公开(公告)号：US07271483B2

公开(公告)日：2007-09-18

申请号：US11026919

申请日：2004-12-29

申请人： Ying-Ren Lin ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

发明人： Ying-Ren Lin ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/40

CPC分类号： H01L24/12 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11902 ,  H01L2224/13018 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/0723 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013

摘要： A bump structure of a semiconductor package and a method for fabricating the same are provided. The bump structure is used to connect a semiconductor element to a carrier of the semiconductor package. The fabrication method primarily employs an electroplating process to form the bump structure including an under bump metallurgy (UBM) layer, at least one I-shaped conductive pillar, and a solder material. This allows fine-pitch electrical connection pads to be arranged in the semiconductor package, and also provides an enhanced support structure and a sufficient height between the semiconductor element and the carrier.

摘要翻译： 提供半导体封装的凸块结构及其制造方法。 凸块结构用于将半导体元件连接到半导体封装的载体。 该制造方法主要采用电镀工艺来形成凸块结构，其包括凸块下金属（UBM）层，至少一个I形导电柱和焊料材料。 这允许在半导体封装中布置细间距电连接焊盘，并且还提供增强的支撑结构和在半导体元件和载体之间的足够的高度。

公开(公告)号：US20070141761A1

公开(公告)日：2007-06-21

申请号：US11703517

申请日：2007-02-06

申请人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Ying-Ren Lin ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating semiconductor packages includes the steps of: providing a plurality of substrates and a carrier having a plurality of openings, wherein, each of the substrates has at least one chip (die) disposed thereon, length and width of the substrates are approximately equal to the predefined length and width of semiconductor packages, and length and width of the openings of the carrier are bigger than length and width of the substrates; respectively positioning the substrates in the openings of the carrier and blocking the gaps between the substrates and the carrier so as to prevent the gaps from penetrating through the carrier; performing a mold press process so as to form an encapsulant on each of the openings for encapsulating the chip, wherein length and width of the area covered by the encapsulant are bigger than length and width of the opening; performing a mold releasing process; and cutting along edges of the substrates according to the predefined length and width of semiconductor packages, thereby obtaining a plurality of semiconductor packages. The present invention also discloses a structure and method for positioning the substrates.

摘要翻译： 一种制造半导体封装的方法包括以下步骤：提供多个基板和具有多个开口的载体，其中每个基板具有设置在其上的至少一个芯片（芯片），基板的长度和宽度大致为 等于半导体封装的预定长度和宽度，载体的开口的长度和宽度大于基板的长度和宽度; 分别将基板定位在载体的开口中并阻挡基板和载体之间的间隙，以防止间隙穿透载体; 进行模压加工，以在封装芯片的每个开口上形成密封剂，其中由密封剂覆盖的区域的长度和宽度大于开口的长度和宽度; 执行脱模工艺; 并且根据半导体封装的预定长度和宽度切割基板的边缘，从而获得多个半导体封装。 本发明还公开了一种用于定位基板的结构和方法。

公开(公告)号：US07074645B2

公开(公告)日：2006-07-11

申请号：US11013980

申请日：2004-12-15

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.

摘要翻译： 提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输 到散热器 此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量 水槽只有其底表面与密封剂结合。 这使得所产生的热量通过散热器直接耗散到大气中。 此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。 这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂 成型时产生的力。

公开(公告)号：US20050202590A1

公开(公告)日：2005-09-15

申请号：US10846460

申请日：2004-05-14

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.

