公开(公告)号：US09261145B2

公开(公告)日：2016-02-16

申请号：US12922939

申请日：2009-03-17

Applicant: Tohru Nakagawa ,  Yuichi Asano ,  Masahiro Ozawa

Inventor： Tohru Nakagawa ,  Yuichi Asano ,  Masahiro Ozawa

IPC: F16C13/00 ,  F16D1/072 ,  B60B27/00 ,  F16C19/18 ,  F16D3/2237 ,  F16C35/063 ,  F16D3/223

CPC classification number: B60B27/0005 ,  B60B27/0015 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0078 ,  B60B27/0084 ,  B60B27/0094 ,  B60B35/18 ,  F16C19/186 ,  F16C35/0635 ,  F16C43/04 ,  F16C2226/60 ,  F16C2326/02 ,  F16D1/072 ,  F16D3/2237 ,  F16D2003/22326 ,  F16D2300/12

Abstract: A bearing device for a wheel has a stem shaft of an outer joint member of a constant-velocity universal joint fit and inserted in a hole of a hub wheel, the stem shaft and hub wheel being coupled through an intermediation of a recess-projection fitting structure. Projections extending in an axial direction are provided on one of the stem shaft and an inner diameter surface of the hole of the hub wheel. The projections are press-fit into another of the stem shaft and the inner diameter surface of the hole along the axial direction. Recesses that adhere to and fit the projections are formed in the other. An end on an inboard side of the hub wheel is caulked to an outer diameter side to form a caulking section and preload is applied to a roller bearing by the caulking section.

Abstract translation: 用于车轮的轴承装置具有恒定万向节配合的外接头构件的杆轴，并且插入轮毂轮的孔中，所述杆轴和轮毂轮通过凹凸装置 结构体。 沿轴向延伸的突出部设置在柄轴和轮毂轮的孔的内径面中的一个上。 凸出部分沿轴向压配合到轴的另一个和孔的内径表面。 在另一方面形成粘附并嵌合突起的凹部。 将轮毂轮的内侧的端部铆接到外径侧以形成铆接部，并且通过铆接部将预载荷施加到滚子轴承。

公开(公告)号：US09039286B2

公开(公告)日：2015-05-26

申请号：US14269508

申请日：2014-05-05

Applicant: Akira Torii ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano ,  Mitsuru Umekida ,  Hisaaki Kura ,  Shin Tomogami

Inventor： Akira Torii ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano ,  Mitsuru Umekida ,  Hisaaki Kura ,  Shin Tomogami

IPC: F16C13/00 ,  F16C35/04 ,  F16C3/02 ,  F16C19/18 ,  B60B27/00 ,  F16C33/64 ,  F16C35/063

CPC classification number: B60B27/0078 ,  B60B27/0005 ,  B60B27/0042 ,  B60B27/0084 ,  B60B27/0094 ,  B60B2310/316 ,  B60B2380/12 ,  F16C19/186 ,  F16C33/64 ,  F16C35/063 ,  F16C35/0635 ,  F16C2326/02 ,  F16D2001/103 ,  Y10T29/49536 ,  Y10T403/7021 ,  Y10T403/7026

Abstract: A bearing device for a wheel prevents backlash in a circumferential direction and has excellent workability for connecting a hub wheel and an outer joint member of a constant velocity universal joint. The bearing device includes a recess-projection fitting structure in which the hub wheel and a shaft section, which is fitted in a hole of the hub wheel of the outer joint member of the constant velocity universal joint, are unitized together. In the recess-projection fitting structure, entire fitting regions among projections on the outer surface of the shaft section of the outer joint member and recesses, which fit on the projections, are brought into intimate contact with each other.

