公开(公告)号：US20070074754A1

公开(公告)日：2007-04-05

申请号：US11241050

申请日：2005-09-30

申请人： Donald Farquhar ,  Charles Korman ,  Neil Johnson ,  Ali Iz

发明人： Donald Farquhar ,  Charles Korman ,  Neil Johnson ,  Ali Iz

IPC分类号： H02N6/00

CPC分类号： H02S20/23 ,  E04D13/174 ,  E04D2001/305 ,  E04D2001/306 ,  F24S20/67 ,  H01L31/0547 ,  Y02B10/12 ,  Y02B10/20 ,  Y02E10/44 ,  Y02E10/52

摘要： A photovoltaic roofing system and a method of installing the photovoltaic ridge cap structure have been provided. The photovoltaic roofing system includes a ridge cap adapted to cover a ridge of a roof structure. The system also includes at least one photovoltaic cell disposed within the ridge cap. The method of installing a photovoltaic ridge cap structure includes mounting the ridge cap over multiple photovoltaic cells along a ridge of a roof structure. The method further includes routing electrical leads from each photovoltaic cell through one or more openings along the ridge of the roof structure.

摘要翻译： 已经提供了光伏屋顶系统和安装光伏脊盖结构的方法。 光伏屋顶系统包括适于覆盖屋顶结构的脊的脊帽。 该系统还包括设置在脊盖内的至少一个光伏电池。 安装光伏脊盖结构的方法包括沿着屋顶结构的脊部将脊盖安装在多个光伏电池上。 该方法还包括将电引线从每个光伏电池穿过沿着屋顶结构的脊的一个或多个开口。

公开(公告)号：US20070095384A1

公开(公告)日：2007-05-03

申请号：US11261025

申请日：2005-10-28

申请人： Donald Farquhar ,  Neil Johnson ,  Russell Dennison ,  Maria Otero

发明人： Donald Farquhar ,  Neil Johnson ,  Russell Dennison ,  Maria Otero

IPC分类号： H02N6/00

CPC分类号： H01L31/0516 ,  H01L31/022441 ,  Y02E10/50

摘要： A solar cell array includes a series of photovoltaic cells having a front side and a back side. Each photovoltaic cell also includes front contacts and back contacts disposed on the front side and back side of each cell respectively, wherein the front contacts and the back contacts are accessible from the back side of each cell. The solar cell array also includes multiple tabs electrically coupled to the front contacts and configured to provide electrical paths from the front contacts to the back side of each photovoltaic cell. Further, the photovoltaic cells are interconnected by multiple interconnect leads that are coupled from a tab on the back side of a first photovoltaic cell to a back contact point on the back side of a second photovoltaic cell. An automated method of interconnecting the photovoltaic cells in the solar cell array is also disclosed.

摘要翻译： 太阳能电池阵列包括一系列具有前侧和后侧的光伏电池。 每个光伏电池还包括分别设置在每个电池的前侧和后侧的前触点和后触点，其中前触点和后触点可从每个单元的背面接近。 太阳能电池阵列还包括电连接到前触点并被配置为提供从前触点到每个光伏电池的背侧的电路的多个突片。 此外，光伏电池通过多个互连引线互连，所述多个互连引线从第一光伏电池的背面上的突片耦合到第二光伏电池的背面上的后接触点。 还公开了一种互连太阳能电池阵列中的光伏电池的自动化方法。

公开(公告)号：US20050124096A1

公开(公告)日：2005-06-09

申请号：US11029969

申请日：2005-01-05

申请人： Bernd Appelt ,  James Bupp ,  Donald Farquhar ,  Ross Keesler ,  Michael Klodowski ,  Andrew Seman ,  Gary Schild

发明人： Bernd Appelt ,  James Bupp ,  Donald Farquhar ,  Ross Keesler ,  Michael Klodowski ,  Andrew Seman ,  Gary Schild

IPC分类号： H05K3/06 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L21/82 ,  H01L21/44

CPC分类号： H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K3/427 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1572 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps, etching the metal layer exposed by said development to form said plurality of conductive bumps, removing said first photoresist, applying a second photoresist onto the metal layer, exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.

