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    Electronic part of surface mounted type and its mounting method
    53.
    发明授权
    Electronic part of surface mounted type and its mounting method 失效
    表面安装型电子部件及其安装方法

    公开(公告)号：US5382754A

    公开(公告)日：1995-01-17

    申请号：US34371

    申请日：1993-03-18

    Applicant: Shigemasa Sunada

    Inventor： Shigemasa Sunada

    IPC: B23K26/00 ,  H05K3/30 ,  H05K13/04 ,  H05K5/06

    CPC classification number: H05K3/305 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2203/107 ,  Y02P70/613

    Abstract: A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.

    Abstract translation: 树脂的底面的中央区域，其中通过照射激光束对与芯片电连接的两个引线端子中的每一个的二极管芯片和基端部进行燃烧处理，以便除去存在于该芯片中的脂肪和油 底面。 因此，防止了将树脂的底面固定到电路板上的粘合剂的粘合强度的劣化。

    Electrical appliance powered by an incorporated rechargeable battery
    54.
    发明授权
    Electrical appliance powered by an incorporated rechargeable battery 失效
    由装有可充电电池供电的电器

    公开(公告)号：US5380602A

    公开(公告)日：1995-01-10

    申请号：US942266

    申请日：1992-09-09

    Applicant: Hirokazu Kato ,  Makoto Tanimizu ,  Masakazu Kita

    Inventor： Hirokazu Kato ,  Makoto Tanimizu ,  Masakazu Kita

    IPC: H01M2/10 ,  H01M2/20 ,  H01M2/22 ,  H01M2/30 ,  H05K1/00 ,  H05K1/18 ,  H05K3/30 ,  H01M2/26

    CPC classification number: H05K1/18 ,  H01M2/1055 ,  H01M2/20 ,  H01M2/22 ,  H05K1/0286 ,  H05K2201/10651 ,  H05K2203/176 ,  H05K2203/178 ,  H05K3/308 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A rechargeable battery is utilized in many kinds of electrical appliances. However, as the battery contains harmful substances such as cadmium, it is not desired to discard the electrical appliances with the rechargeable battery from a standpoint of prevention of environmental pollution. An electrical appliance powered by an incorporated rechargeable battery of the present invention is capable of effectively engaging a tool for separating the battery from the appliance. That is to say, at least one of negative and positive electrodes of the rechargeable battery is connected to a terminal strip by spot welding. An electrical power of the battery is supplied to a circuit for operating the appliance through the terminal strip. The terminal strip also has an opening which is formed so as to engage a tool for separating the battery from the terminal strip. Therefore, when the appliance is discarded, the battery can be easily and safety separated form the electrical appliance by applying an external force to the tool engaged into the opening.

    Abstract translation: 可充电电池用于许多种类的电器。 然而，由于电池含有诸如镉等有害物质，因此从防止环境污染的观点出发，不希望放弃具有可再充电电池的电器。 由本发明的并入的可再充电电池供电的电器能够有效地接合用于将电池与器具分离的工具。 也就是说，可再充电电池的负极和正极中的至少一个通过点焊连接到端子条。 电池的电力被提供给用于通过端子排操作器具的电路。 端子排也具有形成为与用于将电池与端子排分离的工具接合的开口。 因此，当器具被丢弃时，通过向接合到开口中的工具施加外力，电池可以容易且安全地从电器部件分离。

    Electronic components with leads partly solder coated
    55.
    发明授权
    Electronic components with leads partly solder coated 失效
    带导线的电子元件部分焊接涂层

    公开(公告)号：US5274911A

    公开(公告)日：1994-01-04

    申请号：US780111

    申请日：1991-10-21

    Applicant: Joseph A. Toro

    Inventor： Joseph A. Toro

    IPC: H01L21/48 ,  H01L23/495 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H01R43/00

    CPC classification number: H01L21/4821 ,  H01L23/49582 ,  H01R4/028 ,  H01R43/0235 ,  H05K3/3447 ,  B23K2201/36 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/1147 ,  H05K2203/304 ,  Y10T29/49121 ,  Y10T29/49222 ,  Y10T29/49224

    Abstract: An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material. Leads having a center region devoid of solder plating may be formed by providing a lead frame, with selectively plated and punched regions of the lead frame to form the internal and external lead portions, plating the internal and external lead portions with solder and thereafter punching the center unplatted region to provide a plurality of leads having a center unplatted region. Components are thereafter electrically coupled to the solder plated internal portions of the leads on the lead frame with the leads and attached electrical components encased in an encasement material so that the encasement material is in direct contact with the unplatted center region of the leads.