Abstract translation: 用于车轮的轴承装置防止在圆周方向上的间隙，并且具有用于连接轮毂轮和等速万向接头的外接头构件的优异的可加工性。 轴承装置包括凹凸突起嵌合结构，轮毂轮和装配在等速万向接头的外接头构件的轮毂轮的孔中的轴部分组合在一起。 在凹凸装配结构中，外接头构件的轴部的外表面的突起之间的整体嵌合区域和配合在突起上的凹部彼此紧密接触。

公开(公告)号：US08998731B2

公开(公告)日：2015-04-07

申请号：US13823199

申请日：2011-08-18

Applicant: Mitsuru Umekida ,  Masahiro Ozawa ,  Yuichi Asano

Inventor： Mitsuru Umekida ,  Masahiro Ozawa ,  Yuichi Asano

IPC: F16D1/072 ,  F16D3/24 ,  F16D1/08 ,  F16D3/223 ,  F16C35/063 ,  F16C33/76 ,  B60B27/00 ,  F16C19/18

CPC classification number: F16D3/24 ,  B60B27/0026 ,  B60B27/0042 ,  B60B2900/115 ,  B60Y2200/11 ,  F16C19/186 ,  F16C19/527 ,  F16C33/768 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/0858 ,  F16D3/223 ,  F16D2001/103 ,  F16D2003/22326 ,  Y10T403/7026

Abstract: A shaft portion of a joint outer ring where projections extending in an axial direction are provided is press-fitted into a hole portion of a hub wheel to thereby form recesses by the projections in an inner diameter surface of a shaft fitting hole of the hub wheel, by which a recess-projection fitting structure is constructed. An entire area of fitting sites of the projections and the recesses are brought into close contact. Moreover, a bolt member is fastened in a bolt hole provided in the shaft portion of the joint outer ring after the construction of the recess-projection fitting structure, which restricts separation between the hub wheel and the joint outer ring. As the bolt member, if an outer diameter of a seating surface thereof is d1 and a shaft diameter is d2, a bolt member satisfying a relational expression of 2.3≦(d1/d2)2≦4.9 is used.

Abstract translation: 设置有沿轴向延伸的突起的接合外圈的轴部压配合到轮毂轮的孔部，由此通过轮毂圈的轴嵌合孔的内径面的突起形成凹部 由此构成凹凸配合结构。 突出部和凹部的配合位置的整个区域紧密接触。 此外，在构造凹凸装配结构之后，螺栓构件被紧固在设置在接头外圈的轴部中的螺栓孔中，这限制了轮毂轮和接头外圈之间的间隔。 作为螺栓构件，如果其座面的外径为d1，轴径为d2，则使用满足2.3＆nlE;（d1 / d2）2＆nlE; 4.9的关系式的螺栓构件。

公开(公告)号：US20130172088A1

公开(公告)日：2013-07-04

申请号：US13823199

申请日：2011-08-18

Applicant: Mitsuru Umekida ,  Masahiro Ozawa ,  Yuichi Asano

Inventor： Mitsuru Umekida ,  Masahiro Ozawa ,  Yuichi Asano

IPC: F16D3/24

CPC classification number: F16D3/24 ,  B60B27/0026 ,  B60B27/0042 ,  B60B2900/115 ,  B60Y2200/11 ,  F16C19/186 ,  F16C19/527 ,  F16C33/768 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/0858 ,  F16D3/223 ,  F16D2001/103 ,  F16D2003/22326 ,  Y10T403/7026

Abstract: An object of the present invention is to enhance assemblability of a wheel bearing device, and stably maintain predetermined torque transmissibility over a long period of time. A shaft portion (12) of a joint outer ring (5) where projections (35) extending in an axial direction are provided is press-fitted into a hole portion (22) of a hub wheel (1) to thereby form recesses (36) by the projections 35 in an inner diameter surface (37) of a shaft fitting hole 22a of the hub wheel (1), by which a recess-projection fitting structure M is constructed, where an entire area of fitting sites of the projections (35) and the recesses (36) are brought into close contact. Moreover, a bolt member (50) is fastened in a bolt hole (13) provided in the shaft portion (12) of the joint outer ring (5) after the construction of the recess-projection fitting structure (M), which restricts separation between the hub wheel (1) and the joint outer ring (5). As the bolt member (50), if an outer diameter of a seating surface thereof (50a1) is d1 and a shaft diameter is d2, a bolt member satisfying a relational expression of 2.3≦(d1/d2)2≦4.9 is used.

