-
公开(公告)号:US08846447B2
公开(公告)日:2014-09-30
申请号:US13593118
申请日:2012-08-23
IPC分类号: H01L23/00 , H01L23/498 , H01L21/683 , G01R31/28 , H01L25/04 , H01L21/66
CPC分类号: H01L22/32 , G01R31/2886 , H01L21/6835 , H01L22/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/04 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381 , H01L2224/11015 , H01L2224/11849 , H01L2224/13014 , H01L2224/13082 , H01L2224/14131 , H01L2224/14135 , H01L2224/16111 , H01L2224/16112 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/16257 , H01L2224/16267 , H01L2224/16503 , H01L2224/17051 , H01L2224/8109 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2224/81805
摘要: A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.
摘要翻译: 将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准,微电子元件具有多个间隔开的导电凸块,每个包括接合金属,并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分,该内表面不被其形成凸起的粘结金属润湿。 可以进行凸块的回流,使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化,使得至少一些凹部中的回流焊接材料机械地接合 基质。
-
公开(公告)号:US20140054763A1
公开(公告)日:2014-02-27
申请号:US13593118
申请日:2012-08-23
IPC分类号: H01L23/00 , H01L23/498
CPC分类号: H01L22/32 , G01R31/2886 , H01L21/6835 , H01L22/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/04 , H01L25/0652 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/6834 , H01L2221/68381 , H01L2224/11015 , H01L2224/11849 , H01L2224/13014 , H01L2224/13082 , H01L2224/14131 , H01L2224/14135 , H01L2224/16111 , H01L2224/16112 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/16257 , H01L2224/16267 , H01L2224/16503 , H01L2224/17051 , H01L2224/8109 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/00 , H01L2224/81805
摘要: A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart electrically conductive bumps each including a bond metal, and reflowing the bumps. The bumps can be exposed at a front surface of the microelectronic element. The substrate can have a plurality of spaced-apart recesses extending from a first surface thereof. The recesses can each have at least a portion of one or more inner surfaces that are non-wettable by the bond metal of which the bumps are formed. The reflowing of the bumps can be performed so that at least some of the bond metal of each bump liquefies and flows at least partially into one of the recesses and solidifies therein such that the reflowed bond material in at least some of the recesses mechanically engages the substrate.
摘要翻译: 将微电子元件附接到衬底的方法可以包括将衬底与微电子元件对准,微电子元件具有多个间隔开的导电凸块,每个包括接合金属,并且回流凸块。 凸起可以暴露在微电子元件的前表面处。 衬底可以具有从其第一表面延伸的多个间隔开的凹部。 这些凹部各自可以具有一个或多个内表面的至少一部分,该内表面不被其形成凸起的粘结金属润湿。 可以进行凸块的回流,使得每个凸块的至少一些粘结金属液化并且至少部分地流入其中一个凹部并在其中固化,使得至少一些凹部中的回流焊接材料机械地接合 基质。
-
公开(公告)号:US08785790B2
公开(公告)日:2014-07-22
申请号:US13293698
申请日:2011-11-10
申请人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Belgacem Haba , Hiroaki Sato , Philip Damberg
发明人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Belgacem Haba , Hiroaki Sato , Philip Damberg
CPC分类号: H05K1/115 , H01L23/14 , H01L23/49827 , H01L23/49866 , H01L2924/0002 , H05K1/03 , H05K1/09 , H05K3/42 , H05K2201/0141 , H05K2201/0175 , H05K2201/09509 , H05K2201/10378 , H05K2203/025 , H05K2203/1105 , Y10T29/49165 , H01L2924/00
摘要: A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.
摘要翻译: 组件包括具有第一和第二间隔开并平行表面的支撑结构以及沿第一和第二表面之间的方向延伸的多个导电元件。 每个导电元件包含选自铜,铝,镍和铬的布线金属的合金和选自由镓,锗,铟,硒,锡,硫,银,磷和 铋。 该合金具有随导电元件的至少一个方向上的距离而变化的组成。 添加剂的浓度小于或等于导电元件的总原子质量的5%,并且导电元件的电阻率在2.5至30微欧姆厘米之间。
-
公开(公告)号:US08772946B2
公开(公告)日:2014-07-08
申请号:US13492064
申请日:2012-06-08
申请人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
CPC分类号: H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要: A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译: 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面,并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘,第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
-
公开(公告)号:US20130328186A1
公开(公告)日:2013-12-12
申请号:US13492064
申请日:2012-06-08
申请人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
发明人: Cyprian Emeka Uzoh , Charles G. Woychik , Terrence Caskey , Kishor V. Desai , Huailiang Wei , Craig Mitchell , Belgacem Haba
IPC分类号: H01L23/48 , H01L21/28 , H01L23/498
CPC分类号: H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要: A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.
