公开(公告)号：US10456886B2

公开(公告)日：2019-10-29

申请号：US15394044

申请日：2016-12-29

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Nag B. Patibandla ,  Rajeev Bajaj ,  Daniel Redfield ,  Fred C. Redeker ,  Mahendra C. Orilall ,  Boyi Fu ,  Mayu Yamamura ,  Ashwin Chockalingam

IPC: B24D3/20 ,  B24D3/28 ,  B24D11/02 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y10/00 ,  B33Y80/00

Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

公开(公告)号：US10391605B2

公开(公告)日：2019-08-27

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

IPC: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20180304539A1

公开(公告)日：2018-10-25

申请号：US15809969

申请日：2017-11-10

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan

IPC: B29C64/393 ,  B29C64/227 ,  B29C64/209 ,  B29C64/245 ,  B29C64/277 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/393 ,  B29C64/209 ,  B29C64/227 ,  B29C64/245 ,  B29C64/277 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing apparatus includes a platform, a support, an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform, one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad, a plurality of individually addressable energy sources supported above the platform, and a controller. The energy sources are arranged in an array that extends at least along a second axis perpendicular to the first axis and are configured to emit radiation toward the platform. The controller is configured to cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform.

公开(公告)号：US20180079147A1

公开(公告)日：2018-03-22

申请号：US15494332

申请日：2017-04-21

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B24D18/00

CPC classification number: G01B11/0608 ,  B24B37/20 ,  B24B37/245 ,  B24B37/26 ,  B24D18/009 ,  B29C64/112 ,  B29C64/129 ,  B29C64/277 ,  B29C64/386 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  G01N2015/1075 ,  G01N2015/1493

Abstract: A method of additive manufacturing includes dispensing successive layers of feed material to form a polishing pad, and directing first and second radiation beams toward the layers of feed material to form a polishing pad. Dispensing each successive layer of the layers of feed material includes dispensing a drop of feed material, and directing the first and second radiation beams toward the layers of feed material includes, for each successive layer, directing the first radiation beam toward the drop of feed material to cure an exterior surface of the drop of feed material, and directing the second radiation beam toward the drop of feed material to cure an interior volume of the drop of feed material.

公开(公告)号：US20180006083A1

公开(公告)日：2018-01-04

申请号：US15270763

申请日：2016-09-20

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L27/15 ,  H01L21/66 ,  H01L23/00 ,  H01L33/48

CPC classification number: H01L27/156 ,  H01L21/6835 ,  H01L22/22 ,  H01L24/741 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L33/48 ,  H01L2221/68368 ,  H01L2224/7598 ,  H01L2224/95136

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

公开(公告)号：US12195635B1

公开(公告)日：2025-01-14

申请号：US18417560

申请日：2024-01-19

Applicant: Applied Materials, Inc.

Inventor： Kulandaivelu Sivanandan ,  Sivapackia Ganapathiappan ,  Nag Bhushanam Patibandla

IPC: C09D11/00 ,  C09D11/101 ,  C09D11/322 ,  C09D11/52 ,  H10K50/115

Abstract: Liquid dispersions of quantum dot particles include an acrylic medium having a boiling point in a range of from greater than or equal to 100° C. to less than or equal to 500° C., quantum dot particles dispersed in the acrylic medium, a photo-initiator, and a surface additive. The liquid dispersions of quantum dot particles are useful as stable liquid formulations that resist gelling for spin-coating and ink-jet printing of color conversion layers in the manufacture of LED and micro-LED panels for advanced displays. Methods of manufacturing light-emitting devices using the liquid dispersions of quantum dot particles are also disclosed.

公开(公告)号：US11980992B2

公开(公告)日：2024-05-14

申请号：US17946547

申请日：2022-09-16

Applicant: Applied Materials, Inc.

Inventor： Ashavani Kumar ,  Ashwin Chockalingam ,  Sivapackia Ganapathiappan ,  Rajeev Bajaj ,  Boyi Fu ,  Daniel Redfield ,  Nag B. Patibandla ,  Mario Dagio Cornejo ,  Amritanshu Sinha ,  Yan Zhao ,  Ranga Rao Arnepalli ,  Fred C. Redeker

IPC: B24B37/24 ,  B24B37/16 ,  B24B37/20 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  H01L21/306

CPC classification number: B24B37/245 ,  B24B37/26 ,  B24D11/04 ,  B24D18/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y80/00 ,  B24B37/16 ,  B24B37/20 ,  B24D2203/00 ,  B33Y30/00 ,  H01L21/30625

Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

公开(公告)号：US11855241B2

公开(公告)日：2023-12-26

申请号：US17870769

申请日：2022-07-21

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Lisong Xu ,  Sivapackia Ganapathiappan ,  Hou T. Ng ,  Byung Sung Kwak ,  Mingwei Zhu ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/06 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/005 ,  H01L33/06

Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US20230352632A1

公开(公告)日：2023-11-02

申请号：US18349032

申请日：2023-07-07

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/44 ,  H01L33/50 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  H01L21/70 ,  H01L21/02 ,  H01L21/027 ,  H01L27/15

CPC classification number: H01L33/44 ,  H01L33/505 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/0093 ,  H01L21/707 ,  H01L21/70 ,  H01L21/02104 ,  H01L21/027 ,  H01L33/00 ,  H01L27/153 ,  H01L2933/0066 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.