Abstract translation: 本发明的目的是提高车轮轴承装置的组装性，并且能够长时间稳定地保持预定的扭矩传递率。 设置有沿轴向延伸的凸部（35）的接合外圈（5）的轴部（12）压配合到轮毂轮（1）的孔部（22）上，从而形成凹部（36 ）通过轮毂圈（1）的轴嵌合孔22a的内径面（37）中的突起35，构成凹凸嵌合结构M，突起的配合位置的整个面积 35）和凹部（36）紧密接触。 此外，在构造凹凸嵌合结构（M）之后，将螺栓构件（50）固定在设置在接头外圈（5）的轴部（12）中的螺栓孔（13）中，限制分离 在轮毂轮（1）和接头外圈（5）之间。 作为螺栓构件（50），如果其座面的外径（50a1）为d1，轴径为d2，则使用满足2.3 @（d1 / d2）2·4.9的关系式的螺栓构件。

公开(公告)号：US08382378B2

公开(公告)日：2013-02-26

申请号：US12520931

申请日：2007-12-04

Applicant: Yoshikazu Fukumura ,  Hisaaki Kura ,  Shin Tomogami ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano

Inventor： Yoshikazu Fukumura ,  Hisaaki Kura ,  Shin Tomogami ,  Hiroshi Kawamura ,  Kiyoshige Yamauchi ,  Masahiro Ozawa ,  Tohru Nakagawa ,  Yuichi Asano

IPC: F16C13/00

CPC classification number: B60B27/0094 ,  B60B27/0005 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0084 ,  F16C19/186 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/072 ,  F16D1/0858 ,  F16D1/10 ,  F16D3/2237 ,  F16D2001/103 ,  F16D2003/22326

Abstract: A wheel bearing device suppresses backlash in the circumferential direction and has excellent workability in connecting a hub wheel and an outer joint component of a constant velocity universal joint. The wheel bearing device has a stem shaft of an outer joint component of a constant velocity universal joint fitted into a hole section of a hub wheel that is integrated with the hub wheel by a projection and recess mating structure. In the projection and recess mating structure, an overall recess mating area of a projection is in close contact with a corresponding recess.

Abstract translation: 车轮轴承装置抑制周向上的间隙，并且在轮毂轮和等速万向接头的外接头部件的连接方面具有优异的可加工性。 车轮轴承装置具有装配到轮毂轮的孔部中的等速万向接头的外接头部件的杆轴，该轮毂轮通过突出和凹入配合结构与轮毂轮一体化。 在突出和凹入配合结构中，突起的整体凹入配合区域与相应的凹部紧密接触。

公开(公告)号：US20120319275A1

公开(公告)日：2012-12-20

申请号：US13596736

申请日：2012-08-28

Applicant: Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

Inventor： Tomoyuki Fukuda ,  Yoshihiro Kubota ,  Hiroshi Ohtsubo ,  Yuichi Asano

IPC: H01L23/498

CPC classification number: H01L23/4334 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2224/05599

Abstract: A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of wires connecting the electrodes on the semiconductor element with the electrodes on the substrate; a heat dissipation member disposed on the substrate, covering the semiconductor element, and having openings formed in areas facing apex portions of the plurality of wires connected to the electrodes formed along each side of the semiconductor element; and a sealing resin member for covering and sealing the semiconductor element and heat dissipation member.

