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860 条记录 (耗时 0.029 秒)

    Chip package and method for forming the same
    81.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号：US08900913B2

    公开(公告)日：2014-12-02

    申请号：US13588898

    申请日：2012-08-17

    申请人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Shen-Yuan Mao ,  Cheng-Chi Peng

    发明人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Shen-Yuan Mao ,  Cheng-Chi Peng

    IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L27/146

    CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2933/0025

    摘要： An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.

    摘要翻译： 本发明的一个实施例提供了一种用于形成芯片封装的方法，其包括：提供具有第一表面和第二表面的衬底，其中在衬底中形成至少一个光电器件; 在所述基板上形成绝缘层; 在所述基板上的所述绝缘层上形成导电层，其中所述导电层电连接到所述至少一个光电器件; 以及在所述基板的第二表面上喷射遮光材料的溶液，以在所述基板的第二表面上形成遮光层。

    Input detection device, input detection method, input detection program, and computer readable media
    82.
    发明授权
    Input detection device, input detection method, input detection program, and computer readable media 有权
    输入检测装置，输入检测方法，输入检测程序和计算机可读介质

    公开(公告)号：US08884894B2

    公开(公告)日：2014-11-11

    申请号：US13241061

    申请日：2011-09-22

    申请人： Yoshikazu Matsui ,  Naoki Sumi ,  Kazuyuki Hashimoto

    发明人： Yoshikazu Matsui ,  Naoki Sumi ,  Kazuyuki Hashimoto

    IPC分类号： G06F3/041 ,  G06F3/044

    CPC分类号： G06F3/044 ,  G06F3/0416

    摘要： An input detection device including: a reading part reading touch inputs from an input interface of a touch sensor by scanning every above two electrode lines which are adjacent on the scanning sequence from an end of the input interface to the opposite end, and acquiring a difference between detection data obtained from a half of the above two electrode lines which are successive and from the other half of the above two electrode lines which are successive; and a calculation part integrating the differences for the entire input interface to obtain touch information, wherein if an integration result obtained in the case where the above two lines stretches over the scanning finish end and the scanning start end is not satisfied with a predetermined value, the calculation part resets the detection data obtained from the electrode line located at the scanning finish end to be the predetermined value.

    摘要翻译： 一种输入检测装置，包括：读取部，从所述输入接口的一端到相对端扫描从扫描序列相邻的上述两条电极线，从触摸传感器的输入接口读取触摸输入， 在从连续的上述两个电极线的一半获得的检测数据和连续的上述两个电极线的另一半之间; 以及积分整个输入界面的差异以获得触摸信息的计算部分，其中如果在上述两条线在扫描结束端和扫描开始端之间延伸的情况下获得的积分结果不满足预定值， 计算部分将从位于扫描完成端的电极线获得的检测数据重置为预定值。

    Lighting apparatus, backlight module and display apparatus
    83.
    发明授权
    Lighting apparatus, backlight module and display apparatus 有权
    照明装置，背光模块和显示装置

    公开(公告)号：US08823261B2

    公开(公告)日：2014-09-02

    申请号：US13542580

    申请日：2012-07-05

    申请人： Tseng-Hung Lin

    发明人： Tseng-Hung Lin

    IPC分类号： F21V7/04

    CPC分类号： G02F1/13471 ,  G02B6/002 ,  G02B6/0021 ,  G02B6/0068

    摘要： A lighting apparatus includes a light-guiding plate and a lighting unit. The light-guiding plate includes a light-incident surface and a light-emitting surface. The lighting unit includes a first light source, a second light source and a circuit board. The first and second light sources are disposed on the circuit board, and the light emitted by the first and second light sources enters into the light-guiding plate through the light-incident surface and exits the light-guiding plate through the light-emitting surface. A first distance from the first light source to a reference line of the light-incident surface is not equal to a second distance from the second light source to the reference line.

    摘要翻译： 照明装置包括导光板和照明单元。 导光板包括光入射表面和发光表面。 照明单元包括第一光源，第二光源和电路板。 第一和第二光源设置在电路板上，由第一和第二光源发射的光通过光入射表面进入导光板，并通过发光表面离开导光板 。 从第一光源到光入射表面的参考线的第一距离不等于从第二光源到参考线的第二距离。

    Chip package and fabrication method thereof
    84.
    发明授权
    Chip package and fabrication method thereof 有权
    芯片封装及其制造方法

    公开(公告)号：US08822325B2

    公开(公告)日：2014-09-02

    申请号：US13958398

    申请日：2013-08-02

    申请人： Xintec Inc.

    发明人： Ching-Yu Ni ,  Chia-Ming Cheng ,  Nan-Chun Lin

    IPC分类号： H01L23/485 ,  H01L21/60

    CPC分类号： H01L23/498 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/06 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer.

    摘要翻译： 根据本发明的实施例提供了芯片封装及其制造方法。 芯片封装包括含有芯片并具有器件面积和外围焊盘区域的半导体衬底。 多个导电焊盘设置在外围接合焊盘区域处，并且钝化层形成在半导体衬底上以露出导电焊盘。 在器件区域的钝化层上形成绝缘保护层。 封装层设置在绝缘保护层上方以在外围接合焊盘区域露出导电焊盘和钝化层。 该方法包括在切割过程中形成绝缘保护层以覆盖多个导电焊盘，并且通过封装层的开口去除导电焊盘上的绝缘保护层。

    High-reflection submount for light-emitting diode package and fabrication method thereof
    89.
    发明授权
    High-reflection submount for light-emitting diode package and fabrication method thereof 有权
    发光二极管封装的高反射基座及其制造方法

    公开(公告)号：US08778707B2

    公开(公告)日：2014-07-15

    申请号：US14024564

    申请日：2013-09-11

    申请人： Xintec Inc.

    发明人： Shang-Yi Wu ,  Chien-Hui Chen

    IPC分类号： H01L21/00

    CPC分类号： H01L33/60 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/73265 ,  H01L2933/0033 ,  H01S5/02236 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A method for fabricating a silicon submount for LED packaging. A silicon substrate is provided. A reflection layer is formed on the silicon substrate. Portions of the reflection layer and the silicon substrate are removed to form openings. A wafer backside grinding process is carried out to thin the silicon substrate thereby turning the openings into through silicon vias. An insulating layer is then deposited to cover the reflection layer and the silicon substrate. A seed layer is formed on the insulating layer. A resist pattern is then formed on the seed layer. A metal layer is formed on the seed layer not covered by the resist pattern. The resist pattern is then stripped. The seed layer not covered by the metal layer is then removed.

    摘要翻译： 一种用于制造用于LED封装的硅基座的方法。 提供硅衬底。 在硅衬底上形成反射层。 去除反射层和硅衬底的部分以形成开口。 进行晶片背面研磨处理以使硅衬底变薄，从而将开口转变成通过硅通孔。 然后沉积绝缘层以覆盖反射层和硅衬底。 种子层形成在绝缘层上。 然后在种子层上形成抗蚀剂图案。 在未被抗蚀剂图案覆盖的种子层上形成金属层。 然后剥离抗蚀剂图案。 然后除去未被金属层覆盖的籽晶层。