公开(公告)号：US20100289130A1

公开(公告)日：2010-11-18

申请号：US12464253

申请日：2009-05-12

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H01L23/48 ,  H05K1/11 ,  H01L21/50

CPC classification number: H05K1/181 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2201/10689 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00

Abstract: A method and apparatus for constructing a packaged integrated circuit stack 40 having at least two packaged integrated circuits 44 and 45 with an interposer 42 between the packaged integrated circuits 44 and 45. Interposer 42 is provided with apertures 47 which allow adhesive 50 to flow through interposer 42 to bond packaged integrated circuits 44 and 45 together with interposer 42. Alternate embodiments provide holes 54 to allow passage of leads 56 through interposer 42 to a substrate 60 through additional connections 48. The method describes the construction of the stack.

Abstract translation: 一种用于构建封装集成电路堆叠40的方法和装置，其具有至少两个封装的集成电路44和45以及在封装的集成电路44和45之间的插入器42.内插件42设置有孔47，允许粘合剂50流过插入件 将封装的集成电路44和45与插入器42连接在一起。替代实施例提供孔54以允许引线56通过插入件42通过附加连接48通过衬底60.该方法描述了堆叠的构造。

公开(公告)号：US20100181890A1

公开(公告)日：2010-07-22

申请号：US12688520

申请日：2010-01-15

Applicant: Ching-Lin Tseng ,  Ming-Li Chang ,  Cheng-Chieh Lin

Inventor： Ching-Lin Tseng ,  Ming-Li Chang ,  Cheng-Chieh Lin

IPC: H01J61/52 ,  H01J9/24

CPC classification number: H05K1/021 ,  F21K9/00 ,  F21V29/70 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/142 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/281 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10924 ,  H05K2203/063

Abstract: A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.

Abstract translation: 照明装置包括：至少一个照明模块，包括引线框架和封装在引线框架上的多个发光二极管; 设置在所述引线框架上的上板，并且具有形成有用于使所述发光二极管延伸的多个通孔的至少一个穿孔区域，以及分别设置在所述穿孔区域的两侧上的至少两个导体区域， 导体区域与引线框架电连接; 布置在引线框架下方的散热器; 以及将照明模块固定到上板和散热器的多个紧固件，使得散热器与发光二极管的底端紧密接触。

公开(公告)号：US07754974B2

公开(公告)日：2010-07-13

申请号：US11372104

申请日：2006-03-10

Applicant: Masataka Suzuki ,  Kenji Hayakawa

Inventor： Masataka Suzuki ,  Kenji Hayakawa

IPC: H05K1/00

CPC classification number: H05K3/4092 ,  H05K1/056 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the metal plate and a circuit pattern formed on a surface of the insulating layer, wherein a part of said metal plate is exposed to outside of the insulating layer and is utilized as connector terminals. The metal plate has a heat sink plate to heat sink a heat-generating device mounted on the metal-core substrate and connector terminal plates disposed separately from the heat sink plate and utilized for the connector terminals. The heat-generating device and a driving part thereof each are disposed on a different surface of the metal-core substrate.

Abstract translation: 本发明提供一种不安装大尺寸端子和连接器的金属芯基板。 因此，金属芯基板可以更小更薄。 金属芯基板包括金属板，形成在金属板的表面上的绝缘层和形成在绝缘层的表面上的电路图案，其中所述金属板的一部分暴露于绝缘层的外部， 被用作连接器端子。 金属板具有散热板，用于将安装在金属芯基板上的发热装置和与散热板分开设置的连接器端子板散热，用于连接器端子。 发热元件及其驱动部分分别设置在金属芯基板的不同表面上。

公开(公告)号：US07663886B2

公开(公告)日：2010-02-16

申请号：US12003037

申请日：2007-12-19

Applicant: Kazuo Aoki ,  Junji Tsuruoka ,  Seiji Yasui ,  Yasushi Kabata ,  Shin Soyano

Inventor： Kazuo Aoki ,  Junji Tsuruoka ,  Seiji Yasui ,  Yasushi Kabata ,  Shin Soyano

IPC: H05K7/20 ,  H01L23/02

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L24/40 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/10924 ,  H05K2201/2018 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Abstract translation: 电子电路装置包括形成有主电路的下侧基板; 形成有驱动控制主电路的驱动控制电路的上侧基板; 以硬化状态的树脂位于下侧基板的上方固定的支撑体; 以及壳体，具有外周面，外周面具有至少一部分驱动控制电路的外部引出端子和主电路，以及基板收纳空间，其在下侧容纳下侧基板 从周边部分向内。

