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公开(公告)号：US08900922B2
公开(公告)日：2014-12-02
申请号：US13398568
申请日：2012-02-16
申请人： Cheng-Chung Lin , Kuei-Wei Huang , Ai-Tee Ang , Tsai-Tsung Tsai , Ming-Da Cheng , Chung-Shi Liu
发明人： Cheng-Chung Lin , Kuei-Wei Huang , Ai-Tee Ang , Tsai-Tsung Tsai , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L25/07
CPC分类号： H01L21/565 , H01L21/486 , H01L23/145 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/105 , H01L25/50 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81203 , H01L2224/81815 , H01L2224/83104 , H01L2224/83191 , H01L2224/94 , H01L2225/1023 , H01L2225/1058 , H01L2924/01322 , H01L2924/15311 , H01L2924/1533 , H01L2924/1815 , H01L2924/18161 , H01L2924/00014 , H01L2924/013 , H01L2224/11 , H01L2224/27 , H01L2924/0665 , H01L2924/01014 , H01L2924/014 , H01L2924/00
摘要： A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings.
摘要翻译： 一种方法包括在第一包装部件上层压非导电膜（NCF），以及将第二包装部件接合在第一包装部件上。 NCF和第二封装组件位于第一封装组件的同一侧。 然后将模具的支柱压入NCF中以在NCF中形成开口。 第一包装部件的连接器通过开口露出。
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公开(公告)号：US20130214431A1
公开(公告)日：2013-08-22
申请号：US13398568
申请日：2012-02-16
申请人： Cheng-Chung Lin , Kuei-Wei Huang , Ai-Tee Ang , Tsai-Tsung Tsai , Ming-Da Cheng , Chung-Shi Liu
发明人： Cheng-Chung Lin , Kuei-Wei Huang , Ai-Tee Ang , Tsai-Tsung Tsai , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L21/565 , H01L21/486 , H01L23/145 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/105 , H01L25/50 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16225 , H01L2224/16227 , H01L2224/27436 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81203 , H01L2224/81815 , H01L2224/83104 , H01L2224/83191 , H01L2224/94 , H01L2225/1023 , H01L2225/1058 , H01L2924/01322 , H01L2924/15311 , H01L2924/1533 , H01L2924/1815 , H01L2924/18161 , H01L2924/00014 , H01L2924/013 , H01L2224/11 , H01L2224/27 , H01L2924/0665 , H01L2924/01014 , H01L2924/014 , H01L2924/00
摘要： A method includes laminating a Non-Conductive Film (NCF) over a first package component, and bonding a second package component on the first package component. The NCF and the second package component are on a same side of the first package component. Pillars of a mold tool are then forced into the NCF to form openings in the NCF. The connectors of the first package component are exposed through the openings.
摘要翻译： 一种方法包括在第一包装部件上层压非导电膜（NCF），以及将第二包装部件接合在第一包装部件上。 NCF和第二封装组件位于第一封装组件的同一侧。 然后将模具的支柱压入NCF中以在NCF中形成开口。 第一包装部件的连接器通过开口露出。
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公开(公告)号：US08846448B2
公开(公告)日：2014-09-30
申请号：US13571665
申请日：2012-08-10
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L21/67288 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/73204 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H05B6/6447 , H05B6/80 , H01L2924/0001
摘要： The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure.
摘要翻译： 本公开涉及一种减少封装封装半导体结构内的翘曲的工具布置和方法，同时最小化耦合封装的电绝缘粘合剂内的空隙形成。 压力发生器和可变频率微波源耦合到封装封装的封装半导体结构的处理室。 封装的封装半导体结构由可变频率，可变温度和可变持续时间的可变频率微波源同时加热，并通过压力发生器暴露于高压。 这种用于微波加热和升高压力的组合限制了引入的翘曲量，同时防止在封装封装半导体结构的衬底的电绝缘粘合剂中形成空隙。
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公开(公告)号：US20140045300A1
公开(公告)日：2014-02-13
申请号：US13571665
申请日：2012-08-10
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Tsai-Tsung Tsai , Ai-Tee Ang , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L21/67288 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/73204 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H05B6/6447 , H05B6/80 , H01L2924/0001
摘要： The present disclosure relates to a tool arrangement and method to reduce warpage within a package-on-package semiconductor structure, while minimizing void formation within an electrically-insulating adhesive which couples the packages. A pressure generator and a variable frequency microwave source are coupled to a process chamber which encapsulates a package-on-package semiconductor structure. The package-on-package semiconductor structure is simultaneously heated by the variable frequency microwave source at variable frequency, variable temperature, and variable duration and exposed to an elevated pressure by the pressure generator. This combination for microwave heating and elevated pressure limits the amount of warpage introduced while preventing void formation within an electrically-insulating adhesive which couples the substrates of the package-on-package semiconductor structure.