摘要翻译： 一种形成多个固体导电凸块的方法，用于将电路板的两个导电层与基本上共面的上表面互连。 该方法包括以下步骤：将连续的均匀金属层施加到电介质基底上，施加第一光致抗蚀剂并暴露和显影所述第一光致抗蚀剂以限定导电凸块的图案，蚀刻由所述显影暴露的金属层以形成所述多个导电 去除所述第一光致抗蚀剂，在所述金属层上施加第二光致抗蚀剂，暴露和显影所述第二光致抗蚀剂以限定导电凸块和电路线的图案; 蚀刻由所述显影曝光的金属层，以在所述金属层中形成电路线图案; 并除去所述第二光致抗蚀剂。 本发明的方法还提供制造用于向面板提供刚性的多层电路板和金属边框。

公开(公告)号：US20080022519A1

公开(公告)日：2008-01-31

申请号：US11865794

申请日：2007-10-02

申请人： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

发明人： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

IPC分类号： H05K3/36

CPC分类号： H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： A laminating method. A structure that includes first and second dielectric layers respectively positioned on opposing surfaces of a thermally conductive layer is pressurized between 1000 and 3000 psi concurrent with being subjected to a thermal process, including the steps of: (a) heating the structure from ambient room temperature to a temperature between 670° F. to 695° F. in a heatup stage of duration 42 to 57 minutes; (b) after step (a), maintaining the structure at an approximately constant temperature between 670° F. and 695° F. in a dwell stage of duration 105 to 125 minutes; (c) after step (b), cooling the structure to 400° F. in a slow cool stage of duration of 120 to 150 minutes, wherein step (c) is performed after step (b); and (d) after step (3), cooling the structure to ambient room temperature in a rapid cool stage of duration less than 180 minutes.

摘要翻译： 层压方法。 包括分别位于导热层的相对表面上的第一和第二电介质层的结构在1000和3000psi之间被加压，同时进行热处理，包括以下步骤：（a）从环境室温 在持续时间为42至57分钟的加热阶段中温度在670°F至695°F之间; （b）在步骤（a）之后，在持续105至125分钟的停留阶段中，将结构保持在670°F和695°F之间的近似恒定温度; （c）在步骤（b）之后，在120至150分钟的缓慢冷却阶段中将结构冷却至400°F，其中步骤（c）在步骤（b）之后进行; 和（d）在步骤（3）之后，在持续时间小于180分钟的快速冷却阶段中将结构冷却至环境室温。

公开(公告)号：US20050019527A1

公开(公告)日：2005-01-27

申请号：US10925021

申请日：2004-08-25

申请人： Donald Farquhar ,  Mark Poliks

发明人： Donald Farquhar ,  Mark Poliks

IPC分类号： G02F1/13 ,  B32B7/04 ,  B32B37/00 ,  C09K19/00 ,  H05K1/03 ,  H05K3/46 ,  B32B3/10

CPC分类号： H05K3/4632 ,  B32B7/04 ,  B32B37/00 ,  B32B37/0046 ,  B32B2037/0092 ,  B32B2305/34 ,  B32B2305/55 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/5825 ,  B32B2309/02 ,  B32B2311/00 ,  C09K19/00 ,  H05K1/0313 ,  H05K3/4641 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09318 ,  Y10T428/24273 ,  Y10T428/24331

摘要： A multi-layered structure and method of formation. A page is generated by stacking N substructures (N≧2) in an ordered sequence. A first substructure of each pair of adjacent substructures comprises liquid crystal polymer (LCP) dielectric material to be bonded with a second substructure of a pair of the adjacent substructure. The page is subjected to a temperature less than the lowest nematic-to-isotropic transition temperature of the LCP dielectric materials within the page. The dwell time and elevated pressure are sufficient to cause all LCP dielectric material within the page to plastically deform and laminate each pair of adjacent substructures without any extrinsic adhesive layer disposed between the first and second substructures of each pair of adjacent substructures.

公开(公告)号：US20050280136A1

公开(公告)日：2005-12-22

申请号：US11208982

申请日：2005-08-22

申请人： Brian Curcio ,  Donald Farquhar ,  Lisa Jimarez ,  Keith Brodock

发明人： Brian Curcio ,  Donald Farquhar ,  Lisa Jimarez ,  Keith Brodock

IPC分类号： B32B3/24 ,  H01L21/48 ,  H01L23/02 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46

CPC分类号： B32B3/266 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/24917 ,  Y10T428/2804

摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.