公开(公告)号：US20090190320A1

公开(公告)日：2009-07-30

申请号：US12362354

申请日：2009-01-29

Applicant: ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

Inventor： ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC: H05K7/04 ,  H01L23/48

CPC classification number: H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

Abstract translation: 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US20090158584A1

公开(公告)日：2009-06-25

申请号：US12004539

申请日：2007-12-20

Applicant: Christopher D. Prest

Inventor： Christopher D. Prest

IPC: H01R13/58 ,  H01R43/00

CPC classification number: H01R43/0263 ,  H01R4/023 ,  H01R12/58 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/10356 ,  H05K2201/10424 ,  H05K2201/10924 ,  H05K2201/10962 ,  Y10T29/49117 ,  Y10T29/49123 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49179 ,  Y10T29/49208

Abstract: A termination for a multi-conductor cable is made by providing a metal structure that includes a plurality of parallel but spaced apart fingers that are joined together by a connecting member adjacent at least one end of each finger. Each of the conductors in the cable is connected to a respective one of the fingers at a location that is spaced from the connecting member. The cable and the fingers are then over-molded with an insulating material where the conductors are connected to the fingers. This over-molding leaves a portion of the length of each finger exposed. The connecting member is then severed and removed.

Abstract translation: 通过提供包括多个平行但间隔开的指状物的金属结构来形成多导体电缆的终端，所述多个平行但间隔开的指状物通过邻近每个手指的至少一个端部的连接构件连接在一起。 电缆中的每个导体在与连接构件间隔开的位置处连接到相应的一个指状物。 然后将电缆和指状物用绝缘材料进行过模制，其中导体连接到手指。 这种过度模制使得每个手指的长度的一部分暴露出来。 然后将连接件切断并移开。

公开(公告)号：US07484971B2

公开(公告)日：2009-02-03

申请号：US11604289

申请日：2006-11-27

Applicant: Mark W. Gailus ,  Leon M. Khilchenko

Inventor： Mark W. Gailus ,  Leon M. Khilchenko

IPC: H01R9/09

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

公开(公告)号：US20070090513A1

公开(公告)日：2007-04-26

申请号：US11371562

申请日：2006-03-09

Applicant: Chin Kuo ,  Yi Hsieh

Inventor： Chin Kuo ,  Yi Hsieh

IPC: H01L23/053

CPC classification number: H01L23/49568 ,  H01L23/49531 ,  H01L23/49551 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1316 ,  H01L2924/00

Abstract: A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.

Abstract translation: 公开了一种功率模块的制造方法及其结构。 该方法包括以下步骤：提供金属板并在金属板上限定图案; 根据图案切割金属板以形成多个销和导热板，其中销通过连接部彼此连接或连接到金属板，并且导热板联接到连接部分 通过固定部分; 弯曲销的第一端以形成延伸部分并弯曲固定部分以将导热板和金属板设置在不同的水平; 提供具有多个通孔的电路板，并将所述延伸部分相应地插入所述通孔中并将所述销固定在所述电路板上; 形成壳体以将电路板封装在其中，其中导热板镶嵌在壳体上，并且销的第二端延伸出壳体; 以及切割连接部分和固定部分，以将销彼此分开并与金属板分离，并使引脚和导热板隔离。

公开(公告)号：US20070036490A1

公开(公告)日：2007-02-15

申请号：US11426298

申请日：2006-06-23

Applicant: Donald Ice ,  Darin Douma

Inventor： Donald Ice ,  Darin Douma

IPC: G02B6/36

CPC classification number: G02B6/4246 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/302

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。

公开(公告)号：US06963028B2

公开(公告)日：2005-11-08

申请号：US11097136

申请日：2005-04-04

Applicant: Junichi Tanaka ,  Hiroyuki Takubo ,  Shigenobu Abe

Inventor： Junichi Tanaka ,  Hiroyuki Takubo ,  Shigenobu Abe

IPC: B42D15/10 ,  G06K17/00 ,  G06K19/07 ,  G06K19/077 ,  H05K1/02 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K5/00

CPC classification number: G06K19/0726 ,  G06K19/0723 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K3/202 ,  H05K3/328 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  H05K2201/10924 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.

Abstract translation: IC模块包括具有要连接到IC卡的天线线圈的端子的引线框架，以及安装在引线框架上并用树脂封装的用于调谐的IC芯片和多层片式电容器。 多层片式电容器安装在引线框架上的凹槽中。