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1.发明申请DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF 有权用于电路和多层电路的电介质粘合剂及其制造方法公开(公告)号：US20110214906A1
公开(公告)日：2011-09-08
申请号：US13040532
申请日：2011-03-04
CPC分类号： H05K1/119 , B05D5/12 , B32B27/04 , B32B27/38 , B32B37/00 , B44C1/17 , H05K1/00 , H05K1/09 , H05K1/11 , H05K3/386 , Y10T156/1089 , Y10T428/24942 , Y10T428/2495 , Y10T428/2826
摘要： A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
摘要翻译： 一种粘合层，包括包含热固性组合物和填料组合物的第一外层; 第二外层，其包含与第一外层相同类型的热固性组合物和填料组合物; 以及设置在第一和第二外层之间的中间层，并且包括热固性组合物和与第一和第二外层具有相同类型的填料组合物，其中中间层的热固性组合物具有固化度 其大于第一和第二外层的每种热固性组合物的固化程度。
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2.发明申请公开(公告)号：US20100307803A1
公开(公告)日：2010-12-09
申请号：US12813556
申请日：2010-08-23
申请人： Sankar Paul , Scott D. Kennedy , Dirk M. Baars
发明人： Sankar Paul , Scott D. Kennedy , Dirk M. Baars
IPC分类号： H05K1/09 , C08L9/00 , C08K3/22 , C08K3/38 , C08K3/28 , C08L53/00 , B32B37/14 , H05K1/00 , H05K1/11
CPC分类号： H05K3/4626 , B32B3/04 , B32B3/08 , B32B3/18 , B32B3/30 , B32B5/08 , B32B5/16 , B32B5/30 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/14 , B32B15/16 , B32B15/20 , B32B25/08 , B32B25/14 , B32B27/08 , B32B27/12 , B32B27/14 , B32B27/20 , B32B27/26 , B32B27/285 , B32B27/302 , B32B27/32 , B32B27/38 , B32B2255/10 , B32B2255/205 , B32B2260/025 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/14 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2264/12 , B32B2270/00 , B32B2307/202 , B32B2307/204 , B32B2307/30 , B32B2307/302 , B32B2307/3065 , B32B2307/308 , B32B2307/7265 , B32B2457/00 , B32B2457/08 , C08G65/485 , C08K3/013 , C08L9/00 , C08L13/00 , C08L15/00 , C08L19/006 , C08L51/04 , C08L71/12 , C08L71/126 , C08L2666/08 , C08L2666/14 , C09J107/00 , C09J113/00 , C09J171/12 , H05K1/0393 , H05K3/00 , H05K3/462 , H05K3/4641 , H05K3/4676 , H05K2201/0133 , H05K2201/0158 , H05K2201/0355 , H05K2201/10378 , Y10T156/10 , Y10T428/24802 , Y10T428/263 , Y10T428/31544 , Y10T428/31931 , C08L2666/04
摘要： A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.
摘要翻译： 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。
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3.发明申请公开(公告)号：US20100015404A1
公开(公告)日：2010-01-21
申请号：US12504996
申请日：2009-07-17
CPC分类号： H05K1/0373 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , Y10T156/10 , Y10T428/24612 , Y10T428/24917 , Y10T428/249994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257
摘要： A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
摘要翻译： 一种电路基板层叠体，包括导电金属层; 介电复合材料的介电常数小于约3.5，损耗因数小于约0.006，其中介电复合材料包括聚合物树脂; 和约10至约70体积％的三氧化二铁含量小于或等于3重量％。
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公开(公告)号：US6132668A
公开(公告)日：2000-10-17
申请号：US615988
申请日：1990-11-20
IPC分类号： B29C47/00 , B29C47/14 , B29C47/20 , B29C55/00 , B29C55/12 , B29C55/28 , C08G73/22 , C08G75/32
CPC分类号： B29C55/005 , B29C47/0021 , B29C47/0026 , B29C47/14 , B29C47/24 , B29C47/8805 , B29C47/8895 , B29C55/12 , B29K2105/0079
摘要： This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics. A preferred ordered polymer for use in the present invention is poly (para-phenylenebenzo bisthiazole), (PBT), a compound having the structure: ##STR1## The present invention is also directed to methods and apparatus suitable for producing biaxially oriented films, coatings, and like materials from ordered polymers, preferably PBT.
摘要翻译： 本发明一般涉及形成具有双轴分子取向的厚膜。 这种膜根据本发明由棒状延伸链芳族 - 杂环有序聚合物制备。 这种膜具有高拉伸强度，模量和耐环境特性。 用于本发明的优选的有序聚合物是聚（对亚苯基苯基双噻唑），（PBT），具有以下结构的化合物：本发明还涉及适用于生产双轴取向膜，涂层等的方法和设备 有序聚合物的材料，优选PBT。
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公开(公告)号：US4973442A
公开(公告)日：1990-11-27
申请号：US98710
申请日：1987-09-21
CPC分类号： B29C47/8895 , B29C47/0021 , B29C47/0026 , B29C47/14 , B29C47/24 , B29C47/32 , B29C55/005 , B29C55/12 , B29C67/24 , B29C47/0016 , B29C47/0023 , B29K2079/00 , B29K2081/00 , B29K2105/0079 , Y10T428/2967 , Y10T428/31
摘要： This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics. A preferred ordered polymer for use in the present invention is poly (para--phenylenebenzo bisthiazole), (PBT), a compound having the structure: ##STR1## The present invention is also directed to methods and apparatus suitable for producing biaxially oriented films, coatings, and like materials from ordered polymers, preferably PBT.
