公开(公告)号：US5497545A

公开(公告)日：1996-03-12

申请号：US34372

申请日：1993-03-18

申请人： Ryuji Watanabe ,  Osamu Miura ,  Kunio Miyazaki ,  Yukio Ookoshi ,  Akio Takahashi

发明人： Ryuji Watanabe ,  Osamu Miura ,  Kunio Miyazaki ,  Yukio Ookoshi ,  Akio Takahashi

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/58 ,  H01L23/12 ,  H01L23/538 ,  H01R12/51 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36 ,  H01R9/09

CPC分类号： H05K3/4046 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5384 ,  H01L23/5385 ,  H01R12/523 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K3/328 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49151

摘要： A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.

摘要翻译： 一种多层布线组件，包括一层绝缘层，例如 的聚酰亚胺，与布线图案交替，通常为铜。 为了建立电路图案，连续的布线图案通过金属螺柱连接在预定位置处通过中间绝缘层彼此连接。 通过将螺柱通过上面的绝缘层的通孔将螺柱线接合到下面的布线图案上，并且然后冲压引线接合的螺柱的暴露的端部以使其与 最上面的布线图案。 例如， 的Au与底层导体形成牢固的结合，并且使用引线接合机快速地应用于自动化过程中。

公开(公告)号：US06326561B1

公开(公告)日：2001-12-04

申请号：US08675069

申请日：1996-07-03

申请人： Ryuji Watanabe ,  Takeyuki Itabashi ,  Osamu Miura ,  Akio Takahashi ,  Yukio Ookoshi ,  Hitoshi Suzuki ,  Masahiro Suzuki ,  Tsutomu Imai

发明人： Ryuji Watanabe ,  Takeyuki Itabashi ,  Osamu Miura ,  Akio Takahashi ,  Yukio Ookoshi ,  Hitoshi Suzuki ,  Masahiro Suzuki ,  Tsutomu Imai

IPC分类号： H01R909

CPC分类号： H01L23/49861 ,  H01L21/486 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/422 ,  H05K3/467 ,  H05K2203/0554 ,  Y10T156/1052 ,  Y10T156/1093

摘要： A thin-film multilayer wiring board with first and second metallic wiring layers formed on a substrate and an organic insulating layer interposed between the metallic wiring layers. The insulating layer has the first metallic wiring layer and via holes in a thickness of the insulating layer. The lands of the first and second metallic wiring layers are electrically connected by via studs which are made of a conductive metal filled in the via holes.

摘要翻译： 一种薄膜多层布线板，其具有形成在基板上的第一和第二金属布线层以及置于金属布线层之间的有机绝缘层。 绝缘层具有第一金属布线层和绝缘层厚度的通孔。 第一和第二金属布线层的焊盘通过由填充在通孔中的导电金属制成的通孔螺栓电连接。

公开(公告)号：US06190493B1

公开(公告)日：2001-02-20

申请号：US08975172

申请日：1997-11-20

申请人： Ryuji Watanabe ,  Takeyuki Itabashi ,  Osamu Miura ,  Akio Takahashi ,  Yukio Ookoshi ,  Hitoshi Suzuki ,  Masahiro Suzuki ,  Tsutomu Imai

发明人： Ryuji Watanabe ,  Takeyuki Itabashi ,  Osamu Miura ,  Akio Takahashi ,  Yukio Ookoshi ,  Hitoshi Suzuki ,  Masahiro Suzuki ,  Tsutomu Imai

IPC分类号： H05K300

CPC分类号： H01L23/49861 ,  H01L21/486 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/422 ,  H05K3/467 ,  H05K2203/0554 ,  Y10T156/1052 ,  Y10T156/1093

摘要： A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5° or less, can provide a high wiring density and signal transmission performance.

