公开(公告)号：US07007854B2

公开(公告)日：2006-03-07

申请号：US10673451

申请日：2003-09-30

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Isobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： G06K19/06

CPC分类号： G06Q20/042 ,  G07D7/003 ,  G07D7/0047 ,  G07D7/01 ,  G07D7/12 ,  G07D7/2033

摘要： A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from which information can be read cut or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

摘要翻译： 一种检查纸张伪造的方法，该纸张设置有电子电路芯片，从该电子电路芯片可以读取或写入信息并具有可见信息。 该方法包括加密片材的可见信息并将加密的可见信息存储在电子电路芯片中的步骤，以及通过将片材的可见信息与存储在片材中的信息进行比较来区别地确定片材的真实性的步骤 电子电路芯片。

公开(公告)号：US20050194591A1

公开(公告)日：2005-09-08

申请号：US11101577

申请日：2005-04-08

申请人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

发明人： Mitsuo Usami ,  Kazutaka Tsuji ,  Takeshi Saito ,  Akira Sato ,  Kenji Sameshima ,  Kazuo Takaragi ,  Chizuko Yasunobu

IPC分类号： B42D15/00 ,  D21H21/48 ,  G06K7/00 ,  G06K19/073 ,  G06K19/077 ,  H01L21/60 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H01Q1/22

CPC分类号： B42D25/30 ,  B42D25/29 ,  B42D2033/46 ,  D21H21/48 ,  G06K7/0008 ,  G06K19/073 ,  G06K19/07363 ,  G06K19/07372 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H01L21/6835 ,  H01L23/3171 ,  H01L23/49855 ,  H01L23/576 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/2518 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29298 ,  H01L2224/73204 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01Q1/2208 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

摘要翻译： 非接触式识别半导体器件设置有半导体芯片，该半导体芯片包括接收对非接触识别半导体器件的查询的接收电路，存储多个比特的识别信息的存储器和发送识别信息的发送电路。 耦合到所述半导体芯片的天线从所述半导体芯片接收所述识别信息，并将所述识别信息发送到所述非接触式半导体之外。 半导体芯片的长边长度在平面尺寸上不大于0.5mm，并且通过由电子束打印的图案来存储识别信息。

公开(公告)号：US06930401B2

公开(公告)日：2005-08-16

申请号：US10674337

申请日：2003-10-01

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： B42D15/10 ,  G06K7/00 ,  G06K19/04 ,  G06K19/07 ,  G06K19/077 ,  H01L21/50 ,  H01L23/051 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/552 ,  H01L23/64 ,  H01L23/28 ,  H01L23/34

CPC分类号： H01L24/01 ,  G06K7/0008 ,  G06K19/02 ,  G06K19/041 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07786 ,  H01L21/50 ,  H01L23/051 ,  H01L23/08 ,  H01L23/291 ,  H01L23/3107 ,  H01L23/48 ,  H01L23/4827 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/16588 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/83205

摘要： An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

公开(公告)号：US20050134460A1

公开(公告)日：2005-06-23

申请号：US11002083

申请日：2004-12-03

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： B42D15/10 ,  B65D23/00 ,  B65D25/20 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q13/10 ,  H01Q23/00 ,  G08B13/14

CPC分类号： H01Q1/38 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07786 ,  H01L2224/16 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q23/00

摘要： To provide an antenna shape devised to be integrated and compact. The antenna connected to an IC chip that performs wireless identification includes a slit that separates two connection points with respect to the IC chip, in which a length of the slit is approximately 3 millimeters, and a width of the slit is in a range of from 0.8 millimeter to 1.4 millimeters.

摘要翻译： 为了提供一体化和紧凑的天线形状。 连接到执行无线识别的IC芯片的天线包括狭缝，其相对于IC芯片分离两个连接点，其中狭缝的长度为大约3毫米，并且狭缝的宽度在从 0.8毫米至1.4毫米。

公开(公告)号：US06731509B1

公开(公告)日：2004-05-04

申请号：US09856758

申请日：2001-09-14

申请人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

发明人： Chikashi Okamoto ,  Kazuo Takaragi ,  Kazutaka Tsuji ,  Mitsuo Usami ,  Chizuko Yasunobu ,  Asahiko Sobe ,  Yasuhiro Tsunemi ,  Hiroyuki Yagi

IPC分类号： H05K706

CPC分类号： G06K19/07747 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H01L2924/3511 ,  Y10T29/49018 ,  H01L2924/00

摘要： In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

摘要翻译： 在将平面电子电路芯片与另一平面电子元件一起安装在柔性片材上的方法中，选择电子电路部件和另一个电气元件，使得另一个电气元件的平坦表面大于 电子电路芯片，另一个电子元件和电子电路芯片安装在片材上，使得另一个电子元件的平面和电子电路芯片的平面与片材表面平行，并且平面 的电子电路芯片在垂直于片材表面的方向上被容纳在另一电气元件的平面内。

公开(公告)号：US06635968B2

公开(公告)日：2003-10-21

申请号：US09775546

申请日：2001-02-05

申请人： Mitsuo Usami

发明人： Mitsuo Usami

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/49855 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/83191 ,  H01L2924/01019 ,  H01L2924/07811 ,  H01L2924/19041 ,  Y10S257/91 ,  Y10S438/928 ,  H01L2924/00

摘要： A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface are prepared. The first and second members are positioned such that the first and second conductors face each other, and the semiconductor chip is held between the members. In this arrangement, one of the first and second conductors is in electrical contact with the first electrode.