公开(公告)号：US20100331093A1

公开(公告)日：2010-12-30

申请号：US12676955

申请日：2008-09-10

Applicant: Masahiro Ozawa ,  Yuichi Asano ,  Masayuki Kuroda ,  Tohru Nakagawa ,  Kiyoshige Yamauchi ,  Mitsuru Umekida

Inventor： Masahiro Ozawa ,  Yuichi Asano ,  Masayuki Kuroda ,  Tohru Nakagawa ,  Kiyoshige Yamauchi ,  Mitsuru Umekida

IPC: B60B35/14 ,  B60B35/18 ,  F16D3/20 ,  F16D3/22 ,  F16C19/18 ,  F16C33/62

CPC classification number: B60B27/0005 ,  B60B27/00 ,  F16C19/186 ,  F16C33/64 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/072 ,  F16D3/2237 ,  F16D2003/22326 ,  F16D2300/10

Abstract: Provided is a bearing device for a wheel capable of suppressing a backlash in a circumferential direction, excellent in coupling workability of a hub wheel and an outer joint member of a constant velocity universal joint, and excellent in strength owing to stable fitting between the hub wheel and the outer joint member of the constant velocity universal joint. An axle module using such bearing device for a wheel is also provided. Projecting portions extending in an axial direction are provided on one of an outer surface of a shaft section of the outer joint member and an inner surface of a hole portion of the hub wheel. The projecting portions are press-fitted into the other along the axial direction, and recessed portions are formed in the other through press-fitting of the projecting portions. Thus, a recess-projection fitting structure is formed, in which the projecting portions and the recessed portions are held in close contact with each other through an entire region of fitting contact regions therebetween. Hardness of at least press-fitting start end portions of the projecting portions is set to be higher than hardness of a recessed-portion forming region. A hardness difference therebetween is set to be equal to or larger than 20 points in HRC.

Abstract translation: 本发明提供一种轮毂的轴承装置，其能够抑制圆周方向的间隙，轮毂轮和等速万向接头的外侧接头构件的联接作业性优异，并且由于轮毂轮之间的稳定配合而具有优异的强度 和等速万向节的外接头构件。 还提供了一种使用这种用于车轮的轴承装置的车轴模块。 在外接头构件的轴部的外表面和轮毂圈的孔部的内表面之一上设置有沿轴向延伸的突出部。 突出部沿着轴向压入另一个，并且凹部通过压入突出部而彼此形成。 因此，形成凹凸嵌合结构，其中突出部和凹部通过其间的配合接触区域的整个区域彼此紧密地保持。 突起部的至少压入开始端部的硬度被设定为高于凹部形成区域的硬度。 它们之间的硬度差在HRC中设定为等于或大于20点。

公开(公告)号：US20100092122A1

公开(公告)日：2010-04-15

申请号：US12529240

申请日：2008-03-07

Applicant: Yoshikazu Fukumura ,  Masayuki Kuroda ,  Hisaaki Kura ,  Shin Tomogami ,  Hiroshi Kawamura ,  Shigeaki Fukushima ,  Masahiro Ozawa ,  Yuichi Asano

Inventor： Yoshikazu Fukumura ,  Masayuki Kuroda ,  Hisaaki Kura ,  Shin Tomogami ,  Hiroshi Kawamura ,  Shigeaki Fukushima ,  Masahiro Ozawa ,  Yuichi Asano

IPC: F16C13/02 ,  B21D53/10

CPC classification number: B60B27/0094 ,  B60B27/0005 ,  B60B27/0026 ,  B60B27/0042 ,  B60B27/0084 ,  F16C19/186 ,  F16C19/527 ,  F16C35/0635 ,  F16C2326/02 ,  F16D1/0858 ,  F16D3/224 ,  F16D2001/103 ,  F16D2003/22326 ,  F16D2300/12 ,  Y10T29/49643

