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公开(公告)号：US09060446B2
公开(公告)日：2015-06-16
申请号：US14279465
申请日：2014-05-16
Applicant: Ibiden Co., Ltd.
Inventor： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC: H05K1/18 , H01G4/224 , H01G4/228 , H01G4/40 , H01L21/48 , H01L23/50 , H01L23/64 , H01L25/16 , H05K1/02 , H01L23/498 , H05K1/11 , H05K3/46
CPC classification number: H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
Abstract: A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.
Abstract translation: 印刷电路板包括容纳层，容纳层中容纳的片状电容器器件，以及形成在容纳层上的堆积结构，使得堆积结构覆盖容纳层中的片状电容器器件。 积层结构具有安装导体结构，其被定位成将IC芯片装置安装在积层结构的表面上，使得IC芯片装置直接安装在芯片电容器装置上，每个芯片电容器装置具有电介质体， 所述积聚结构，形成在所述电介质体上且在所述电介质体的表面上延伸的第一电极，以及形成在所述电介质体上并在所述电介质体的表面上延伸的第二电极，并且所述电介质体介于所述第一电极 电极和第二电极。
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Patent Agency Ranking
公开(公告)号：US20150130079A1
公开(公告)日：2015-05-14
申请号：US14601541
申请日：2015-01-21
Applicant: IBIDEN CO., LTD.
Inventor： Hajime SAKAMOTO , Dongdong Wang
IPC: H01L23/498
CPC classification number: H01L23/49838 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49866 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/1147 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24227 , H01L2224/274 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/30107 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2224/82 , H01L2924/3512 , H01L2924/00 , H01L2224/03
Abstract: A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material.
Abstract translation: 多层器件具有树脂层，半导体器件位于树脂层中，并且包括电子部件和具有露出电子部件的电极的开口的钝化层，包含金属层并形成在钝化层的开口中的中间层 层，使得中间层连接到电子部件的电极，以及形成在树脂层上并具有形成在绝缘层中的绝缘层和通路导体的积聚层，使得通孔导体连接到中间层 。 树脂层包含一种或多种选自热固性树脂材料和热塑性树脂材料的树脂材料。
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公开(公告)号：US09245838B2
公开(公告)日：2016-01-26
申请号：US14601541
申请日：2015-01-21
Applicant: IBIDEN CO., LTD.
Inventor： Hajime Sakamoto , Dongdong Wang
IPC: H01L23/49 , H01L23/498 , H01L21/56 , H01L21/683 , H01L23/538 , H01L23/00 , H05K1/18 , H05K3/46
CPC classification number: H01L23/49838 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49866 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/27 , H01L24/97 , H01L2224/0401 , H01L2224/04105 , H01L2224/1147 , H01L2224/12105 , H01L2224/20 , H01L2224/24137 , H01L2224/24227 , H01L2224/274 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/30107 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/09036 , H05K2201/09563 , H05K2201/096 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2224/82 , H01L2924/3512 , H01L2924/00 , H01L2224/03
Abstract: A multilayer device has a resin layer, a semiconductor device positioned in the resin layer and including an electronic component and a passivation layer having an opening exposing an electrode of the electronic component, an intermediate layer including metal layers and formed in the opening of the passivation layer such that the intermediate layer is connected to the electrode of the electronic component, and a buildup layer formed on the resin layer and including an insulating layer and a via conductor formed in the insulating layer such that the via conductor is connected to the intermediate layer. The resin layer includes one or more resin material selected from the group consisting of a thermosetting resin material and a thermoplastic resin material.
Abstract translation: 多层器件具有树脂层，半导体器件位于树脂层中，并且包括电子部件和具有露出电子部件的电极的开口的钝化层，包含金属层并形成在钝化层的开口中的中间层 层，使得中间层连接到电子部件的电极，以及形成在树脂层上并具有形成在绝缘层中的绝缘层和通路导体的积聚层，使得通孔导体连接到中间层 。 树脂层包含一种或多种选自热固性树脂材料和热塑性树脂材料的树脂材料。
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公开(公告)号：US08842440B2
公开(公告)日：2014-09-23
申请号：US13930617
申请日：2013-06-28
Applicant: Ibiden Co., Ltd.
Inventor： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
IPC: H05K1/18
CPC classification number: H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
Abstract: A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip.
Abstract translation: 一种印刷电路板的制造方法，其特征在于，在基板上形成开口部，将所述基板的开口部中的芯片电容器定位，使得所述芯片电容器容纳在所述基板的开口部，形成包含层间树脂 绝缘层和在基板的表面上的导电层和容纳在基板的开口部分中的芯片电容器，并且在构成堆积结构的凸起结构的表面上形成，以便安装IC芯片，使得开口中的芯片电容器 基板的一部分直接位于IC芯片的正下方。
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公开(公告)号：US09717151B2
公开(公告)日：2017-07-25
申请号：US14865061
申请日：2015-09-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka Taniguchi , Dongdong Wang , Michimasa Takahashi
CPC classification number: H05K3/4691 , H05K1/0206 , H05K1/0207 , H05K2201/0323 , H05K2201/096
Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
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公开(公告)号：US20130286615A1
公开(公告)日：2013-10-31
申请号：US13930617
申请日：2013-06-28
Applicant: IBIDEN CO., LTD.
Inventor： Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
CPC classification number: H05K1/181 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L24/16 , H01L24/17 , H01L25/16 , H01L25/162 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/82039 , H01L2224/82047 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01052 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/187 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09509 , H05K2201/09536 , H05K2201/10636 , H05K2201/10674 , H05K2203/063 , Y02P70/611 , Y10T29/435 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
Abstract: A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip.
Abstract translation: 一种印刷电路板的制造方法，其特征在于，在基板上形成开口部，将所述基板的开口部中的芯片电容器定位，使得所述芯片电容器容纳在所述基板的开口部，形成包含层间树脂 绝缘层和在基板的表面上的导电层和容纳在基板的开口部分中的芯片电容器，并且在构成堆积结构的凸起结构的表面上形成，以便安装IC芯片，使得开口中的芯片电容器 基板的一部分直接位于IC芯片的正下方。
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