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    HOUSING ARRANGEMENT, METHOD OF PRODUCING A HOUSING AND METHOD OF PRODUCING AN ELECTRONIC ASSEMBLY
    65.
    发明申请
    HOUSING ARRANGEMENT, METHOD OF PRODUCING A HOUSING AND METHOD OF PRODUCING AN ELECTRONIC ASSEMBLY 有权
    住房安排，生产房屋的方法和生产电子装配的方法

    公开(公告)号：US20150228562A1

    公开(公告)日：2015-08-13

    申请号：US14424539

    申请日：2013-08-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Thomas Schwarz

    IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

    CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/49503 ,  H01L25/0753 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  Y10T29/49158 ,  H01L2924/00

    Abstract: A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.

    Abstract translation: 壳体布置包括用于电子部件的多个互连壳体，每个壳体包括引线框架的引线框架部分，其中所述引线框架部分由导电材料形成并且具有容纳所述电子部件和/或接触区域的接收区域 其与所述电子部件接触，所述引线框架部分嵌入所述模制材料中，并且所述模制材料具有至少一个接收区域和/或所述接触区域露出的接收开口，以及形成在所述模制材料中的至少一个应力消除开口 并且没有接收区域和/或接触区域，其中壳体经由引线框和模制材料彼此连接，所述应力减小开口形成在从壳体中的一个壳体到另一壳体的过渡处。

    HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY
    66.
    发明申请
    HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY 有权
    用于电子元件的住房，电子总成，用于制造用于电子元件的住房的方法和用于生产电子组件的方法

    公开(公告)号：US20150221585A1

    公开(公告)日：2015-08-06

    申请号：US14423835

    申请日：2013-08-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

    IPC: H01L23/495 ,  H01L21/48

    CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

    Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

    Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

    Light-Emitting Semiconductor Component and Method for Producing a Light-Emitting Semiconductor Component
    67.
    发明申请
    Light-Emitting Semiconductor Component and Method for Producing a Light-Emitting Semiconductor Component 有权
    发光半导体元件及发光半导体元件的制造方法

    公开(公告)号：US20150041845A1

    公开(公告)日：2015-02-12

    申请号：US14382578

    申请日：2013-02-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Stefan Illek

    IPC: H01L33/54 ,  H01L33/64 ,  H01L33/62

    CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

    Abstract: The invention relates to a light-emitting semiconductor component comprising a light-emitting semiconductor chip with a semiconductor layer series, a light out-coupling surface, a rear surface lying opposite said light out-coupling surface and lateral surfaces, and a support body with a shaped body that directly covers the lateral surfaces in form-locked manner, two electric contact layers and a thermal contact layer being provided on the rear surface. The thermal contact layer is electrically insulated from the electric contact layers and the semiconductor layer series, the support body has electric connection elements in direct contact with the electric contact layers and a thermal connection element in direct contact with the thermal contact layer on the rear surface and the thermal connection element at least partially forms an assembly surface of the semiconductor component facing away from the semiconductor chip. The invention further relates to a method for producing a semiconductor component.

    Abstract translation: 本发明涉及一种发光半导体元件，其包括具有半导体层系列的发光半导体芯片，发光耦合表面，与所述发光耦合表面相对的后表面和侧表面，以及支撑体， 以形状锁定的方式直接覆盖侧表面的成形体，在后表面上设置有两个电接触层和热接触层。 热接触层与电接触层和半导体层系列电绝缘，支撑体具有与电接触层直接接触的电连接元件和与后接触层上的热接触层直接接触的热连接元件 并且热连接元件至少部分地形成半导体元件背离半导体芯片的组装表面。 本发明还涉及半导体元件的制造方法。

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