SIGNALING SYSTEM WITH ADAPTIVE TIMING CALIBRATION
    642.
    发明申请
    SIGNALING SYSTEM WITH ADAPTIVE TIMING CALIBRATION 审中-公开
    具有自适应时序校准的信号系统

    公开(公告)号:US20170054549A1

    公开(公告)日:2017-02-23

    申请号:US15250685

    申请日:2016-08-29

    Applicant: Rambus Inc.

    Abstract: A signaling system is disclosed. The signaling system includes a first integrated circuit (IC) chip to receive a data signal and a strobe signal. The first IC includes circuitry to sample the data signal at times indicated by the strobe signal to generate phase error information and circuitry to output the phase error information from the first IC device. The system further includes a signaling link and a second IC chip coupled to the first IC chip via the signaling link to output the data signal and the strobe signal to the first IC chip. The second IC chip includes delay circuitry to generate the strobe signal by delaying an aperiodic timing signal for a first time interval and timing control circuitry to receive the phase error information from the first IC chip and adjust the first time interval in accordance with the phase error information.

    Abstract translation: 公开了一种信令系统。 信令系统包括用于接收数据信号和选通信号的第一集成电路(IC)芯片。 第一IC包括在由选通信号指示的时间采样数据信号以产生相位误差信息的电路,以及从第一IC器件输出相位误差信息的电路。 该系统还包括信令链路和经由信令链路耦合到第一IC芯片的第二IC芯片,以将数据信号和选通信号输出到第一IC芯片。 第二IC芯片包括延迟电路,用于通过延迟第一时间间隔的非周期性定时信号和定时控制电路来产生选通信号,以从第一IC芯片接收相位误差信息,并根据相位误差调整第一时间间隔 信息。

    Memory module with integrated error correction
    644.
    发明授权
    Memory module with integrated error correction 有权
    具有集成纠错的内存模块

    公开(公告)号:US09450614B2

    公开(公告)日:2016-09-20

    申请号:US14475619

    申请日:2014-09-03

    Applicant: Rambus Inc.

    CPC classification number: G06F11/1048 H03M13/1525 H03M13/19 H03M13/617

    Abstract: A memory system includes a memory module that supports error detection and correction (EDC) in a manner that relieves a memory controller or processor of some or all of the computational burden associated with EDC. Individual EDC components perform EDC functions on subsets of the data, and share data between themselves using relatively short, fast interconnections.

    Abstract translation: 存储器系统包括以能够缓解存储器控制器或处理器与EDC相关联的一些或全部计算负担的方式支持错误检测和校正(EDC)的存储器模块。 单独的EDC组件在数据子集上执行EDC功能,并使用相对较短,快速的互连在其间共享数据。

    Stacked memory having same timing domain read data and redundancy
    646.
    发明授权
    Stacked memory having same timing domain read data and redundancy 有权
    具有相同定时域的堆叠存储器读取数据和冗余

    公开(公告)号:US09431063B2

    公开(公告)日:2016-08-30

    申请号:US14827831

    申请日:2015-08-17

    Applicant: Rambus Inc.

    Abstract: A stacked memory is disclosed including a first integrated circuit memory chip having first storage locations and a second integrated circuit memory chip disposed in a stacked relationship with the first integrated circuit memory chip. The second integrated circuit memory chip has second storage locations. Redundant storage is provided including a first storage area dedicated to storing failure address information of failure address locations in the first or second integrated circuit memory chips. The redundant storage includes a second storage area dedicated to storing data corresponding to the failure address locations. Matching logic matches incoming data transfer addresses to the stored failure address information.

    Abstract translation: 公开了一种堆叠存储器,其包括具有第一存储位置的第一集成电路存储器芯片和与第一集成电路存储器芯片堆叠关系地设置的第二集成电路存储器芯片。 第二集成电路存储器芯片具有第二存储位置。 提供了冗余存储器,其包括专用于存储第一或第二集成电路存储器芯片中的故障地址位置的故障地址信息的第一存储区域。 冗余存储器包括专用于存储对应于故障地址位置的数据的第二存储区域。 匹配逻辑将输入的数据传输地址与存储的故障地址信息进行匹配。

    Methods and Apparatus for Testing Inaccessible Interface Circuits in a Semiconductor Device
    648.
    发明申请
    Methods and Apparatus for Testing Inaccessible Interface Circuits in a Semiconductor Device 审中-公开
    用于测试半导体器件中不可接受的接口电路的方法和装置

    公开(公告)号:US20160161552A1

    公开(公告)日:2016-06-09

    申请号:US14950138

    申请日:2015-11-24

    Applicant: Rambus Inc.

    Abstract: A semiconductor IC device comprises a timing circuit to transfer a timing signal, the timing circuit being configured to receive a first test signal and to effect a delay in the timing signal in response to the first test signal, the first test signal including a first timing event. The semiconductor IC device further comprises an interface circuit configured to transfer the data signal in response to the timing signal, the interface circuit being further configured to receive a second test signal and to effect a delay in the data signal in response to the second test signal, the second test signal including a second timing event that is related to the first timing event according to a test criterion.

    Abstract translation: 半导体IC器件包括用于传送定时信号的定时电路,所述定时电路被配置为接收第一测试信号并且响应于所述第一测试信号而在定时信号中产生延迟,所述第一测试信号包括第一定时 事件。 所述半导体IC器件还包括接口电路,其被配置为响应于所述定时信号传送所述数据信号,所述接口电路还被配置为接收第二测试信号并响应于所述第二测试信号而实现所述数据信号的延迟 所述第二测试信号包括根据测试标准与所述第一定时事件相关的第二定时事件。

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