公开(公告)号：US10062511B1

公开(公告)日：2018-08-28

申请号：US15812198

申请日：2017-11-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12 ,  H05K1/11 ,  H05K1/18 ,  H01G4/012 ,  H01G4/248

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: A multilayer electronic component includes a capacitor body with first and second external electrodes on a mounting surface of the capacitor body. First and second connection terminals include insulators and are respectively connected to the first and second external electrodes. The first connection terminal includes first to third conductive patterns and a first cut portion a side surface. The second connection terminal includes fourth to sixth conductive patterns and a second cut portion in a side surface.

公开(公告)号：US09773761B2

公开(公告)日：2017-09-26

申请号：US14903858

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L33/62 ,  H01L25/075 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

公开(公告)号：US20160172339A1

公开(公告)日：2016-06-16

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

Abstract translation: 提供了使用纳米级LED电极组件的LED灯。 使用纳米级LED电极组件的LED灯可以解决限制，其中当根据现有技术的纳米级LED器件立起并且三维耦合到电极时，难以允许纳米级 LED装置站起来，并且当纳米尺度的LED装置与一对一耦合对应于彼此不同的电极时，产品质量劣化。 因此，具有纳米单元的纳米级LED器件可以连接到彼此不同的两个电极而不引起缺陷，并且由于连接到电极的纳米级LED器件的方向性，可以提高光提取效率。 此外，由于LED灯中设置的纳米级LED的一部分的缺陷导致的LED灯的功能劣化可以最小化，并且LED灯可以通过使用纳米级LED电极而具有柔性的结构和形状 其组件根据LED灯的使用目的或位置可变形。

公开(公告)号：US09064634B2

公开(公告)日：2015-06-23

申请号：US13817964

申请日：2011-08-23

Applicant: Tatsuya Nakamura

Inventor： Tatsuya Nakamura

IPC: H05K7/14 ,  H01L23/48 ,  H01G4/248 ,  H01G4/228 ,  H01G2/10 ,  H01R3/00 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01G2/10 ,  H01G2/06 ,  H01G9/08 ,  H01G9/12 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract translation: 一种电容器保持器，包括形成为能够安装电容器的尖端的形状的主体部分; 以及引导部，其固定到主体部并且可以被焊接到预定的配合位置。 主体部分具有露出电容器的前端的开口，以及当电容器的前端装配到电容器的前端时与端子表面抵接部分邻接电容器的顶端表面 身体部位。 引线部分相对于参考平面固定在与电容器相对的位置处的主体部分，该基准面是包括抵靠端表面抵接部分的电容器的末端表面的平面。

公开(公告)号：US20150092373A1

公开(公告)日：2015-04-02

申请号：US14043970

申请日：2013-10-02

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： Alex CHAN ,  Paul J. BROWN

IPC: H05K1/11 ,  H05K13/04 ,  G06F17/50

CPC classification number: H05K1/111 ,  G06F17/5077 ,  H05K1/112 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/282 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49144

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) comprising a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern; through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads; a solder mask covering the via pad with an opening; a solder pad within said opening electrically connected to said via pad; and a two-lead component attached to said solder pad.

Abstract translation: 各种示例性实施例涉及一种印刷电路板（PCB），其包括以栅格图案布置的PCB一侧上的BGA焊盘的球栅阵列（BGA）; 通孔通孔，包括通孔焊盘，布置成电连接到所述BGA焊盘的所述栅格图案; 覆盖通孔垫的开口的焊接掩模; 所述开口内的焊盘，电连接到所述通孔焊盘; 以及连接到所述焊盘的双引线部件。

公开(公告)号：US08646963B2

公开(公告)日：2014-02-11

申请号：US13603096

申请日：2012-09-04

Applicant: Kyong Jun Kim

Inventor： Kyong Jun Kim

IPC: F21V7/04

CPC classification number: F21V23/00 ,  F21K9/00 ,  G02B6/0031 ,  G02B6/0068 ,  G02B6/0083 ,  G02B6/0085 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/3426 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/2009 ,  H05K2203/0577 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.

Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。

公开(公告)号：US20130134136A1

公开(公告)日：2013-05-30

申请号：US13332389

申请日：2011-12-21

Applicant: GUAN-NAN REN

Inventor： GUAN-NAN REN

IPC: B23K3/02

CPC classification number: B23K3/0473 ,  B23K1/0016 ,  B23K3/0338 ,  B23K3/0476 ,  B23K2101/42 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10393 ,  H05K2201/10651 ,  Y02P70/613

Abstract: An electric soldering iron head includes a heat-conducting pipe, a connecting member mounted to the heat-conducting pipe, a first heating block extending down from the connecting member, a second heating block slidably attached to the connecting member, and an operation member rotatably installed in the connecting member. The operation member includes a gear. The first heating block includes a first clamping portion. The second heating block includes a gear rack meshing with the gear and a second clamping portion facing the first clamping portion. When the operation member is operated to rotate, the gear drives the gear rack to slide, the second clamping portion slides toward or away from the first clamping portion.

Abstract translation: 电烙铁头包括导热管，安装在导热管上的连接构件，从连接构件向下延伸的第一加热块，可滑动地安装在连接构件上的第二加热块，以及可旋转地 安装在连接件上。 操作构件包括齿轮。 第一加热块包括第一夹紧部分。 第二加热块包括与齿轮啮合的齿条和面向第一夹紧部的第二夹紧部。 当操作构件旋转时，齿轮驱动齿条滑动，第二夹紧部分向着或远离第一夹紧部分滑动。

公开(公告)号：US08259460B2

公开(公告)日：2012-09-04

申请号：US12303572

申请日：2007-06-05

Applicant: Rabin Bhattacharya ,  Pieter Jacob Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger ,  Martijn Krans ,  Sima Asvadi ,  Alexander Ulrich Douglas ,  Jacqueline Van Driel ,  Martinus Jacobus Johannes Hack

Inventor： Rabin Bhattacharya ,  Pieter Jacob Snijder ,  Liesbeth Van Pieterson ,  Erich Zainzinger ,  Martijn Krans ,  Sima Asvadi ,  Alexander Ulrich Douglas ,  Jacqueline Van Driel ,  Martinus Jacobus Johannes Hack

IPC: H05K7/02 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

公开(公告)号：US08254146B2

公开(公告)日：2012-08-28

申请号：US12684977

申请日：2010-01-11

Applicant: Chung-Wei Kuo ,  Chien-Jung Wu ,  Ming-Chuan Lee

Inventor： Chung-Wei Kuo ,  Chien-Jung Wu ,  Ming-Chuan Lee

IPC: H05K7/02

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K2201/10015 ,  H05K2201/10325 ,  H05K2201/10651 ,  Y10T29/49142 ,  Y10T29/49149

Abstract: A capacitor seat and two conductors are utilized to install a capacitor seat on a PCB by soldering the two conductors on electrical contacts of the PCB. The capacitor is installed on the capacitor seat in a fastening way such as by pressing downward, rotating the capacitor or in other feasible fastening ways to be electrically connected with the electrical contacts on the PCB. If the detachable capacitor device has errors or is damaged in use, or a user wants to replace it with a different type of the capacitors to test or adjust the characteristic of the circuit, it is easy to replace the capacitor.

Abstract translation: 电容器座和两个导体用于通过将两个导体焊接在PCB的电触点上来在PCB上安装电容器座。 电容器以紧固方式安装在电容器座上，例如通过向下按压，旋转电容器或以其它可行的紧固方式与PCB上的电触点电连接。 如果可拆卸电容器件有错误或使用中损坏，或者用户想要用不同类型的电容器来替换电容器来测试或调整电路的特性，则容易更换电容器。

公开(公告)号：US08208269B2

公开(公告)日：2012-06-26

申请号：US12822795

申请日：2010-06-24

Applicant: Ming-Tang Yang ,  Wei-Kai Hsiao

Inventor： Ming-Tang Yang ,  Wei-Kai Hsiao

IPC: H05K7/00 ,  H01K1/00

CPC classification number: H05K3/301 ,  H05K3/306 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/2027

Abstract: A composite structure includes an electronic component and a supporting member. The electronic component includes a main body and a plurality of pins extended outwardly from the main body. The supporting member includes a first supporting part and a second supporting part. The first supporting part is foldable with respect to the second supporting part. The main body of the electronic component is accommodated within the first supporting part of the supporting member. The pins are accommodated with the second supporting part of the supporting member. The first supporting part is folded with respect to the second supporting part such that the pins are bent to define a bent structure.

Abstract translation: 复合结构包括电子部件和支撑部件。 电子部件包括主体和从主体向外延伸的多个销。 支撑构件包括第一支撑部和第二支撑部。 第一支撑部分可相对于第二支撑部折叠。 电子部件的主体容纳在支撑部件的第一支撑部内。 销支撑在支撑构件的第二支撑部分上。 第一支撑部分相对于第二支撑部分折叠，使得销弯曲以限定弯曲结构。