摘要翻译： 一种薄膜多层布线板，包括形成在基板上的第一和第二金属布线层，其中介于金属布线层之间的有机绝缘层，其中第一和第二金属布线层的焊盘通过螺柱电连接 通过无电镀形成的导电金属填料，并且每个通孔螺柱的顶端直径和底部直径之间的差异为10％或更小，或绝缘层和每个通孔螺柱之间的界面的锥度形成的角度 相对于其轴线为5°以下，可以提供高的布线密度和信号传输性能。

公开(公告)号：US5768108A

公开(公告)日：1998-06-16

申请号：US720028

申请日：1996-09-27

申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

公开(公告)号：US5350886A

公开(公告)日：1994-09-27

申请号：US659672

申请日：1991-02-25

申请人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

发明人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

IPC分类号： H01L23/538 ,  H05K1/03 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L23/5385 ,  H05K3/462 ,  H05K3/4629 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0379 ,  H05K2203/061

摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

摘要翻译： 一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与 该单元的表面导电层的那个。

公开(公告)号：US5565706A

公开(公告)日：1996-10-15

申请号：US407081

申请日：1995-03-20

申请人： Osamu Miura ,  Akio Takahashi ,  Takao Miwa ,  Masahiro Suzuki ,  Ryuji Watanabe ,  Junichi Katagiri ,  Yoichi Daiko ,  Tsutomu Imai ,  Haruo Akahoshi

发明人： Osamu Miura ,  Akio Takahashi ,  Takao Miwa ,  Masahiro Suzuki ,  Ryuji Watanabe ,  Junichi Katagiri ,  Yoichi Daiko ,  Tsutomu Imai ,  Haruo Akahoshi

IPC分类号： H01L23/13 ,  H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/13 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate on which memory LSIs and a logic LSI with only elements formed without multilayer wiring are mounted, a multilayer wiring layer insuring signal transfer of the LSIs is formed, providing a thin package board.

摘要翻译： 提供了一种用于通用大型计算机和高速处理器的薄型和高密度封装板。 在其上安装有仅具有不具有多层布线的元件的存储器LSI和逻辑LSI的陶瓷基板上，形成确保LSI的信号传输的多层布线层，从而提供薄的封装板。

公开(公告)号：US09248796B2

公开(公告)日：2016-02-02

申请号：US14349495

申请日：2012-06-06

申请人： Akio Takahashi ,  Shinsuke Ueda

发明人： Akio Takahashi ,  Shinsuke Ueda

IPC分类号： G06F7/00 ,  B60R21/00 ,  G06K9/00 ,  B60W40/09 ,  G08G1/16 ,  G01C21/36 ,  B60W50/14 ,  B60K28/06 ,  B60W40/08

CPC分类号： B60R21/00 ,  B60K28/066 ,  B60R2300/302 ,  B60W40/09 ,  B60W50/14 ,  B60W2040/0818 ,  B60W2540/18 ,  B60W2540/22 ,  G01C21/3602 ,  G01C21/3641 ,  G01C21/3697 ,  G06K9/00798 ,  G06K9/00845 ,  G08G1/16 ,  G08G1/166

摘要： A visually-distracted-driving detection device that can detect visually distracted driving with high accuracy. The visually-distracted-driving detection device includes a visually-distracted-driving determination unit that determines that a driver is visually distracted if the direction in which the driver is looking is greater than or equal to a predetermined angle with respect to the front of the driver; and a prohibition unit that, if it is specified that the present position of the vehicle as specified by a present-position specifying unit is within a first predetermined distance from an intersection, prohibits a process that is performed in cases where it is determined that the driver is visually distracted.

摘要翻译： 一种视觉上分散驾驶的检测装置，其可以高精度地检测视觉上分心的驾驶。 视觉分散驱动检测装置包括视觉分散驱动判定单元，其如果驾驶员正在观看的方向相对于前方的前方大于或等于预定角度，则判断驾驶员在视觉上分心 司机 以及禁止单元，如果指定由当前位置指定单元指定的车辆的当前位置在距离交点的第一预定距离内的情况下，则禁止在确定 司机在视觉上分心。

公开(公告)号：US20140129082A1

公开(公告)日：2014-05-08

申请号：US14124054

申请日：2012-04-11

申请人： Akio Takahashi ,  Shinsuke Ueda

发明人： Akio Takahashi ,  Shinsuke Ueda

IPC分类号： B60R16/027 ,  G06K9/00

CPC分类号： B60R16/027 ,  B60K35/00 ,  B60K37/06 ,  B60K2350/1096 ,  B60K2350/2013 ,  B60K2350/928 ,  B60R1/12 ,  B60R2001/1215 ,  B60R2001/1223 ,  G06K9/00845

摘要： An automotive instrument specifying unit of an automotive instrument operating device specifies a group of automotive instruments on the basis of the direction of gaze of an occupant detected by a gaze direction detector, and specifies one automotive instrument from among the specified group of automotive instruments on the basis of the up/down direction selected by up/down direction selecting unit when the up/down direction selecting unit has been operated in a state in which the group of automotive instruments has been specified.