摘要翻译： 本发明一般涉及形成具有双轴分子取向的厚膜。 这种膜根据本发明由棒状延伸链芳族 - 杂环有序聚合物制备。 这种膜具有高拉伸强度，模量和耐环境特性。 用于本发明的优选的有序聚合物是聚（对亚苯基苯基双噻唑）（PBT），具有以下结构的化合物：本发明还涉及适用于生产双轴取向膜，涂层的方法和装置 和类似的有序聚合物的材料，优选PBT。
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公开(公告)号：US4939235A
公开(公告)日：1990-07-03
申请号：US203329
申请日：1988-06-07
IPC分类号： B29C49/08 , B29C47/00 , B29C47/14 , B29C55/00 , B29C55/12 , B29C55/26 , B29C55/28 , B29K81/00 , B29L7/00 , B29L22/00 , C08G75/00 , C08G75/02 , C08G75/32 , C08J5/18
CPC分类号： C08J5/18 , B29C47/0021 , B29C47/14 , B29C47/8895 , B29C55/005 , B29C55/12 , C08G75/32 , B29C47/0026 , B29K2105/0079 , C08J2379/06
摘要： This invention relates in general to the formation of thick films having a biaxial molecular orientation. Such films are prepared in accordance with the present invention from rod-like extended chain aromatic-heterocyclic ordered polymers. Such films have high tensile strength, modulus, and environmental resistance characteristics.A preferred ordered polymer for use in the present invention is poly (para - phenylenebenzo bisthiazole), (PBT), a compound having the structure: ##STR1## The present invention is also directed to methods and apparatus suitable for producing biaxially oriented films, coatings, and like materials from ordered polymers, preferably PBT.
摘要翻译： 本发明一般涉及形成具有双轴分子取向的厚膜。 这种膜根据本发明由棒状延伸链芳族 - 杂环有序聚合物制备。 这种膜具有高拉伸强度，模量和耐环境特性。 用于本发明的优选的有序聚合物是聚（对 - 亚苯基苯基双噻唑）（PBT），具有以下结构的化合物：本发明还涉及适用于生产双轴取向膜，涂层的方法和设备 和类似的有序聚合物的材料，优选PBT。
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7.发明授权Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof 有权用于电路和多层电路的介电键层及其制造方法公开(公告)号：US08809690B2
公开(公告)日：2014-08-19
申请号：US13040532
申请日：2011-03-04
IPC分类号： H05K1/00
CPC分类号： H05K1/119 , B05D5/12 , B32B27/04 , B32B27/38 , B32B37/00 , B44C1/17 , H05K1/00 , H05K1/09 , H05K1/11 , H05K3/386 , Y10T156/1089 , Y10T428/24942 , Y10T428/2495 , Y10T428/2826
摘要： A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.
摘要翻译： 一种粘合层，包括包含热固性组合物和填料组合物的第一外层; 第二外层，其包含与第一外层相同类型的热固性组合物和填料组合物; 以及设置在第一和第二外层之间的中间层，并且包括热固性组合物和与第一和第二外层具有相同类型的填料组合物，其中中间层的热固性组合物具有固化度 其大于第一和第二外层的每种热固性组合物的固化程度。
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8.发明授权Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom 有权具有改进粘结的电路材料，其制造方法和由其形成的制品公开(公告)号：US08519273B2
公开(公告)日：2013-08-27
申请号：US12937018
申请日：2009-02-13
申请人： Sankar Paul , Dirk M. Baars
发明人： Sankar Paul , Dirk M. Baars
IPC分类号： H05K1/00
CPC分类号： H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
摘要： A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
摘要翻译： 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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9.发明授权公开(公告)号：US08187696B2
公开(公告)日：2012-05-29
申请号：US12504996
申请日：2009-07-17
IPC分类号： B32B15/00
CPC分类号： H05K1/0373 , H05K2201/015 , H05K2201/0158 , H05K2201/0209 , Y10T156/10 , Y10T428/24612 , Y10T428/24917 , Y10T428/249994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257
摘要： A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
摘要翻译： 一种电路基板层叠体，包括导电金属层; 介电复合材料的介电常数小于约3.5，损耗因数小于约0.006，其中介电复合材料包括聚合物树脂; 和约10至约70体积％的三氧化二铁含量小于或等于3重量％的空心微球。
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10.发明申请CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM 有权具有改进粘合剂的电路材料，其制造方法及其形成的制品公开(公告)号：US20090191387A1
公开(公告)日：2009-07-30
申请号：US12370806
申请日：2009-02-13
申请人： Sankar Paul , Dirk M. Baars
发明人： Sankar Paul , Dirk M. Baars
CPC分类号： H05K1/0373 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/285 , B32B27/32 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2262/0276 , B32B2264/0278 , B32B2307/204 , B32B2307/302 , B32B2307/3065 , B32B2307/50 , B32B2307/54 , B32B2307/714 , B32B2307/7265 , B32B2307/734 , B32B2457/00 , C08K3/22 , C08L15/00 , C08L19/006 , C08L71/12 , C08L2666/14 , C09D5/24 , C09D7/61 , C09J107/00 , C12Q1/6886 , C12Q2600/154 , C12Q2600/156 , H05K1/032 , H05K3/386 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/122 , Y10T156/10 , Y10T428/24802 , Y10T428/2804 , Y10T428/31826 , Y10T428/31833 , Y10T428/31855 , Y10T428/31909 , Y10T428/31924 , Y10T428/31931 , Y10T428/31938 , C08L2666/08
摘要： A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.
摘要翻译： 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。
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