公开(公告)号：US20070145606A1

公开(公告)日：2007-06-28

申请号：US11612738

申请日：2006-12-19

申请人： Joachim Mahler ,  Ralf Wombacher ,  Dieter Lachman ,  Bernd Betz ,  Stefan Paulus ,  Edmund Riedl

发明人： Joachim Mahler ,  Ralf Wombacher ,  Dieter Lachman ,  Bernd Betz ,  Stefan Paulus ,  Edmund Riedl

IPC分类号： H01L23/48

CPC分类号： H01L23/296 ,  H01L23/3142 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01037 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.

摘要翻译： 半导体器件包括半导体器件部件，粘合促进器结构和塑料外壳组合物。 半导体器件部件嵌入在塑料外壳组合物中，其中粘合促进剂结构设置在器件部件和壳体组合物之间。 粘合促进剂结构包括第一和第二粘附促进剂层。 第一层包括金属氧化物。 金属氧化物是由氧和有机金属分子构成的反应性化合物的硅酸盐。 第二层包括至少一种聚合物。

公开(公告)号：US07705472B2

公开(公告)日：2010-04-27

申请号：US11612738

申请日：2006-12-19

申请人： Joachim Mahler ,  Ralf Wombacher ,  Dieter Lachman ,  Bernd Betz ,  Stefan Paulus ,  Edmund Riedl

发明人： Joachim Mahler ,  Ralf Wombacher ,  Dieter Lachman ,  Bernd Betz ,  Stefan Paulus ,  Edmund Riedl

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/296 ,  H01L23/3142 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01037 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes semiconductor device components, an adhesion promoter structure and a plastic housing composition. The semiconductor device components are embedded in the plastic housing composition with the adhesion promoter structure being disposed between the device components and the housing composition. The adhesion promoter structure includes first and second adhesion promoter layers. The first layer includes metal oxides. The metal oxides being silicates of a reactive compound composed of oxygen and organometallic molecules. The second layer includes at least one polymer.

摘要翻译： 半导体器件包括半导体器件部件，粘合促进器结构和塑料外壳组合物。 半导体器件部件嵌入在塑料外壳组合物中，其中粘合促进剂结构设置在器件部件和壳体组合物之间。 粘合促进剂结构包括第一和第二粘附促进剂层。 第一层包括金属氧化物。 金属氧化物是由氧和有机金属分子构成的反应性化合物的硅酸盐。 第二层包括至少一种聚合物。

公开(公告)号：US09953952B2

公开(公告)日：2018-04-24

申请号：US12195200

申请日：2008-08-20

申请人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

发明人： Joachim Mahler ,  Michael Juerss ,  Stefan Landau

IPC分类号： H01L23/34 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/564 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/28 ,  H01L24/29 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73204 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/37099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.

公开(公告)号：US09313898B2

公开(公告)日：2016-04-12

申请号：US12275458

申请日：2008-11-21

申请人： Manfred Mengel ,  Joachim Mahler

发明人： Manfred Mengel ,  Joachim Mahler

IPC分类号： C09K19/00 ,  H05K3/28 ,  C08G73/10 ,  C09D179/08

CPC分类号： H05K3/285 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09D179/08 ,  H05K2201/0154 ,  H05K2203/013 ,  Y10T428/1005 ,  Y10T428/1023

摘要： An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low molecular mass polyimide.

摘要翻译： 一种电气部件，其包括基材和与所述基材工作的取向的聚合物层，所述聚合物层包括低分子量聚酰亚胺。

公开(公告)号：US09123764B2

公开(公告)日：2015-09-01

申请号：US13594711

申请日：2012-08-24

申请人： Thomas Behrens ,  Joachim Mahler ,  Ivan Nikitin

发明人： Thomas Behrens ,  Joachim Mahler ,  Ivan Nikitin

IPC分类号： H01L21/30 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L21/67

CPC分类号： H01L21/6836 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/27462 ,  H01L2224/27848 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29318 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T83/0448 ,  H01L2224/27 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/014 ,  H01L2924/00

摘要： A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.

摘要翻译： 公开了一种制造组件的方法。 该方法的一个实施例包括在多个部件中划分载体，载体设置在支撑载体上，在切割之后，将连接层放置在载体上并从支撑载体上移除部件。

公开(公告)号：US08642389B2

公开(公告)日：2014-02-04

申请号：US12536712

申请日：2009-08-06

申请人： Thomas Wowra ,  Joachim Mahler ,  Manfred Mengel

发明人： Thomas Wowra ,  Joachim Mahler ,  Manfred Mengel

IPC分类号： H01L21/00

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/82001 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00

摘要： The method comprises providing multiple chips attached to a first carrier, stretching the first carrier so that the distance between adjacent ones of the multiple chips is increased, and applying a laminate to the multiple chips and the stretched first carrier to form a first workpiece embedding the multiple chips, the first workpiece having a first main face facing the first carrier and a second main face opposite to the first main face.

