公开(公告)号：US07311240B2

公开(公告)日：2007-12-25

申请号：US10836129

申请日：2004-04-30

申请人： Kinya Nippa ,  Wei Hong Soh

发明人： Kinya Nippa ,  Wei Hong Soh

IPC分类号： B23K31/02

CPC分类号： H05K3/363 ,  B23K1/0008 ,  B23K2101/36 ,  B23K2101/42 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0545

摘要： Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.

摘要翻译： 公开了用于制造两个制品之间的焊接接头的示例性方法。 该方法包括将待焊接在一起的第一制品和第二制品定位的步骤。 第一篇文章和第二篇文章中至少有一篇至少附有一个按钮。 按钮具有与其所附接的物品的表面上方的所需高度。 第二制品具有位于要形成焊点的位置的焊料量。 应用热源直到焊料液化为止。 除去热源，直到焊料以大约等于按钮高度的均匀厚度固化。

公开(公告)号：US07304247B2

公开(公告)日：2007-12-04

申请号：US10478295

申请日：2002-05-18

申请人： Dietmar Birgel ,  Sergej Lopatin

发明人： Dietmar Birgel ,  Sergej Lopatin

IPC分类号： H05K1/16

CPC分类号： H05K3/363 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/114 ,  H05K3/28 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/0979 ,  H05K2201/10666 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05655

摘要： A circuit board having, between the circuit board and a component arranged thereon, an electrical and mechanical connection of high mechanical-load-bearing ability. The circuit board includes at least one internally situated conductor path, a first insulating layer arranged on a first surface of the circuit board, a second insulating layer arranged on a second surface of the circuit board, a first contact location at which the conductor path is accessible, a second contact location, at which the conductor path is accessible through a bore passing completely through the circuit board, and an electronic component arranged on the first surface. The component has a first contact surface, which is connected with the first contact location by solder or electrically conductive adhesive, and a second contact surface which is connected with the second contact location by solder or adhesive.

摘要翻译： 在电路板和布置在其上的部件之间具有高机械承载能力的电气和机械连接的电路板。 电路板包括至少一个内部定位的导体路径，布置在电路板的第一表面上的第一绝缘层，布置在电路板的第二表面上的第二绝缘层，第一接触位置，导体路径 可接近的第二接触位置，导体路径可以通过完全穿过电路板的孔访问，以及布置在第一表面上的电子部件。 该部件具有通过焊料或导电粘合剂与第一接触位置连接的第一接触表面，以及通过焊料或粘合剂与第二接触位置连接的第二接触表面。

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

申请人： Shin Kim ,  Se-Yong OH

发明人： Shin Kim ,  Se-Yong OH

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

摘要翻译： 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。

公开(公告)号：US07205909B2

公开(公告)日：2007-04-17

申请号：US10606797

申请日：2003-06-27

申请人： Sook Jin Lee

发明人： Sook Jin Lee

IPC分类号： H03K17/94 ,  H03M11/00

CPC分类号： G06F3/0414 ,  G06F3/0488 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10666

摘要： A touch panel device includes a wiring terminal, a flexible printed circuit film connected to the wiring terminal, an adhesion part corresponding to a location where the flexible printed circuit film is connected to the wiring terminal, and an adhesion-reinforcing part adjacent to the adhesion part for strengthening an adhesive bonding strength of the adhesion part.

摘要翻译： 触摸面板装置包括接线端子，连接到接线端子的柔性印刷电路膜，对应于柔性印刷电路膜连接到接线端子的位置的粘合部分，以及与粘合剂相邻的粘附增强部件 用于增强粘合部分的粘合强度的部分。

公开(公告)号：US07155815B2

公开(公告)日：2007-01-02

申请号：US10859114

申请日：2004-06-03

申请人： Angelika Gernhardt ,  Thomas Goulet ,  Carsten Menzel ,  Waldemar Ollik

发明人： Angelika Gernhardt ,  Thomas Goulet ,  Carsten Menzel ,  Waldemar Ollik

IPC分类号： H03K3/34

CPC分类号： H05K3/403 ,  H05K1/0284 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

摘要： A method for contacting printed conductors terminating at the edge of a circuit board with printed conductors of a MID component includes: on a panel which includes the circuit board, producing the printed conductors of the circuit board in a layout in which the printed conductors are extended past a partition line which defines the edge of the circuit board; providing the panel with through holes along the partition line in the region of the printed conductors; electroplating through the through holes; isolating the circuit board from the panel; and positioning the circuit board in relation to the MID component and soldering the printed conductors of the circuit board to the printed conductors of the MID component. Rear electrical contacting areas are provided on a back side of the panel near the partition line, and the printed conductors are connected to the rear electrical contacting areas via the through holes.

摘要翻译： 用于将终端于电路板边缘的印刷导体与MID组件的印刷导体接触的方法包括：在包括电路板的面板上，以印刷导体延伸的布局产生电路板的印刷导体 通过限定电路板边缘的分隔线; 在印刷导体的区域中沿着分隔线提供通孔; 通过通孔电镀; 将电路板与面板隔离; 并将电路板相对于MID组件定位并将电路板的印刷导体焊接到MID组件的印刷导体。 后面的电气接触区域设置在靠近分隔线的面板的背面，并且印刷的导体经由通孔连接到后部电接触区域。

公开(公告)号：US20060087011A1

公开(公告)日：2006-04-27

申请号：US11236815

申请日：2005-09-28

申请人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Hitoki Kanagawa ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H01L23/495

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

摘要： A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9. This can provide the result that when the external connecting terminals 8 are connected to the external terminals 23, the connection can be performed while confirming the placement of the solder balls 21 from the respective through holes.