摘要翻译： 汽车仪表操作装置的汽车仪器指定单元基于由注视方向检测器检测到的乘员的凝视方向来指定一组汽车仪表，并且从指定的汽车仪表组中指定一个汽车仪表 在已经指定了该组汽车乐器的状态下操作了上/下方向选择单元时由上/下方向选择单元选择的上/下方向的基础。

公开(公告)号：US07717561B2

公开(公告)日：2010-05-18

申请号：US11664210

申请日：2005-09-29

申请人： Dotan Knaan ,  Adi Shavit ,  Dana Shavit ,  Kazufumi Suzuki ,  Norio Ichihashi ,  Akio Takahashi ,  Akihito Kimata

发明人： Dotan Knaan ,  Adi Shavit ,  Dana Shavit ,  Kazufumi Suzuki ,  Norio Ichihashi ,  Akio Takahashi ,  Akihito Kimata

IPC分类号： A61B3/14

CPC分类号： G03B3/00 ,  A61B3/113 ,  G02B27/0093 ,  G06K9/00604

摘要： In a sight line vector detecting system comprising: an infrared light source for illuminating either an eye or a face; a camera for photographing either the eye or the face; and a computer for processing photographed image data of said camera so as to calculate a sight line vector, the computer includes an image processing unit for detecting the true luminance point and the center of the pupil from the photographed image data; and a calculating unit for calculating the sight line vector; and the image processing unit performs such a processing operation that the image processing unit determines a luminance point capable of satisfying a predetermined requirement as the true luminance point among luminance points having the pupils at near places, calculates a center of the pupils, and further, calculates a center of a cornea ball.

摘要翻译： 在视线矢量检测系统中，包括：用于照射眼睛或脸部的红外光源; 用于拍摄眼睛或脸部的相机; 以及用于处理所述相机的拍摄图像数据以计算视线矢量的计算机，所述计算机包括图像处理单元，用于从所拍摄的图像数据中检测所述真实亮点和所述瞳孔的中心; 以及计算单元，用于计算视线矢量; 并且图像处理单元执行这样的处理操作，使得图像处理单元确定在瞳孔附近的亮度点中能够满足预定要求的亮点作为真实亮度点，计算瞳孔的中心， 计算角膜球的中心。

公开(公告)号：US07082201B2

公开(公告)日：2006-07-25

申请号：US10232984

申请日：2002-08-30

申请人： Hiromi Sotome ,  Shigeo Ando ,  Shinichi Muramatsu ,  Akio Takahashi

发明人： Hiromi Sotome ,  Shigeo Ando ,  Shinichi Muramatsu ,  Akio Takahashi

IPC分类号： H04R5/00

CPC分类号： H04S3/00 ,  H04S7/305

摘要： A three-dimensional sound reproducing apparatus is configured by cascading a sound field effect adding unit and a crosstalk canceling unit. The sound field effect adding unit adds a predetermined three-dimensional sound field effect to an input audio signal, thereby generating audio signals respectively corresponding to left and right channels. The crosstalk canceling unit performs a calculation process on the audio signals of the two channels so that, when the audio signals are respectively generated by two loudspeakers positioned in front of a listener, the audio signals reach the left and right ears of the listener without producing crosstalk. The resulting audio signals are supplied to the loudspeakers, respectively. A sound image localizing unit receives two-channel audio signals which are obtained by encoding a center-channel audio signal, a left-channel audio signal, a right-channel audio signal, and a nonlocalization audio signal, and outputs two-channel audio signals in which sound images are to be respectively localized at virtual loudspeakers.