摘要翻译： 提供具有积层的晶片级半导体封装，其包括具有用于接收其中的半导体芯片的通孔的玻璃框架，填充在形成在半导体芯片和玻璃框架之间的空间内的低模量缓冲材料， 形成在所述玻璃框架和所述半导体芯片上的堆积层，使得所述积层层电连接到所述半导体芯片，以及安装在所述积层层上的多个导电元件，使得所述半导体芯片电连接 到外部设备。 通过使用玻璃框架和低模量缓冲材料，由此获得的晶片级半导体封装没有翘曲，芯片裂纹和分层问题，并且其可靠性得到提高。 还提供了一种用于制造晶片级半导体封装的方法。

公开(公告)号：US20050095875A1

公开(公告)日：2005-05-05

申请号：US11013980

申请日：2004-12-15

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/34

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor package with a heat sink is proposed, in which a chip has its first surface attached to a chip carrier, while a second surface of the chip is attached to a heat sink through an adhesive, allowing heat generated by the chip to be transmitted to the heat sink. Moreover, in a molding process, a molding resin is used to form an encapsulant for encapsulating the chip, while a top surface and side surfaces connected to the top surface of the heat sink are exposed to outside of the encapsulant, that is, the heat sink merely has its bottom surface bonded to the encapsulant. This makes the generated heat directly dissipated to the atmosphere through the heat sink. Furthermore, the top surface of the heat sink is coated with an interface layer, while adhesion between the interface layer and the molding resin is smaller than that between the heat sink and the encapsulant. This allows the molding resin remained on the interface layer to be easily removed after completing the molding process, while delamination can be prevented from occurrence between the heat sink or the chip and the encapsulant, and also the chip can be prevented from cracking due to clamping force generated during molding.

摘要翻译： 提出了具有散热器的半导体封装，其中芯片的第一表面附着到芯片载体上，而芯片的第二表面通过粘合剂附接到散热器，从而允许芯片产生的热量被传输 到散热器 此外，在成型工艺中，使用模塑树脂形成用于封装芯片的密封剂，同时连接到散热器的顶表面的顶表面和侧表面暴露于密封剂的外部，即热量 水槽只有其底表面与密封剂结合。 这使得所产生的热量通过散热器直接耗散到大气中。 此外，散热器的顶表面涂覆有界面层，而界面层和模制树脂之间的粘合力小于散热器和密封剂之间的粘合。 这允许在完成模制过程之后容易地去除界面层上的模塑树脂，同时可以防止散热片或芯片与密封剂之间发生分层，并且还可以防止芯片由于夹紧而开裂 成型时产生的力。

公开(公告)号：US20110287587A1

公开(公告)日：2011-11-24

申请号：US13195617

申请日：2011-08-01

申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/52

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401 ,  H01L2224/45099

摘要： A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.

摘要翻译： 公开了一种散热封装结构及其制造方法，其包括通过其有源表面安装和电连接半导体芯片到芯片载体; 将具有散热部和支撑部的散热部件安装在所述芯片载体上，使得所述半导体芯片能够容纳在由所述散热部和所述支撑部形成的空间中，其中，所述散热部具有对应的开口 到半导体芯片; 形成密封剂以封装半导体芯片和散热构件; 并且使所述密封剂变薄以除去形成在所述半导体芯片上的所述密封剂，以从所述密封剂暴露所述半导体芯片的无效表面和所述散热部分的顶表面。 因此，通过以低成本的简化的制造步骤制造散热封装结构，并且克服了在现有技术的封装成型工艺中芯片容易损坏的问题。

公开(公告)号：US08062933B2

公开(公告)日：2011-11-22

申请号：US11954355

申请日：2007-12-12

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L33/64 ,  H01L33/48

CPC分类号： H01L24/97 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for encapsulating the chip, with a non-active surface of the chip being exposed from the encapsulant; and a heat spreader having a hollow portion and attached to the encapsulant, wherein the chip is received in the hollow portion and the non-active surface of the chip is completely exposed to the hollow portion, such that heat generated by the chip can be directly dissipated out of the package structure. The present invention also provides a method for fabricating the heat dissipating package structure.