摘要翻译： 该方法包括提供附接到第一载体的多个芯片，拉伸第一载体，使得多个芯片中的相邻芯片之间的距离增加，以及将多个芯片和拉伸的第一载体施加层压体以形成第一工件， 多个芯片，第一工件具有面向第一托架的第一主面和与第一主面相对的第二主面。

公开(公告)号：US20130256855A1

公开(公告)日：2013-10-03

申请号：US13430726

申请日：2012-03-27

申请人： Joachim Mahler ,  Ralf Wombacher ,  Anton Prueckl

发明人： Joachim Mahler ,  Ralf Wombacher ,  Anton Prueckl

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/52

CPC分类号： H01L23/49575 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49579 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37111 ,  H01L2224/37118 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37164 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92246 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip arrangement is provided, the chip arrangement including: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed over the first chip carrier and electrically insulated from the first chip carrier; and a third chip electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip.

摘要翻译： 提供了芯片布置，芯片布置包括：第一芯片载体; 第二芯片载体; 电连接到第一芯片载体的第一芯片; 第二芯片，设置在所述第一芯片载体上并与所述第一芯片载体电绝缘; 和与第二芯片载体电连接的第三芯片; 其中所述第一芯片和所述第二芯片中的至少一个电连接到所述第三芯片。

公开(公告)号：US20130200502A1

公开(公告)日：2013-08-08

申请号：US13369075

申请日：2012-02-08

申请人： Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

发明人： Ivan Nikitin ,  Stefan Landau ,  Joachim Mahler ,  Alexander Heinrich ,  Ralf Wombacher

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/29 ,  H01L21/78

CPC分类号： H01L21/561 ,  B32B37/203 ,  B32B2305/342 ,  B32B2457/14 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/83001 ,  H01L2224/92244 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/24246

摘要： A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.

摘要翻译： 一种制造半导体器件的方法包括提供转印箔。 多个半导体芯片放置在转印箔上并粘附到转印箔上。 粘附到转印箔上的多个半导体芯片放置在多器件载体上。 施加热量以将转印箔层压在多器件载体上，从而在叠层转印箔和多器件载体之间容纳多个半导体芯片。

公开(公告)号：US20130187259A1

公开(公告)日：2013-07-25

申请号：US13354089

申请日：2012-01-19

申请人： Ivan Nikitin ,  Joachim Mahler

发明人： Ivan Nikitin ,  Joachim Mahler

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/3185 ,  H01L24/32 ,  H01L24/50 ,  H01L24/86 ,  H01L2224/32245 ,  H01L2224/86203 ,  H01L2224/86801 ,  H01L2224/8685 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461

摘要： An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the semiconductor chip. A first conductive member is disposed in a first recess of the dielectric layer. The first conductive member electrically connects the contact element of the semiconductor chip with the conductive layer. A second conductive member is disposed in a second recess of the dielectric layer. The second conductive member electrically connects the conductive layer with the electrical connector.

摘要翻译： 电子设备包括半导体芯片。 接触元件，电连接器和电介质层设置在面向半导体芯片的导电层的第一表面上。 第一导电构件设置在电介质层的第一凹部中。 第一导电构件将半导体芯片的接触元件与导电层电连接。 第二导电构件设置在电介质层的第二凹部中。 第二导电构件将导电层与电连接器电连接。

公开(公告)号：US20130168870A1

公开(公告)日：2013-07-04

申请号：US13340770

申请日：2011-12-30

申请人： Edward Fuergut ,  Joachim Mahler

发明人： Edward Fuergut ,  Joachim Mahler

IPC分类号： H01L21/56 ,  H01L23/522

CPC分类号： H01L23/49517 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/03003 ,  H01L2224/03438 ,  H01L2224/0344 ,  H01L2224/03602 ,  H01L2224/0361 ,  H01L2224/04105 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/05571 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A method for manufacturing an electronic interconnect device is described, the method comprising: providing an electronic members each having one or more electrical contacts on a first member side thereof; providing a carrier having a carrier base and having sets of one or more electrically conductive projections on a surface of the carrier base; attaching the electronic members with the corresponding contacts thereof to the respective set of projections to thereby electrically connect the one or more electrical contacts of the respective chip with the corresponding one or more electrically conductive projections of the respective set; encapsulating exposed portions of the electronic member with an encapsulating material to form an encapsulation.

摘要翻译： 描述了一种用于制造电子互连器件的方法，所述方法包括：在其第一部件侧上提供每个具有一个或多个电触点的电子部件; 提供具有载体基底并且在载体基底的表面上具有一组或多个导电突起的载体; 将具有其相应触点的电子部件附接到相应的一组突起，从而将相应芯片的一个或多个电触点与相应组的相应的一个或多个导电突起电连接; 用封装材料封装电子部件的暴露部分以形成封装。