, and an interdigital transducer electrode positioned over the piezoelectric layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The acoustic wave device can be a surface acoustic wave device configured to generate a surface acoustic wave.

公开(公告)号：US11770111B2

公开(公告)日：2023-09-26

申请号：US15922960

申请日：2018-03-16

申请人： Murata Manufacturing Co., Ltd.

发明人： Yutaka Kishimoto ,  Tetsuya Kimura ,  Masashi Omura

IPC分类号： H03H9/02 ,  H03H3/02 ,  H03H9/17 ,  H10N30/87 ,  H10N30/88 ,  H10N30/853 ,  H03H9/05 ,  H03H9/145 ,  H03H9/64

CPC分类号： H03H9/02897 ,  H03H3/02 ,  H03H9/02133 ,  H03H9/02228 ,  H03H9/02559 ,  H03H9/0585 ,  H03H9/14538 ,  H03H9/175 ,  H10N30/8536 ,  H10N30/8542 ,  H10N30/877 ,  H10N30/883 ,  H03H9/6406 ,  H03H2003/025

摘要： An elastic wave device includes a supporting substrate, an acoustic multilayer film on the supporting substrate, a piezoelectric substrate on the acoustic multilayer film, and an IDT electrode on the piezoelectric substrate. An absolute value of a thermal expansion coefficient of the piezoelectric substrate is larger than an absolute value of a thermal expansion coefficient of the supporting substrate. The acoustic multilayer film includes at least four acoustic impedance layers. The elastic wave device further includes a bonding layer provided at any position in a range of from inside the first acoustic impedance layer from the piezoelectric substrate side towards the supporting substrate side, to an interface between the third acoustic impedance layer and the fourth acoustic impedance layer.

公开(公告)号：US20170244386A1

公开(公告)日：2017-08-24

申请号：US15047250

申请日：2016-02-18

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

IPC分类号： H03H9/54 ,  H03H3/08 ,  H03H3/02 ,  H03H9/64

CPC分类号： H03H9/64 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02015 ,  H03H9/02543 ,  H03H9/0509 ,  H03H9/0585 ,  H03H9/54 ,  H03H9/564

摘要： A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.

公开(公告)号：US09130539B2

公开(公告)日：2015-09-08

申请号：US14589043

申请日：2015-01-05

申请人： Murata Manufacturing Co., Ltd.

发明人： Taku Kikuchi ,  Hisashi Yamazaki

IPC分类号： H03H9/70 ,  H03H9/72 ,  H03H9/64 ,  H03H9/05 ,  H03H9/02 ,  H03H9/54

CPC分类号： H03H9/64 ,  H03H9/02834 ,  H03H9/0576 ,  H03H9/0585 ,  H03H9/54 ,  H03H9/70 ,  H03H9/725

摘要： An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.

摘要翻译： 弹性波装置包括第一弹性波元件，第二弹性波元件和第一基板。 第一弹性波元件包括第一压电基片。 第二弹性波元件包括第二压电基片。 第二压电基板被堆叠在第一压电基板上。 第二压电基板的线膨胀系数大于第一压电基板的线膨胀系数。 第一衬底被结合到第二压电衬底。 第一基板的线膨胀系数低于第二压电基板的线膨胀系数。

公开(公告)号：US20150109071A1

公开(公告)日：2015-04-23

申请号：US14589043

申请日：2015-01-05

申请人： Murata Manufacturing Co., Ltd.

发明人： Taku KIKUCHI ,  Hisashi YAMAZAKI

IPC分类号： H03H9/54 ,  H03H9/70

CPC分类号： H03H9/64 ,  H03H9/02834 ,  H03H9/0576 ,  H03H9/0585 ,  H03H9/54 ,  H03H9/70 ,  H03H9/725

摘要： An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.

