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    Light emitting diodes including pedestals
    62.
    发明申请
    Light emitting diodes including pedestals 审中-公开
    包括基座的发光二极管

    公开(公告)号：US20060131599A1

    公开(公告)日：2006-06-22

    申请号：US11338918

    申请日：2006-01-25

    申请人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

    发明人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

    IPC分类号： H01L33/00

    CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.

    摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。 凹槽可以包括锥形侧壁和/或斜面底板。 衬底的第一面也可以包括一组通孔。 通孔可以包括锥形侧壁和/或底板。

    Light emitting diode package with optical element
    63.
    发明授权
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US08735920B2

    公开(公告)日：2014-05-27

    申请号：US11496922

    申请日：2006-07-31

    申请人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    发明人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    Multiple component solid state white light
    65.
    发明申请
    Multiple component solid state white light 有权

    公开(公告)号：US20060138435A1

    公开(公告)日：2006-06-29

    申请号：US11347645

    申请日：2006-02-02

    申请人： Eric Tarsa ,  Michael Dunn ,  Bernd Keller

    发明人： Eric Tarsa ,  Michael Dunn ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2933/0091 ,  Y10S362/80 ,  H01L2924/00

    摘要： A white light emitting lamp is disclosed comprising a solid state ultra violet (UV) emitter that emits light in the UV wavelength spectrum. A conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light. One or more complimentary solid state emitters are included that emit at different wavelengths of light than the UV emitter and the conversion material. The lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering. Other embodiments of white light emitting lamp according to the present invention comprises a solid state laser instead of a UV emitter. A high flux white emitting lamp embodiment according to the invention comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum and includes a conversion material. A plurality of complimentary solid state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material such that the lamp emits a balanced white light. Scattering particles can be included in each of the embodiments to scatter the light from the emitters, conversion material and complimentary emitters to provide a more uniform emission.

    Light emitting diode package with optical element
    68.
    发明申请
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US20080023711A1

    公开(公告)日：2008-01-31

    申请号：US11496922

    申请日：2006-07-31

    申请人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    发明人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并且补偿透镜与封装的其余部分之间的不同的热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    LIGHT SOURCE WITH NEAR FIELD MIXING
    69.
    发明申请
    LIGHT SOURCE WITH NEAR FIELD MIXING 有权
    具有近场混合的光源

    公开(公告)号：US20090283779A1

    公开(公告)日：2009-11-19

    申请号：US12475261

    申请日：2009-05-29

    申请人： Gerald Negley ,  Bernd Keller

    发明人： Gerald Negley ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： F21K9/00 ,  F21K9/69 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode (LED) component comprising a submount with an array of LED chips and a lens over the array of LED chips. A diffuser is arranged so that at least some light from the LEDs passes through the diffuser to mix the LED light in the near field. The light passing through the diffuser appears as a mixture of LED chip light when directly viewed. A lighting device is also disclosed comprising an LED component comprising an array of LED chips and a near field diffuser to mix at least some of the light from the LED chips in the near field. A remote reflector is included to reflect at least some the light from the LED component so that is emits from the lighting device in the desired direction.

    摘要翻译： 一种发光二极管（LED）组件，包括具有LED芯片阵列的底座和LED芯片阵列上的透镜。 扩散器被布置成使得来自LED的至少一些光通过漫射器以混合近场中的LED光。 当直接观察时，通过扩散器的光作为LED芯片的混合物出现。 还公开了一种照明装置，其包括LED组件，该LED组件包括LED芯片阵列和近场扩散器，用于混合来自近场中的LED芯片的至少一些光。 包括远程反射器以反射来自LED部件的至少一些光，从而在所需方向上从照明装置发射。