    Abstract translation: 电气设备包括封装在封装材料中的电气部件，引线电耦合到部件并延伸穿过封装材料以附接到电路。 引线包括镀有用于附接到部件的焊料的内部区域，镀有用于将部件电耦合到电路板的焊料的外部区域，以及在内部和外部区域之间的中间区域，其中没有焊料并且被定位 与包装材料接触以限定铅和包装材料之间的未镀层界面。 具有不具有焊料镀层的中心区域的引线可以通过提供引线框架，引线框架的选择性镀覆和冲压区域形成内部和外部引线部分，用焊料电镀内部和外部引线部分，然后冲压 中心未平坦区域以提供具有中心未平坦区域的多个引线。 然后，元件电连接到引线框架上的引线的焊接镀层内部，引线和附接的电气部件封装在封装材料中，使得封装材料与引线的未平坦的中心区域直接接触。

    Stacked configuration for integrated circuit devices
    56.
    发明授权
    Stacked configuration for integrated circuit devices 失效
    集成电路设备的堆叠配置

    公开(公告)号：US5117282A

    公开(公告)日：1992-05-26

    申请号：US604883

    申请日：1990-10-29

    Applicant: Matthew M. Salatino

    Inventor： Matthew M. Salatino

    IPC: H01L23/40 ,  H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K7/02 ,  H05K7/20

    CPC classification number: H05K7/20509 ,  H05K1/189 ,  H05K7/023 ,  H01L2924/1627 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3421

    Abstract: A stacked packaging assembly for a plurality of integrated circuit devices employs a web of flexible interconnect material folded into a `layered` arrangement of parallel web fingers onto which a plurality of integrated circuit devices are surface-mounted. The leads of the integrated circuit devices are attached to interconnect links of the flexible interconnect web. A plurality of heat sink plates are interleaved with the folded web fingers of the stack, so as to engage the integrated circuit devices mounted on the web fingers. The heat sink plates are retained by thermally conductive spacer blocks along their edges. The spacer blocks are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers.

    Abstract translation: 用于多个集成电路器件的堆叠式封装组件使用折叠成平行网状指状物的“分层”布置的柔性互连材料的腹板，多个集成电路器件被表面安装在该布置上。 集成电路器件的引线连接到柔性互连网的互连链路。 多个散热板与堆叠的折叠腹板指状物交错，以便与安装在腹板指状物上的集成电路装置接合。 散热板沿着其边缘由导热间隔块保持。 间隔块以紧凑的层叠结构夹紧在一起，以便形成刚性支撑件，其减轻了卷筒纸指状物折叠处的机械应力。

    Surface mounted component UHF oscillator
    60.
    发明授权
    Surface mounted component UHF oscillator 失效
    表面安装元件UHF振荡器

    公开(公告)号：US4677396A

    公开(公告)日：1987-06-30

    申请号：US806252

    申请日：1985-12-06

    Applicant: Michael S. Cruz ,  Harmon P. Vaughter

    Inventor： Michael S. Cruz ,  Harmon P. Vaughter

    IPC: H03B1/00 ,  H03B1/04 ,  H03B5/18 ,  H05K1/02 ,  H05K1/18 ,  H03B5/12 ,  H05K13/04

    CPC classification number: H05K1/0237 ,  H03B5/1847 ,  H03B2200/004 ,  H03B2201/0208 ,  H03B2202/084 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/1572 ,  Y02P70/611 ,  Y10T29/53174

    Abstract: A UHF oscillator circuit includes a plurality of first leadless, or "chip", surface mounted components machine positioned on a first side of a printed circuit (PC) board and a plurality of second lead-bearing components mounted on a second side of the PC board and coupled in circuit through the PC board to the chip components in an arrangement which substantially reduces circuit fabrication costs. Comprised of a majority of automatically positioned surface mounted chip components and making use of a minimum number of lead mounted discrete components, the low Q values of the surface mounted components are compensated for by an external surface mounted feedback capacitor coupled across the collector-emitter junction of a common base transistor to provide oscillator tuning over a frequency range greater than an octave.

    Abstract translation: UHF振荡器电路包括位于印刷电路板（PC）板的第一侧上的多个第一无引线或“芯片”的表面安装元件机器，以及安装在PC的第二侧上的多个第二引线轴承部件 通过PC板将电路耦合到芯片组件中，从而大大降低了电路制造成本。 由大多数自动定位的表面贴装芯片部件组成，并利用最少数量的引线安装分立元件，表面安装元件的低Q值由耦合在集电极 - 发射极结上的外部表面安装反馈电容器补偿 的公共基极晶体管，以在大于八度的频率范围上提供振荡器调谐。

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