摘要翻译： 弹性波装置包括第一弹性波元件，第二弹性波元件和第一基板。 第一弹性波元件包括第一压电基片。 第二弹性波元件包括第二压电基片。 第二压电基板被堆叠在第一压电基板上。 第二压电基板的线膨胀系数大于第一压电基板的线膨胀系数。 第一衬底被结合到第二压电衬底。 第一基板的线膨胀系数低于第二压电基板的线膨胀系数。

公开(公告)号：US08288918B2

公开(公告)日：2012-10-16

申请号：US12641741

申请日：2009-12-18

申请人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

发明人： Kenji Suzuki ,  Yasunori Iwasaki ,  Takashi Yoshino

IPC分类号： H03H9/25

CPC分类号： H03H9/0585 ,  H01L41/313 ,  H01L41/337

摘要： A supporting substrate and a piezoelectric substrate are prepared. A surface of the supporting substrate is bonded to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween to form a laminated substrate. Subsequently, a peripheral surface of the laminated substrate is ground such that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other. Subsequently, the surface of the piezoelectric substrate is polished to reduce the thickness of the piezoelectric substrate and performing mirror polishing of the surface.

摘要翻译： 制备支撑基板和压电基板。 支撑基板的表面通过有机粘合剂层粘合到压电基板的背面而形成层压基板。 随后，将层叠基板的外周面进行研磨，使得压电基板的周面，有机粘合剂层的外周面和支撑基板的有机粘合层侧的周面与 彼此。 随后，对压电基片的表面进行抛光，以减小压电基片的厚度并进行表面的镜面抛光。

公开(公告)号：US20120105175A1

公开(公告)日：2012-05-03

申请号：US12917738

申请日：2010-11-02

申请人： Roger L. Clark ,  Seth A. Berman ,  Robert E. Kozlowski ,  Gary K. Montress

发明人： Roger L. Clark ,  Seth A. Berman ,  Robert E. Kozlowski ,  Gary K. Montress

IPC分类号： H03H9/64

CPC分类号： H03H9/02818 ,  G01P15/0975 ,  H01L2224/48091 ,  H03H9/02228 ,  H03H9/02897 ,  H03H9/0585 ,  H03H9/1092 ,  H03H2009/0019 ,  H01L2924/00014

摘要： A device, comprising a substrate having opposing first and second surfaces, a first surface acoustic wave resonator disposed on the first surface of the substrate, a second surface acoustic wave resonator disposed on the second surface of the substrate, a first adhesive layer sandwiched between the first surface acoustic wave resonator and the substrate, and a second adhesive layer sandwiched between the second surface acoustic wave resonator.

摘要翻译： 一种器件，包括具有相对的第一和第二表面的衬底，设置在衬底的第一表面上的第一表面声波谐振器，设置在衬底的第二表面上的第二表面声波谐振器，夹在衬底的第二表面之间的第一粘合剂层 第一表面声波谐振器和基板，以及夹在第二声表面波谐振器之间的第二粘合层。

公开(公告)号：US20070096312A1

公开(公告)日：2007-05-03

申请号：US11641345

申请日：2006-12-19

申请人： Giles Humpston ,  Belgacem Haba

发明人： Giles Humpston ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A capped chip is provided in which a cap member has a bottom surface facing a front surface of the chip and a top surface opposite the front surface. A plurality of through holes is desirably provided in the cap member which extend from the bottom surface to the top surface. A plurality of metallic interconnects electrically connected to the chip are provided which project upwardly from the front surface of the chip at least partially through the through holes. Desirably, the metallic interconnects include stud bumps.

摘要翻译： 提供了一种封盖芯片，其中盖构件具有面向芯片的前表面的底表面和与前表面相对的顶表面。 期望地在盖构件中设置有多个通孔，其从底表面延伸到顶表面。 提供电连接到芯片的多个金属互连件，其至少部分地穿过通孔从芯片的前表面向上突出。 理想地，金属互连件包括螺柱凸块。

公开(公告)号：US20070096311A1

公开(公告)日：2007-05-03

申请号：US11641152

申请日：2006-12-19

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。