公开(公告)号：US20070046114A1

公开(公告)日：2007-03-01

申请号：US11509673

申请日：2006-08-25

申请人： Koji Kondo ,  Masatoshi Koumura

发明人： Koji Kondo ,  Masatoshi Koumura

IPC分类号： H02K3/24 ,  H02K11/04

CPC分类号： H02K11/046 ,  H01L23/367 ,  H01L25/115 ,  H01L2924/0002 ,  H02K19/365 ,  H01L2924/00

摘要： A rectifier of an automotive alternator includes a heat sink that has fitting holes, in each of which one rectifying element is fitted, and a major surface on which the fitting holes open. The heat sink also has substantially annular ribs, each of which is formed on the major surface around a corresponding one of the fitting holes. Each of the ribs has a first portion, which lies in an area on the major surface where a minimum distance between an inner edge of the heat sink defining the corresponding fitting hole and an outer edge of the heat sink defining an outline of the heat sink is smaller, and a second portion that lies in an area on the major surface where a minimum distance between the inner and outer edges is larger. The first portion has a greater protruding height from the major surface than the second portion.

摘要翻译： 汽车交流发电机的整流器包括具有装配孔的散热器，每个安装有一个整流元件以及装配孔打开的主表面。 散热器还具有基本上环形的肋，每个肋形成在相应的一个装配孔周围的主表面上。 每个肋具有第一部分，其位于主表面上的区域中，其中限定相应的装配孔的散热器的内边缘与散热器的外边缘之间的最小距离限定散热器的轮廓 并且位于主表面上的内边缘和外边缘之间的最小距离较大的区域中的第二部分。 第一部分具有比第二部分更大的从主表面的突出高度。

公开(公告)号：US20070014266A1

公开(公告)日：2007-01-18

申请号：US11481248

申请日：2006-07-06

申请人： Koji Kondo

发明人： Koji Kondo

IPC分类号： H04B7/212

CPC分类号： H04W74/0858 ,  H04W84/12 ,  H04W88/08

摘要： A wireless LAN system if formed by a base station, mobile stations and a controller. The controller receives a frame over wireless media, and a frame analyzer analyzes the received frame. A determination section determines whether or not the frame received at a predicted time based on the rule of frame for a service on a layer higher than a media access control layer is an intended frame based on results from the frame analyzer. A frame transmitter sends out a frame containing a field specifying the duration of the frame to be transmitted to a destination station that should be given the first priority to transmit on a wireless uplink and downlink, based on the determination that the frame received is not in conformity with the rule of frame.

摘要翻译： 无线LAN系统如果由基站，移动台和控制器组成。 控制器通过无线介质接收帧，帧分析器分析接收到的帧。 确定部分基于来自帧分析器的结果，确定在基于用于在媒体访问控制层以上的层上的服务的帧的规则的预测时间接收的帧是否是预期帧。 帧发送器基于所接收的帧不在的确定，发送包含指定要发送的帧的持续时间的帧的帧，所述帧的目的站应当被赋予第一优先级以在无线上行链路和下行链路上进行发送 符合框架规则。

公开(公告)号：US20060068180A1

公开(公告)日：2006-03-30

申请号：US11232078

申请日：2005-09-22

申请人： Koji Kondo ,  Ryohei Kataoka ,  Tomohiro Yokochi ,  Makoto Nakagoshi ,  Tadashi Murai ,  Akimori Hayashi ,  Katsunobu Suzuki

发明人： Koji Kondo ,  Ryohei Kataoka ,  Tomohiro Yokochi ,  Makoto Nakagoshi ,  Tadashi Murai ,  Akimori Hayashi ,  Katsunobu Suzuki

IPC分类号： B32B3/00 ,  B32B37/00

CPC分类号： H05K3/4688 ,  H05K1/0269 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/28 ,  H05K3/285 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2203/161 ,  Y10T428/24917

摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.

摘要翻译： 在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大 比土地和热塑性树脂构件之间的距离大。 在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。 由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。 因此，可以有效地提高土地的识别率。

公开(公告)号：US20050186406A1

公开(公告)日：2005-08-25

申请号：US11116320

申请日：2005-04-28

申请人： Toshikazu Harada ,  Koji Kondo

发明人： Toshikazu Harada ,  Koji Kondo

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00 ,  H05K1/00

CPC分类号： H05K1/0242 ,  H05K1/024 ,  H05K3/382 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2203/065 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T428/24917

摘要： A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.

摘要翻译： 多层印刷电路板包括绝缘基板; 设置在所述绝缘基板的表面上的表面导电图案; 以及嵌入绝缘基板中的内导电图案。 表面导电图案在绝缘基板侧具有表面粗糙度，表面导电图案的表面粗糙度大于内部导电图案的表面粗糙度。

公开(公告)号：US06848178B2

公开(公告)日：2005-02-01

申请号：US10437041

申请日：2003-05-14

申请人： Koji Kondo ,  Ryohei Kataoka ,  Gentaro Masuda

发明人： Koji Kondo ,  Ryohei Kataoka ,  Gentaro Masuda

IPC分类号： H05K1/02 ,  H01L23/12 ,  H01L23/498 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  H04K1/14

CPC分类号： H05K3/4632 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2201/09881 ,  Y10T29/49165 ,  H01L2924/00

摘要： A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating layer, a conductive compound, and a conductive pattern. The insulating layer has a trench. The conductive compound is located in the trench. The conductive pattern adjoins the trench and is electrically connected to the conductive compound. The conductive pattern and the conductive compound make up a conductive wire that has a higher current-carrying capacity than the conductive pattern.