摘要翻译： 本公开涉及一种减少封装封装半导体结构内的翘曲的工具布置和方法，同时最小化耦合封装的电绝缘粘合剂内的空隙形成。 压力发生器和可变频率微波源耦合到封装封装的封装半导体结构的处理室。 封装的封装半导体结构由可变频率，可变温度和可变持续时间的可变频率微波源同时加热，并通过压力发生器暴露于高压。 这种用于微波加热和升高压力的组合限制了引入的翘曲量，同时防止在封装封装半导体结构的衬底的电绝缘粘合剂中形成空隙。
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公开(公告)号：US20140042622A1
公开(公告)日：2014-02-13
申请号：US13572417
申请日：2012-08-10
申请人： Tsai-Tsung Tsai , Chun-Cheng Lin , Ai-Tee Ang , Yi-Da Tsai , Ming-Da Cheng , Chung-Shi Liu
发明人： Tsai-Tsung Tsai , Chun-Cheng Lin , Ai-Tee Ang , Yi-Da Tsai , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/498
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15321 , H05K3/3436 , H05K3/4015 , H05K2201/0367 , H01L2224/0401
摘要： A package-on-package (PoP) device including a substrate having an array of contact pads arranged around a periphery of the substrate, a logic chip mounted to the substrate inward of the array of contact pads, and non-solder bump structures mounted on less than an entirety of the contact pads available.
摘要翻译： 一种封装封装（PoP）器件，包括具有围绕衬底的周边布置的接触焊盘阵列的衬底，安装到衬底内部的接触焊盘阵列的逻辑芯片以及安装在衬底上的非焊料凸块结构 小于可用的接触垫的整体。
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公开(公告)号：US20130167373A1
公开(公告)日：2013-07-04
申请号：US13527459
申请日：2012-06-19
申请人： Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
发明人： Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
CPC分类号： H01L24/11 , H01L21/4853 , H01L24/13 , H01L24/78 , H01L2224/056 , H01L2224/1111 , H01L2224/1134 , H01L2224/13005 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/13169 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/7855 , H01L2224/78621 , H01L2224/85051 , H01L2224/854 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/206 , Y10T29/49192 , Y10T29/49213 , Y10T29/514 , Y10T29/5177 , Y10T29/53217 , Y10T29/53235 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/01049 , H01L2224/4554
摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.
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公开(公告)号：US09021682B2
公开(公告)日：2015-05-05
申请号：US13527459
申请日：2012-06-19
申请人： Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
发明人： Chien Ling Hwang , Yeong-Jyh Lin , Yi-Li Hsiao , Ming-Da Cheng , Tsai-Tsung Tsai , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
IPC分类号： H01R43/052 , H01L21/48 , H01L23/00
CPC分类号： H01L24/11 , H01L21/4853 , H01L24/13 , H01L24/78 , H01L2224/056 , H01L2224/1111 , H01L2224/1134 , H01L2224/13005 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/13169 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/7855 , H01L2224/78621 , H01L2224/85051 , H01L2224/854 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/206 , Y10T29/49192 , Y10T29/49213 , Y10T29/514 , Y10T29/5177 , Y10T29/53217 , Y10T29/53235 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/01049 , H01L2224/4554
摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.
摘要翻译： 一种装置包括：线圈，其被配置为供应线，被配置为在所述线中形成切口的切割装置，以及被配置为结合所述线并形成柱形凸块的毛细管。 该设备还被配置为拉动线在凹口处断裂，尾部区域附接到柱形凸块。
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公开(公告)号：US20140008786A1
公开(公告)日：2014-01-09
申请号：US13544783
申请日：2012-07-09
申请人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/3157 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10175 , H01L2224/1146 , H01L2224/11849 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2924/12042 , H01L2924/15311 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.
摘要翻译： 一种装置包括第一包装部件和第一包装部件的顶表面上的第一金属痕迹和第二金属迹线。 该装置还包括覆盖第一封装部件的顶表面，第一金属迹线和第二金属迹线的介电掩模层，其中介电掩模层具有其中的开口露出第一金属迹线。 该器件还包括形成在第二封装元件上的第二封装元件和互连，所述互连件具有形成在所述金属突起上的金属突起和焊料凸块，其中所述焊料凸点接触所述介电掩模的开口中的所述第一金属迹线 层。
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公开(公告)号：US20130102112A1
公开(公告)日：2013-04-25
申请号：US13280163
申请日：2011-10-24
申请人： Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Kuei-Wei Huang , Wei-Hung Lin , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/75 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L24/97 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/75272 , H01L2224/75314 , H01L2224/75704 , H01L2224/7598 , H01L2224/81191 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2224/94 , H01L2224/97 , H01L2924/00012 , H01L2924/00014 , H01L2224/81 , H01L2924/014
摘要： A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.
摘要翻译： 一种方法包括将第一包装部件装载在凹形船上，以及将第二包装部件放置在第一包装部件上。 负载夹具放置在第二包装部件上，其中负载夹具由凹形舟皿的温度可变的间隔件支撑。 执行回流步骤以将第二包装部件粘合到第一包装部件。 在回流步骤的升温步骤期间，温度可变的间隔件响应于温度升高而软化，并且软化的温度可变间隔件的高度减小，直到负载夹具被刚性间隔件 凹船。
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公开(公告)号：US20130095611A1
公开(公告)日：2013-04-18
申请号：US13276143
申请日：2011-10-18
申请人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu
发明人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/56
摘要： Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.
摘要翻译： 公开了半导体器件的封装方法。 在一个实施例中，封装半导体器件的方法包括提供包括多个封装衬底的工件。 在多个包装基板之间移除一部分工件。 模具附接到多个封装基板中的每一个。
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