摘要翻译： 散热封装结构包括芯片载体; 安装并电连接到芯片载体的半导体芯片; 形成在所述芯片载体上并用于封装所述芯片的密封剂，所述芯片的非活性表面从所述密封剂暴露出来; 以及具有中空部分并附着到密封剂的散热器，其中芯片被容纳在中空部分中，并且芯片的非活动表面完全暴露于中空部分，使得芯片产生的热量可以直接 从包装结构中消散掉。 本发明还提供一种制造散热封装结构的方法。

公开(公告)号：US08008769B2

公开(公告)日：2011-08-30

申请号：US12150047

申请日：2008-04-23

申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

摘要翻译： 公开了一种散热半导体封装结构及其制造方法。 该方法包括：在至少半导体芯片和封装单元上布置并电连接到芯片载体; 在所述封装单元的顶表面上设置有经由所述平坦部分具有平坦部分和支撑部分的散热元件; 在由散热元件的平坦部分和支撑部分形成的接收空间中接收封装单元和半导体芯片; 以及在芯片载体密封剂上形成以封装封装单元，半导体芯片和散热元件。 散热元件消散封装单元产生的热量，提供EMI屏蔽，防止封装单元与密封剂之间的分层，降低热阻，防止开裂。

公开(公告)号：US07981729B2

公开(公告)日：2011-07-19

申请号：US12818701

申请日：2010-06-18

申请人： Jung-Pin Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

发明人： Jung-Pin Huang ,  Chin-Huang Chang ,  Chien-Ping Huang ,  Chung-Lun Liu ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48496 ,  H01L2224/49175 ,  H01L2224/78 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00

摘要： A multi-chip stack structure and a fabrication method thereof are proposed, including providing a leadframe having a die base and a plurality of leads and disposing a first and a second chips on the two surfaces of the die base respectively; disposing the leadframe on a heating block having a cavity in a wire bonding process with the second chip received in the cavity of the heating block; performing a first wire bonding process to electrically connect the first chip to the leads through a plurality of first bonding wires, and forming a bump on one side of the leads connected with the first bonding wires; disposing the leadframe in an upside down manner to the heating block via the bump with the first chip and the first bonding wires received in the cavity of the heating block; and performing a second wire bonding process to electrically connect the second chip to the leads through a plurality of second bonding wires. The bump is used for supporting the leads to a certain height so as to keep the bonding wires from contacting the heating block and eliminate the need of using a second heating block in the second wire bonding process of the prior art, thereby saving time and costs in a fabrication process. Also, as positions where the first and second bonding wires are bonded to the leads on opposite sides of the leadframe correspond with each other, the conventional problems of adversely affected electrical performance and electrical mismatch can be prevented.

摘要翻译： 提出了一种多芯片堆叠结构及其制造方法，包括提供具有芯片基底和多个引线的引线框架，并分别在模具基座的两个表面上设置第一和第二芯片; 将引线框架布置在具有引线接合工艺中的空腔的加热块上，第二芯片容纳在加热块的空腔中; 执行第一引线接合工艺，以通过多个第一接合线将第一芯片电连接到引线，以及在与第一接合线连接的引线的一侧上形成凸块; 通过第一芯片和第一接合线容纳在加热块的空腔中，通过凸块将引线框倒置放置到加热块， 以及执行第二引线接合处理，以通过多个第二接合线将所述第二芯片电连接到所述引线。 凸块用于将引线支撑到一定高度，以便使接合线不会接触加热块，并且在现有技术的第二引线接合过程中不需要使用第二加热块，从而节省了时间和成本 在制造过程中。 此外，由于第一和第二接合线与引线框架的相对侧上的引线接合的位置彼此对应，可以防止电性能和电不匹配受到不利影响的常规问题。

公开(公告)号：US07759170B2

公开(公告)日：2010-07-20

申请号：US12710450

申请日：2010-02-23

申请人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Han-Ping Pu ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/00 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L21/563 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253

摘要： A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

摘要翻译： 提供了具有散热装置的半导体封装和半导体封装的制造方法。 芯片安装在基板上。 散热装置安装在芯片上，并且包括容纳室，以及与容纳室连通的第一开口和第二开口。 在散热装置和衬底之间形成密封剂以封装芯片。 执行切割处理以去除结构的非电气部分并且从密封剂暴露第一和第二开口。 冷却流体容纳在容纳室中以吸收和散发由芯片产生的热量。 散热装置覆盖密封剂和芯片，以为半导体封装提供最大的传热面积。