公开(公告)号：US07080444B1

公开(公告)日：2006-07-25

申请号：US10086491

申请日：2002-02-28

申请人： Gordon S. W. Craig ,  Ming X. Chan ,  Cornelius V. Sutu ,  Omar R. Alvarado ,  Hoang Pham ,  Mark Alfred Hadley

发明人： Gordon S. W. Craig ,  Ming X. Chan ,  Cornelius V. Sutu ,  Omar R. Alvarado ,  Hoang Pham ,  Mark Alfred Hadley

IPC分类号： H05K3/30

CPC分类号： H05K13/027 ,  H01L21/67144 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  Y10S29/046 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261 ,  H01L2924/15153

摘要： An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.

摘要翻译： 一种用于在衬底上分配流体中的块的装置。 该装置包括具有第一端和第二端的第一管。 压缩装置连接到第一管。 第二管连接到第一管，以将具有块的浆料输送到第一管。 压缩装置使流过第一管的一部分的浆料中的至少一个块脉动。

公开(公告)号：US07576656B2

公开(公告)日：2009-08-18

申请号：US11522045

申请日：2006-09-14

申请人： Gordon S. W. Craig ,  Susan Swindlehurst ,  Randolph W. Eisenhardt ,  Ming X. Chan

发明人： Gordon S. W. Craig ,  Susan Swindlehurst ,  Randolph W. Eisenhardt ,  Ming X. Chan

IPC分类号： G08B13/14

CPC分类号： G06K19/07749 ,  H01L23/4985 ,  H01L23/49855 ,  H01L24/83 ,  H01L24/90 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2924/00014

摘要： Apparatuses and methods for high speed bonding for an RFID device are provided. A first substrate includes an antenna and is coupled to a strap assembly by an adhesive material. The adhesive material is substantially inert thermally for a predetermined temperature range, or it otherwise lacks a heat flow variation greater than 0.05 W/g for the predetermined temperature range. Such an adhesive material provides a reliable bond. In a specific embodiment, the predetermined temperature range is about 30° Celsius to about 85° Celsius. In an alternative embodiment, the adhesive material can be exposed to water or steam to reduce its heat flow variation to less than 0.05 W/g for the temperature range.

摘要翻译： 提供了用于RFID装置的高速粘合的装置和方法。 第一衬底包括天线，并通过粘合剂材料联接到带组件。 粘合剂材料在预定温度范围内基本上是惰性的，否则在预定温度范围内缺少大于0.05W / g的热流变化。 这种粘合剂材料提供可靠的粘合。 在具体实施方案中，预定温度范围为约30摄氏度至约85摄氏度。 在替代实施例中，粘合剂材料可以暴露于水或蒸汽，以在其温度范围内将其热流变化减小到小于0.05W / g。

公开(公告)号：US07531218B2

公开(公告)日：2009-05-12

申请号：US11639858

申请日：2006-12-15

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件，以及 其中所述浆料还包括不被设计成与所述基底上的受体区域配合的第二多个元件。 通常，这些第二多个元件有助于第一多个元件的移动。

公开(公告)号：US07244326B2

公开(公告)日：2007-07-17

申请号：US10846753

申请日：2004-05-13

申请人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Kenneth D. Schatz ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： B32B37/00

CPC分类号： G06K19/07718 ,  G06K19/07745 ,  H01L21/673 ,  H01L21/6835 ,  H01L23/49855 ,  H01L23/544 ,  H01L24/19 ,  H01L24/76 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/7665 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K3/303 ,  H05K2201/10636 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T156/17 ,  Y10T156/171 ,  Y10T156/1744 ,  Y10T156/1798 ,  H01L2924/00

摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。

公开(公告)号：US07172789B2

公开(公告)日：2007-02-06

申请号：US10634350

申请日：2003-08-04

申请人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

发明人： John Stephen Smith ,  Mark A. Hadley ,  Gordon S. W. Craig ,  Frank Lowe

IPC分类号： B05D5/06

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element. The method further includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid.

摘要翻译： 将结构组装到基板上的方法和装置。 根据本发明的一个方面的方法包括将浆料分配到基底上，其中所述浆料包括第一多个元件，每个元件设计成与所述基底上的受体区域配合，并且每个元件包括功能元件。 该方法还包括将具有第一方向的流浆分配到基底上，其中浆料包括流体。

公开(公告)号：US06468638B2

公开(公告)日：2002-10-22

申请号：US09268755

申请日：1999-03-16

申请人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

发明人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

IPC分类号： H05L100

CPC分类号： H01L24/95 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/50 ,  H01L24/82 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/18 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及将多个块沉积到衬底上并且耦合到其上沉积有互连的柔性层。 本发明的另一个实施方案涉及沿着柔性层的长度形成显示器，其中包含多个元件的浆料在其上洗涤在柔性层上并且滑入在柔性层中发现的凹陷区域或孔中。 然后在其上沉积互连。 在另一个实施例中，互连被放置在柔性层上，随后是含有多个元件的浆料。

公开(公告)号：US07452748B1

公开(公告)日：2008-11-18

申请号：US11159550

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Scott Herrmann ,  Glenn Gengel ,  Randy Eisenhardt

IPC分类号： H01L21/44

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.

摘要翻译： 电子组件的方法和装置。 该方法包括将功能块沉积到凹陷区域中，选择性地在功能块的选定部分和第一基底的选定部分中的至少一个上形成介电层; 以及形成一个或多个电互连到所述功能块。 凹部区域形成在第一基板上。 功能块的沉积发生在连续的纤维网线上并使用流体自组装过程。 功能块具有与所述凹陷区域的宽度 - 深度纵横比基本上一致的宽度 - 深度纵横比，其宽度比等于或小于10.5:1，等于或小于7.5:1。

公开(公告)号：US07353598B2

公开(公告)日：2008-04-08

申请号：US11268837

申请日：2005-11-07

申请人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

发明人： Gordon S. W. Craig ,  Ali A. Tootoonchi ,  Randolph W. Eisenhardt ,  Scott Herrmann ,  Mark A. Hadley ,  Paul S. Drzaic

IPC分类号： H05K3/32

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82

摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。

公开(公告)号：US07214569B2

公开(公告)日：2007-05-08

申请号：US10769572

申请日：2004-01-30

申请人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

发明人： Susan Swindlehurst ,  Mark A. Hadley ,  Paul S. Drzaic ,  Gordon S. W. Craig ,  Glenn Gengel ,  Scott Hermann ,  Aly Tootoochi ,  Randolph W. Eisenhardt

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： G06K19/07752 ,  G06K19/077 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/24 ,  H01L24/29 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L24/95 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13499 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/76155 ,  H01L2224/81201 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2224/81903 ,  H01L2224/82102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83865 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。

公开(公告)号：US07070851B2

公开(公告)日：2006-07-04

申请号：US10176795

申请日：2002-06-21

申请人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

发明人： Jeffrey Jay Jacobsen ,  Glenn Wilhelm Gengel ,  Mark A. Hadley ,  Gordon S. W. Craig ,  John Stephen Smith

IPC分类号： B32B3/00 ,  H05K7/02

CPC分类号： H01L24/95 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/50 ,  H01L24/82 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/18 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/31681 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.