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    Epoxy foam
    3.
    发明授权
    Epoxy foam 失效
    环氧泡沫

    公开(公告)号：US4546118A

    公开(公告)日：1985-10-08

    申请号：US662589

    申请日：1984-10-19

    申请人： Scott S. Simpson ,  Anthony Yeznach ,  Carlos L. Barton

    发明人： Scott S. Simpson ,  Anthony Yeznach ,  Carlos L. Barton

    IPC分类号： C08J9/30

    CPC分类号： C08J9/30 ,  C08J2363/00

    摘要： An epoxy foam product is presented which is produced by frothing in an intensive mixer an epoxy functional reactant stream and a curing agent stream in the presence of a surfactant and gaseous frothing agent. The epoxy foam product is characterized as a strong, rigid low-density foam having a fine, uniform cell size.

    摘要翻译： 提出了一种环氧发泡产品，其通过在密集混合器中发泡，在表面活性剂和气体发泡剂存在下，通过环氧官能反应物流和固化剂料流产生。 环氧泡沫产品的特征在于具有细小，均匀的泡孔尺寸的坚固的刚性低密度泡沫。

    Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
    5.
    发明授权
    Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom 失效
    用于制造具有动态弯曲区域的多层电路和由其制成的柔性电路的方法

    公开(公告)号：US4812213A

    公开(公告)日：1989-03-14

    申请号：US190890

    申请日：1988-05-06

    申请人： Carlos L. Barton ,  Adrienne Lindsay ,  Samuel W. Henson

    发明人： Carlos L. Barton ,  Adrienne Lindsay ,  Samuel W. Henson

    IPC分类号： C25D7/00 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/28 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  C25D5/02 ,  C25D5/56

    CPC分类号： H05K3/4691 ,  H05K3/427 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2203/1394 ,  H05K3/0094 ,  H05K3/022 ,  H05K3/064 ,  H05K3/108 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4076 ,  H05K3/426

    摘要： A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which has no exposed adhesive. The flexible circuit is made by providing through-holes to a standard single sided laminate. Next, conductive material is vacuum deposited (e.g. sputtered or evaporated) into the through-holes and at the same time a conductive seed-layer is deposited on the polymer side of the standard laminate. Plating resist is applied to both sides of the material and the seed-layer side of the material is patterned such that circuit traces, pads, and through-holes can be electroplated with additional copper. The plating resist is stripped and the very thin layer of copper in the non-conductive areas is flash etched to produce semi-additive circuit features on the seed-layer side. Etch resist is then applied to both sides of the material and circuit patterns fabricated on the foil-side of the material using standard substractive processing techniques. A cover film coated with adhesive is then provided over the exposed circuit patterns.

    摘要翻译： 提出了一种多层通孔接触柔性电路及其制造方法，其具有在弯曲区域中严格对称的层状结构; 并且没有暴露的粘合剂。 柔性电路通过向标准单面层压板提供通孔而制成。 接下来，将导电材料真空沉积（例如溅射或蒸发）到通孔中，同时将导电种子层沉积在标准层压体的聚合物侧上。 将电镀抗蚀剂施加到材料的两侧，并且材料的种子层侧被图案化，使得电路迹线，焊盘和通孔可以用额外的铜电镀。 电镀抗蚀剂被剥离，并且非导电区域中的非常薄的铜层被闪蒸蚀刻以在种子层侧产生半添加电路特征。 然后使用标准的减法处理技术将蚀刻抗蚀剂施加到在材料的箔侧上制造的材料和电路图案的两侧。 然后在暴露的电路图案上提供涂有粘合剂的覆盖膜。

    Method for metallizing fluoropolymer substrates
    10.
    发明授权
    Method for metallizing fluoropolymer substrates 失效
    氟聚合物基材金属化方法

    公开(公告)号：US5413687A

    公开(公告)日：1995-05-09

    申请号：US799447

    申请日：1991-11-27

    申请人： Carlos L. Barton ,  Robert B. McGraw

    发明人： Carlos L. Barton ,  Robert B. McGraw

    IPC分类号： C23C14/20 ,  C23C14/34

    CPC分类号： C23C14/205

    摘要： In accordance with the present invention, it has been discovered that bias sputtering a metal layer (e.g., copper or aluminum) in an atmosphere of a mixture of ammonia and a noble gas leads to dramatically improved adhesion between deposited metal and a fluoropolymer substrate. Preferably, the bias sputtering takes place in an ammonia/argon gas mixture and most preferably in ammonia/argon gas mixture of 5 to 50 volume % ammonia and 50 to 95 volume % argon (most preferably 90/10 argon/ammonia). The use of an ammonia/noble gas atmosphere for bias sputtering is especially well suited for bias sputtering of copper seed layers onto fluoropolymer substrates. In general, the process for depositing a metal layer onto a surface of a fluoropolymer substrate in accordance with the present invention includes the steps of securing the fluoropolymer substrate to an electrically isolated conductive member (e.g. drum) within a vacuum chamber, evacuating the chamber, introducing a flow of a gas mixture of ammonia and a noble gas (preferably argon) through the chamber and bias sputtering a metal (preferably copper) onto the surface of the fluoropolymer substrate while maintaining the flow of the ammonia/noble gas mixture. Preferably, an ammonia plasma pretreatment of the substrate is also used. Also, the drum is preferably rotated during the ammonia plasma pretreatment.

    摘要翻译： 根据本发明，已经发现在氨和惰性气体的混合气氛中偏压溅射金属层（例如铜或铝）导致沉积金属和含氟聚合物基底之间的粘附性显着提高。 优选地，偏压溅射在氨/氩气混合物中进行，最优选在5至50体积％氨和50至95体积％氩（最优选90/10氩/氨）的氨/氩气混合物中进行。 使用氨/惰性气体气氛进行偏置溅射特别适用于将铜种子层偏压溅射到含氟聚合物基材上。 通常，根据本发明的在含氟聚合物基材的表面上沉积金属层的方法包括以下步骤：将氟聚合物基材固定在真空室内的电隔离导电部件（例如鼓）上，抽空该室， 通过室引入氨和惰性气体（优选氩气）的气体混合物的流动，并且在保持氨/惰性气体混合物的流动的同时将金属（优选铜）溅射到氟聚合物基材的表面上。 优选地，还使用基板的氨等离子体预处理。 此外，优选在氨等离子体预处理期间使滚筒旋转。