Abstract: Provided is a small-sized, lightweight, low-cost, and highly reliable bearing device for a driving wheel which needs no tapered spline, and eliminates a circumferential backlash in spline fitting portions to thereby prevent unusual noise. The bearing device for a driving wheel comprises an outer race (5) having an inner periphery in which double-row outer raceway surfaces (13, 14) are formed; a hub wheel (1) and an inner race (2) having outer peripheries in which double-row inner raceway surfaces (7, 8) opposed to the outer raceway surfaces (13, 14) are formed; and double-row rolling elements (3, 4) interposed between the outer raceway surfaces (13, 14) of the outer race (5) and the inner raceway surfaces (7, 8) of the hub wheel (1) and the inner race (2). A shaft hole (28) of the hub wheel (1) is formed into a cylindrical shape, and a male spline (26) is formed on an outer periphery of a stem section (27) of the outer joint member (15) so that the stem section (27) of the outer joint member (15) is press-fit into the shaft hole (28) of the hub wheel (1). With this, recesses caused to closely fit on the male spline (26) with interference are formed in the shaft hole (28) of the hub wheel (1), whereby the hub wheel (1) and the outer joint member (15) are separably coupled to each other.

Abstract translation: 提供了一种小型，重量轻，低成本，高可靠性的驱动轮的轴承装置，其不需要锥形花键，并且消除花键配合部分中的周向间隙，从而防止异常噪声。 用于驱动轮的轴承装置包括：外圈（5），其具有形成双列外滚道表面（13,14）的内周; 具有外周的毂轮（1）和内座圈（2），其中形成有与所述外滚道面（13,14）相对的双列内滚道面（7,8） 和位于外圈（5）的外滚道表面（13,14）和轮毂轮（1）的内滚道表面（7,8）之间的双列滚动元件（3,4）和内圈 （2）。 轮毂轮（1）的轴孔（28）形成为圆筒状，在外侧接头构件（15）的杆部（27）的外周形成有阳型花键（26），使得 外接头构件（15）的杆部（27）压配合到轮毂（1）的轴孔（28）中。 由此，在轮毂圈（1）的轴孔（28）上形成有与干式花键（26）紧密配合的凹部，轮毂轮（1）和外侧接头构件（15） 彼此可分离地耦合。

公开(公告)号：US20090283897A1

公开(公告)日：2009-11-19

申请号：US12121508

申请日：2008-05-15

Applicant: Futoshi FUKAYA ,  Yuichi ASANO ,  Yoshinori NIWA

Inventor： Futoshi FUKAYA ,  Yuichi ASANO ,  Yoshinori NIWA

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H05K3/305 ,  B23K2103/42 ,  B23K2103/50 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49582 ,  H01L23/544 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/05624 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K2201/09036 ,  H05K2201/10689 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.

Abstract translation: 一种半导体封装，其包括具有安装在基板上的半导体器件的基板和密封基板和半导体器件的树脂部件。 树脂构件包括位于第一表面的另一侧的第一表面和第二表面以及与半导体器件电连接的多个引线。 引线从树脂构件突出并延伸到第二表面侧; 其特征在于，所述树脂部件的所述第二面包括具有第一凹部的第一区域和与所述第一区域不同的第二凹部的第二区域，所述第二凹部比所述第一凹部更深。

公开(公告)号：US06222258B1

公开(公告)日：2001-04-24

申请号：US09102005

申请日：1998-06-22

Applicant: Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

Inventor： Yuichi Asano ,  Hitoshi Kobayashi ,  Katsunori Wako

IPC: H01L23495

CPC classification number: H01L23/4334 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012

Abstract: A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.

Abstract translation: 一种半导体器件的制造方法，其特征在于，包括：a）平板部件位于设置有多个引线和多个支撑杆的扁平状引线框架上的安装工序，使得所述平板部件接触 至少所述多个引线，并且所述平板构件附接到多个支撑杆; b）元件安装工艺，其中将半导体元件安装在平板形元件上，该平板元件安装在平板形引线框架的多个支撑杆上; c）引线接合工艺，其中在所述多个引线和所述半导体元件中的每一个之间设置导线; 以及d）分离处理，其在所述引线接合工艺完成之后进行，其中所述多个支撑杆变形，以便分离所述平板部件和所述多个引线，并且将所述平板 来自多个线索的成员。