摘要翻译： 一种形成用于接合的构件以形成复合布线板的方法。 该构件包括电介质基片。 将胶带施加到所述基底的至少一个面上。 至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。 在每个开口中分配导电材料并部分固化。 去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

公开(公告)号：US20050224961A1

公开(公告)日：2005-10-13

申请号：US11148890

申请日：2005-06-08

申请人： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

发明人： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

IPC分类号： H01L21/48 ,  H01L23/34 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

摘要： An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T1MIN and a maximum temperature T1MAX. T1MAX constrains the ductility of the first dielectric layer to be at least D1 following the laminating. T1MAX depends on D1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T2MIN and a maximum temperature T2MAX. T2MAX constrains the ductility of the second dielectric layer to be at least D2 following the laminating. T2MAX depends on D2 and on a second dielectric material comprised by the second dielectric layer.

摘要翻译： 电子封装和形成方法。 提供具有第一和第二相对表面的导热层。 第一电介质层在加压下被层压在导热层的第一相对表面上，温度在最低温度T 1 1MIN和最高温度T 1MAX之间。 在层压之后，T 1MAX 3将第一介电层的延展性约束至少为D 1。 T 1MAX取决于D 1和在由第一介电层组成的第一电介质材料上。 在加压下将第二电介质层在导热层的第二相对表面上，在最低温度T 2 M 2 N 2和最大温度T 2 MAX之间的温度下层压。 在层压之后，T 2MAX 2将第二介电层的延展性约束为至少D 2。 T 2MAX取决于D 2和在由第二介电层组成的第二电介质材料上。

公开(公告)号：US20070285198A1

公开(公告)日：2007-12-13

申请号：US11449752

申请日：2006-06-09

申请人： Donald Farquhar ,  Peter J. Foley ,  Patricia C. Irwin ,  Hsin-Pang Wang

发明人： Donald Farquhar ,  Peter J. Foley ,  Patricia C. Irwin ,  Hsin-Pang Wang

IPC分类号： H01F3/00

CPC分类号： H02K15/12 ,  H01F5/06 ,  H01F41/122

摘要： A method of curing a coating on a metal conductor comprising: (a) connecting the metal conductor in series with a power transformer; and (b) passing a current through the metal conductor so as to achieve a temperature sufficient to cure the coating.

摘要翻译： 一种固化金​​属导体上的涂层的方法，包括：（a）将金属导体与电力变压器串联; 和（b）使电流通过金属导体，以达到足以固化涂层的温度。

公开(公告)号：US20060080348A1

公开(公告)日：2006-04-13

申请号：US11267770

申请日：2005-11-04

申请人： Mario Cesana ,  Donald Farquhar ,  Martino Taddei

发明人： Mario Cesana ,  Donald Farquhar ,  Martino Taddei

IPC分类号： G06F17/30

CPC分类号： G06F21/87 ,  G06F1/1628 ,  Y10T428/23

摘要： A security enclosure and method of forming the security enclosure. The security enclosure includes an electronic assembly, an extension, and a tamper respondent wrap. The extension has a first end inserted in the assembly and a second end having at least one bonding pad thereon. The tamper respondent wrap at least partially surrounds the assembly. The wrap has a bonding pad. The bonding pad of the extension is secured to the bonding pad of the wrap. The tamper respondent wrap includes a plurality of layers. A plurality of electrically conductive lines or a plurality of electrically conductive ink traces exist within each layer of the wrap.

摘要翻译： 形成安全机柜的安全机箱和方法。 安全机柜包括一个电子组件，一个扩展和一个篡改的回应包。 延伸部具有插入组件中的第一端和在其上具有至少一个接合垫的第二端。 篡改答卷者至少部分地围绕组件。 包装有一个接合垫。 延伸部的接合垫固定在包装的接合垫上。 篡改答复包裹包括多个层。 多个导电线或多个导电墨迹存在于包层的每层内。

公开(公告)号：US20050079289A1

公开(公告)日：2005-04-14

申请号：US10641182

申请日：2003-08-14

申请人： Donald Farquhar ,  Robert Japp ,  John Lauffer ,  Konstantinos Papathomas

发明人： Donald Farquhar ,  Robert Japp ,  John Lauffer ,  Konstantinos Papathomas

IPC分类号： H05K3/42 ,  B05D7/00 ,  B05D1/36

CPC分类号： H05K3/429 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2201/09645 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

摘要翻译： 涉及多段电镀通孔的方法和结构。 基板包括夹在第一层叠层和第二层叠层之间的电介质层。 穿过基板形成通孔。 通孔穿过介电层内的不可电介质材料。 结果，随后的通孔的接种和电镀导致在第一层压层的段上的通孔的壁上和第二层压层的段上形成导电金属电镀，而不在不可电绝缘的电介质 电介质层的材料。 因此，导电金属电镀从第一层叠层到第二层叠层不是连续的。