摘要翻译: 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面,并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘,第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。
-
公开(公告)号:US08963335B2
公开(公告)日:2015-02-24
申请号:US13613611
申请日:2012-09-13
IPC分类号: H01L23/48 , H01L23/498 , H01L25/065 , H01L23/00 , H01L21/768 , H01L23/433 , H01L25/16 , H01L25/18
CPC分类号: H01L23/562 , H01L21/4857 , H01L21/486 , H01L21/76898 , H01L23/4334 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/03 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/167 , H01L25/18 , H01L2224/0401 , H01L2224/131 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.
摘要翻译: 复合插入件可以包括衬底元件和支撑元件。 衬底元件可以具有限定200微米或更小的厚度的第一和第二相对表面,并且可以具有在第一表面处暴露的多个触点和延伸穿过该厚度的导电结构。 支撑元件可以具有暴露在支撑元件的第二表面处的电介质或半导体材料中的至少一个的主体,延伸穿过主体的厚度的开口,在至少一些开口内沿着 主体的厚度和暴露在支撑元件的第一表面处的端子。 支撑元件的第二表面可以与衬底元件的第二表面结合。 端子可以通过导电通孔和导电结构与触点电连接。
-
公开(公告)号:US20140070423A1
公开(公告)日:2014-03-13
申请号:US13613611
申请日:2012-09-13
IPC分类号: H01L23/48 , H01L23/00 , H01L21/768
CPC分类号: H01L23/562 , H01L21/4857 , H01L21/486 , H01L21/76898 , H01L23/4334 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/03 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/167 , H01L25/18 , H01L2224/0401 , H01L2224/131 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/48227 , H01L2224/73253 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.
摘要翻译: 复合插入件可以包括衬底元件和支撑元件。 衬底元件可以具有限定200微米或更小的厚度的第一和第二相对表面,并且可以具有在第一表面处暴露的多个触点和延伸穿过该厚度的导电结构。 支撑元件可以具有暴露在支撑元件的第二表面处的电介质或半导体材料中的至少一个的主体,延伸穿过主体的厚度的开口,在至少一些开口内沿着 主体的厚度和暴露在支撑元件的第一表面处的端子。 支撑元件的第二表面可以与衬底元件的第二表面结合。 端子可以通过导电通孔和导电结构与触点电连接。
-
公开(公告)号:US20120314384A1
公开(公告)日:2012-12-13
申请号:US13156609
申请日:2011-06-09
CPC分类号: H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要: A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译: 部件可以包括具有第一表面和远离其的第二表面的基板,沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒,每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起,并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10%或更多。
-
公开(公告)号:US20130118784A1
公开(公告)日:2013-05-16
申请号:US13293698
申请日:2011-11-10
CPC分类号: H05K1/115 , H01L23/14 , H01L23/49827 , H01L23/49866 , H01L2924/0002 , H05K1/03 , H05K1/09 , H05K3/42 , H05K2201/0141 , H05K2201/0175 , H05K2201/09509 , H05K2201/10378 , H05K2203/025 , H05K2203/1105 , Y10T29/49165 , H01L2924/00
摘要: A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.
-
公开(公告)号:US08723049B2
公开(公告)日:2014-05-13
申请号:US13156609
申请日:2011-06-09
IPC分类号: H05K1/11
CPC分类号: H05K3/0094 , B23K1/0016 , B23K35/24 , B23K35/36 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49883 , H01L2224/0401 , H01L2224/0557 , H01L2224/06181 , H01L2224/13023 , H01L2224/131 , H01L2924/00014 , H01L2924/07811 , H01L2924/09701 , Y10T29/49165 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要: A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via.
摘要翻译: 部件可以包括具有第一表面和远离其的第二表面的基板,沿着第一和第二表面之间的方向延伸的开口以及在开口内延伸的导电通孔。 基底可以具有小于10ppm /℃的CTE。导电通孔可以包括多个基础颗粒,每个基底颗粒包括基本上被不同于第一金属的第二金属层覆盖的第一金属的第一区域。 基础颗粒可以冶金学连接在一起,并且颗粒的第二金属层可以至少部分地扩散到第一区域中。 导电通孔可以包括散布在接合的基础颗粒之间的空隙。 空隙可以占据导电通孔体积的10%或更多。
-
-
-
-
-
-
-
-
-