公开(公告)号：US20130210194A1

公开(公告)日：2013-08-15

申请号：US13749647

申请日：2013-01-24

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu ,  Hung-Fai Stephen Law

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29183 ,  H01L2224/75261 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75283 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2224/95001 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01082 ,  H01L2924/0103

Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.

Abstract translation: 描述静电转印头阵列组件以及将微器件阵列转移和接合到接收衬底的方法。 在一个实施例中，一种方法包括从载体基板拾取微器件阵列，其中静电转印头组件支持静电转印头阵列，使接收基片与微器件阵列接触，将静电转印头 组件将微器件阵列接合到接收衬底，以及将微器件阵列释放到接收衬底上。

公开(公告)号：US20130128585A1

公开(公告)日：2013-05-23

申请号：US13708704

申请日：2012-12-07

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/04 ,  F21V7/00 ,  H01L29/06

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US08426227B1

公开(公告)日：2013-04-23

申请号：US13372245

申请日：2012-02-13

Applicant: Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L21/00

CPC classification number: H01L33/06 ,  F21V7/00 ,  H01L25/0753 ,  H01L27/15 ,  H01L29/0684 ,  H01L33/0079 ,  H01L33/04 ,  H01L33/20 ,  H01L33/28 ,  H01L33/30 ,  H01L2224/95

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract translation: 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

公开(公告)号：US08415767B1

公开(公告)日：2013-04-09

申请号：US13543675

申请日：2012-07-06

Applicant: Dariusz Golda ,  Andreas Bibl

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/06

CPC classification number: B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US09343448B2

公开(公告)日：2016-05-17

申请号：US14860185

申请日：2015-09-21

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/06 ,  H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/42

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L24/29 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/73267 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/92244 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

公开(公告)号：US09263627B2

公开(公告)日：2016-02-16

申请号：US14563763

申请日：2014-12-08

Applicant: LuxVue Technology Corporation

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L21/00 ,  B23P19/00 ,  H01L33/00 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/42 ,  H01L33/62 ,  H01L21/56

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US09252375B2

公开(公告)日：2016-02-02

申请号：US13842925

申请日：2013-03-15

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L51/50 ,  G09G3/006 ,  G09G3/3208 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/32 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L27/1214 ,  H01L27/156 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2401 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/29005 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32237 ,  H01L2224/32503 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75725 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/97 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/053 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0103 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Abstract translation: 描述了显示面板和制造方法。 在一个实施例中，显示基板包括像素区域和非像素区域。 子像素阵列和相应的底电极阵列位于像素区域中。 微型LED器件的阵列结合到底部电极阵列。 形成与微型LED器件的阵列电接触的一个或多个顶部电极层。 在一个实施例中，冗余的一对微型LED器件被结合到底部电极阵列。 在一个实施例中，微型LED器件的阵列被成像以检测不规则。

公开(公告)号：US09240397B2

公开(公告)日：2016-01-19

申请号：US14603960

申请日：2015-01-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L27/12 ,  H01L25/075 ,  H01L33/48 ,  H01L33/44 ,  H01L33/20 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract translation: 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括在堤层内的反射堤岸结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。

公开(公告)号：US09236815B2

公开(公告)日：2016-01-12

申请号：US13710442

申请日：2012-12-10

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H02N13/00 ,  B81C99/00

CPC classification number: H02N13/00 ,  B81C99/002 ,  Y10T279/23

Abstract: Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.

Abstract translation: 描述了合适的单极和双极微器件转移头阵列和从SOI衬底形成的方法。 在一个实施例中，柔性传送头阵列形成在基底基板上并且可朝向基底基板偏转，并且图案化金属层包括金属互连层，金属互连层与柔性传送头阵列中的金属电极阵列电连接。

公开(公告)号：US09214494B2

公开(公告)日：2015-12-15

申请号：US14640979

申请日：2015-03-06

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L27/12 ,  H01L25/075 ,  H01L33/20 ,  H01L33/42 ,  G09G3/32

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。