摘要翻译： 一种具有端子的布线电路板，其端子可以提供熔融金属在端子上的可靠放置，以高精度连接端子和外部端子。 绝缘基层3形成在支撑基板2上，导电图案4形成在基底绝缘层3上，使得多条导线4a，4b，4c，4d的线，磁头连接端子 如图7所示，外部连接端子8一体形成，并且第一通孔9形成在外部连接端子8中。 此后，在形成绝缘覆盖层10之后，分别在支撑板2和绝缘基底层3中形成第三通孔20和第二通孔19，以与第一通孔9连通。 这可以得到当外部连接端子8连接到外部端子23时的结果，可以在确认从各个通孔放置焊球21的同时进行连接。

公开(公告)号：US20060042831A1

公开(公告)日：2006-03-02

申请号：US11216813

申请日：2005-08-31

申请人： Meta Rohde ,  Klaus Schoepf ,  Ajay Poddar ,  Reimund Rebel

发明人： Meta Rohde ,  Klaus Schoepf ,  Ajay Poddar ,  Reimund Rebel

IPC分类号： H05K1/11 ,  H05K1/09

CPC分类号： H05K3/3442 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/244 ,  H05K3/368 ,  H05K2201/09481 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49165

摘要： A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.

公开(公告)号：US20050279529A1

公开(公告)日：2005-12-22

申请号：US11054430

申请日：2005-02-10

申请人： Akihiko Happoya

发明人： Akihiko Happoya

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K1/147 ,  H05K3/363 ,  H05K3/4691 ,  H05K2201/10189 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y10T29/49126

摘要： Disclosed is a wiring board, comprising: a rigid substrate having a first surface and a second surface, wiring layers on the first surface and the second surface, and through hole's inner wall conductors electrically conducting the wiring layers on the first and the second surface, the wiring layer on the first surface including part mounting lands; a flexible substrate disposed to oppose the second surface of the rigid substrate and having connection lands on its surface which is opposite to the second surface of the rigid substrate, the connection lands being positioned to substantially agree with positions of the through hole's inner wall conductors of the rigid substrate; and a connecting member which electrically and mechanically connects the through hole's inner wall conductors and the connection lands, and a magnetic disc apparatus having the wiring board and a production method of the wiring board are disclosed.

摘要翻译： 公开了一种布线板，包括：具有第一表面和第二表面的刚性基板，在第一表面和第二表面上的布线层，以及导电第一和第二表面上的布线层的通孔内壁导体， 所述第一表面上的所述布线层包括部分安装台面; 柔性基板设置成与刚性基板的第二表面相对并且在其表面上具有与刚性基板的第二表面相对的连接平台，连接平台被定位成基本上与通孔的内壁导体的位置一致 刚性基材; 以及将通孔的内壁导体和连接台电连接并机械连接的连接部件，以及具有布线基板的磁盘装置和布线基板的制造方法。

公开(公告)号：US20050258526A1

公开(公告)日：2005-11-24

申请号：US11168549

申请日：2005-06-29

申请人： Takashi Noguchi

发明人： Takashi Noguchi

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H01L23/58 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H01L23/495

CPC分类号： H01L22/32 ,  H01L23/498 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3651 ,  H05K3/225 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/0394 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible. A substrate 1 has formed therein through-holes 7 lined on the internal walls with a wiring layer 9, and solder balls 6 are fusion-bonded to the substrate 1 in such a manner as to cover the through-holes 7. In the mounting process or in the repair process, heating probes 41 are passed through the through-holes 7 and thrust into the solder balls 6 to thereby melt the solder balls, and the heating probes are pulled out of the solder balls to let the solder balls cool down. In those processes, only the solder balls 6 can be heated, thereby averting adverse effects on the IC chip 3. In the repair process, the solder balls 6 can be restored to an initial condition free of intermetallic compounds.

摘要翻译： 一种可以降低故障发生率的半导体器件的安装方法，可以容易地修复有缺陷的焊点的半导体器件的修复方法以及使这些方法可行的半导体器件。 衬底1上形成有布线层9内衬在内壁上的通孔7，并且焊球6以覆盖通孔7的方式熔合到衬底1上。在安装过程中 或者在维修过程中，加热用探针41穿过通孔7并推入焊球6，从而熔化焊球，并将加热探针从焊球中拉出以使焊球冷却。 在这些处理中，仅可以加热焊球6，从而避免对IC芯片3的不利影响。在修复过程中，焊球6可以恢复到没有金属间化合物的初始条件。

公开(公告)号：US20040231884A1

公开(公告)日：2004-11-25

申请号：US10849478

申请日：2004-05-19

发明人： Kenneth Daryl Wong ,  Sean L. Bell

IPC分类号： H05K007/20 ,  H05K001/11

CPC分类号： H05K3/44 ,  H05K3/0061 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2203/1178 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

摘要翻译： 公开了一种印刷电路板组件，其采用与连接到导电托盘的焊料填充的互连通孔相邻的焊剂通气孔。 焊锡通气孔允许气体在回流焊接过程中从另一个密封的空腔中逸出，减轻正压，从而允许焊料流入其中。 通过为焊膏回流期间产生的被捕获的空气和气体提供逃生路径，熔融焊料的排气压力和重量足以使焊膏流入空腔。