摘要翻译： 层叠有多个绝缘层和多个导体层的多层电路基板，其中，所述多个绝缘层和多个导体层包含导体图案，其中包括绝缘层，导电性化合物和导体图案。 绝缘层具有沟槽。 导电化合物位于沟槽中。 导电图案与沟槽相邻并且与导电化合物电连接。 导电图案和导电化合物组成导电线，其具有比导电图案更高的载流能力。

公开(公告)号：US06768061B2

公开(公告)日：2004-07-27

申请号：US10179203

申请日：2002-06-26

申请人： Koji Kondo

发明人： Koji Kondo

IPC分类号： H05K103

CPC分类号： H05K3/4632 ,  H01L2224/1147 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/244 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0394 ,  H05K2203/072 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163

摘要： A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24, which are bottomed by the conductor layers, are formed in the resin film. Then interlayer connecting material is packed in the via-holes 24 to form a single-sided conductor layer film having the interlayer connecting material. A plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board. The multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.

摘要翻译： 仅在一个表面上具有电极的多层电路板制造如下。 在由热塑性树脂制成的树脂膜上形成多个导体层以形成单面导体层膜。 然后，在树脂膜中形成有由导体层底部的多个通路孔24。 然后将层间连接材料包装在通孔24中，以形成具有层间连接材料的单面导体层膜。 多个单面导体层膜被形成并堆叠，使得具有导体层的表面面向相同的方向。 然后，对单面导体层膜进行加压加热以完成多层电路板。 多层电路板仅使用单面导体层膜并按压一次形成，因此制造工艺简化。

公开(公告)号：US06713687B2

公开(公告)日：2004-03-30

申请号：US10022222

申请日：2001-12-20

申请人： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

发明人： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC分类号： H05K111

CPC分类号： H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

摘要： Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

摘要翻译： 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。

公开(公告)号：US06641898B2

公开(公告)日：2003-11-04

申请号：US10024470

申请日：2001-12-21

申请人： Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

发明人： Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

IPC分类号： B32B300

CPC分类号： H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

公开(公告)号：US06330166B1

公开(公告)日：2001-12-11

申请号：US09399166

申请日：1999-09-20

申请人： Masayuki Aoyama ,  Yasuaki Matsunaga ,  Tomoyuki Hiramatsu ,  Naoyuki Akita ,  Koji Kondo

发明人： Masayuki Aoyama ,  Yasuaki Matsunaga ,  Tomoyuki Hiramatsu ,  Naoyuki Akita ,  Koji Kondo

IPC分类号： H05K702

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K2201/0394 ,  H05K2201/09427 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively. An outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) extends outward of an outer edge (Y1) of a corresponding first outermost electrode (1b) with respect to the first and second arrays. A distance between an outer edge (X1, Z1) of each of the second outermost electrodes (3b, 3c) and an outer edge (Y1) of a corresponding first outermost electrode (1b) is greater than a distance between an inner edge (X2, Z2) of the second outermost electrode (3b, 3c) and an inner edge (Y2) of the corresponding first outermost electrode (1b) with respect to the first and second arrays.

摘要翻译： 在电子部件安装结构中，电子部件（2）具有表面。 设置在电子部件（2）的表面上的第一电极（1）以第一阵列布置。 设置在基板（4）上的第二电极（3）以对应于第一阵列的第二阵列布置。 第二电极（3）分别对应于第一电极（1）。 焊接凸块（9）分别连接第一电极（1）和第二电极（3）。 第一电极（1）包括位于第一阵列的外部区域中的第一最外电极（1b）。 第二电极（3）包括位于第二阵列的外部区域中的第二最外电极（3b，3c）。 第二最外电极（3b，3c）分别对应于第一最外电极（1b）。 每个第二最外电极（3b，3c）的外边缘（X1，Z1）相对于第一和第二阵列延伸到对应的第一最外电极（1b）的外边缘（Y1）的外侧。 每个第二最外电极（3b，3c）的外边缘（X1，Z1）与对应的第一最外电极（1b）的外边缘（Y1）之间的距离大于内边缘（X2 ，Z2）和相应的第一最外电极（1b）的内边缘（Y2）相对于第一和第二阵列。

公开(公告)号：US06303878B1

公开(公告)日：2001-10-16

申请号：US09121303

申请日：1998-07-23

申请人： Kenji Kondo ,  Masayuki Aoyama ,  Koji Kondo ,  Masanori Takemoto ,  Hidehiro Mikura ,  Tetuhiro Nakano

发明人： Kenji Kondo ,  Masayuki Aoyama ,  Koji Kondo ,  Masanori Takemoto ,  Hidehiro Mikura ,  Tetuhiro Nakano

IPC分类号： H05K109

CPC分类号： H05K3/244 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K2201/09227 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.

摘要翻译： BGA封装安装在具有通过多个焊料凸块以矩阵形式布置的多个电极的多层印刷布线板上。 在最外部定位的电极中，形成引线，其从位于通过连接相邻的最外部定位的电极的每个中心形成的多边形内部的最外部定位的电极的一部分延伸。 因此，由于由外部冲击引起的应力的最外部位置的电极的一部分被集中地施加，所以防止了焊料凸块脱离最外部定位的电极，位于多边形的外侧。 因此，防止了BGA封装和多层印刷电路板之间的接触故障。