公开(公告)号：US06573158B2

公开(公告)日：2003-06-03

申请号：US09991747

申请日：2001-11-26

申请人： Toshio Miyamoto ,  Kunihiro Tsubosaki ,  Mitsuo Usami

发明人： Toshio Miyamoto ,  Kunihiro Tsubosaki ,  Mitsuo Usami

IPC分类号： H01L2146

CPC分类号： H01L21/6835 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01L23/49855 ,  H01L23/5388 ,  H01L24/27 ,  H01L24/28 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/81903 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/3512

摘要： The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.

公开(公告)号：US06514796B2

公开(公告)日：2003-02-04

申请号：US09729191

申请日：2000-12-05

申请人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Kunihiko Nishi

发明人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Kunihiko Nishi

IPC分类号： H01L2144

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/29 ,  H01L2224/29007 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/19043 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor chip (105′) and a substrate (102) are bonded with an organic adhesive layer (409) containing conductive particles (406), and a pad (405) and an electrode (412) are mutually, electrically connected through the conductive particles (406). The semiconductor chip (105′) is formed by contacting a semiconductor wafer (105) attached to a tape (107) with an etchant while rotating the semiconductor wafer (105) within an in-plane direction at a high speed or reciprocating the wafer (105) laterally to uniformly etch the semiconductor wafer (105) thereby reducing the thickness thereof, and dicing the thus reduced wafer. The resultant thin chip (105′) is hot-pressed by means of a heating head (106) for bonding on the substrate (102). In this way, a thin semiconductor chip can be formed stably at low costs and bonded on a substrate without causing any crack of the chip, thereby obtaining a semiconductor device which is unlikely to break owing to the bending stress from outside.

摘要翻译： 半导体芯片（105'）和基板（102）与包含导电颗粒（406）的有机粘合剂层（409）接合，并且焊盘（405）和电极（412）相互电连接，通过导电 颗粒（406）。半导体芯片（105'）通过使附接到带（107）的半导体晶片（105）与蚀刻剂接触而形成，同时以高速在平面内方向上旋转半导体晶片（105） 或者使晶片（105）横向往复移动以均匀蚀刻半导体晶片（105），从而减小其厚度，并切割由此减小的晶片。 所得到的薄片（105'）通过加热头（106）进行热压，用于在基板（102）上接合，以这种方式，可以以低成本稳定地形成薄的半导体芯片，并结合到基板 而不会引起芯片的任何裂纹，从而获得由于来自外部的弯曲应力而不可能破裂的半导体器件。

公开(公告)号：US06486541B2

公开(公告)日：2002-11-26

申请号：US09953913

申请日：2001-09-18

申请人： Mitsuo Usami ,  Takashi Tase

发明人： Mitsuo Usami ,  Takashi Tase

IPC分类号： H01L2302

CPC分类号： G06K19/07728 ,  G06K19/077 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/5388 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599

摘要： A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method for fabricating the thin-film semi-conductor device is also disclosed, in which a thin-film semiconductor circuit is formed on a silicon-on-insulator wafer, the silicon substrate on the reverse side of the silicon-on-insulator wafer is etched off, a thin-film semiconductor chip is formed and attached to the of substrate, and the thin-film semiconductor chip and the substrate are wired to each other by printing.

摘要翻译： 公开了至少包括半导体元件和布线的薄膜半导体器件。 在半导体元件的下表面上形成保护性绝缘材料的薄膜，并且在薄膜的下表面上接合基板。 还公开了一种用于制造薄膜半导体器件的方法，其中在绝缘体上硅晶片上形成薄膜半导体电路，在硅绝缘体晶片的背面上的硅衬底 被蚀刻掉，形成薄膜半导体芯片并将其附着于基板，并且通过印刷使薄膜半导体芯片和基板彼此连接。

公开(公告)号：US5986341A

公开(公告)日：1999-11-16

申请号：US930083

申请日：1998-02-09

申请人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Masaru Miyazaki

发明人： Mitsuo Usami ,  Kunihiro Tsubosaki ,  Masaru Miyazaki

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/822 ,  H01L23/498 ,  H01L23/538 ,  H01L25/04 ,  H01L25/18 ,  H01L27/04 ,  H01L23/34

CPC分类号： G06K19/07728 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  H01L23/49855 ,  H01L23/5388 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3511

摘要： A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are extremely thin, the resulting semiconductor device is highly resistant to bending and highly reliable at a low cost.

摘要翻译： PCT No.PCT / JP96 / 01264 Sec。 371日期：1998年2月9日 102（e）1998年2月9日PCT PCT 1996年5月14日PCT公布。 公开号WO96 / 36496 日期：1996年11月21日在上盖板和下盖板之间放置冷凝器，线圈和薄壁集成电路，并且将粘合剂填充到它们之间的空间中，由此制造卡片。 由于冷凝器，线圈和薄型集成电路非常薄，因此所得到的半导体器件以低成本高度耐弯曲和高可靠性。