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公开(公告)号：US20070092654A1
公开(公告)日：2007-04-26
申请号：US11639858
申请日：2006-12-15
申请人： John Smith , Mark Hadley , Gordon Craig , Frank Lowe
发明人： John Smith , Mark Hadley , Gordon Craig , Frank Lowe
CPC分类号： H01L24/32 , B82Y30/00 , H01L21/31122 , H01L21/32136 , H01L21/84 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L27/1214 , H01L28/55 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2224/95136 , H01L2224/95144 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/01084 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/15788 , Y10S977/882 , Y10S977/883 , H01L2224/82 , H01L2924/00
摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction. A method according to another aspect of the invention includes creating a slurry comprising of fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and projecting the slurry through a nozzle toward the substrate. In one particular implementation of this aspect, additional nozzles may be used to provide suction or additional fluid or additional slurry. A method according to another aspect of the invention includes dissolving a bonding agent into a solvent to create a fluid, dispensing a slurry onto a substrate, wherein the slurry includes the fluid and a plurality of elements each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and evaporating the solvent after each of the plurality of elements has mated with a corresponding receptor, wherein the bonding agent bonds each of the plurality of elements to the corresponding receptor region.
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公开(公告)号：US20060249873A1
公开(公告)日：2006-11-09
申请号：US11485687
申请日：2006-07-12
申请人： John Smith , Mark Hadley , Gordon Craig , Frank Lowe
发明人： John Smith , Mark Hadley , Gordon Craig , Frank Lowe
CPC分类号： H01L24/95 , B81C1/00357 , B81C1/00428 , B81C2201/019 , B82Y30/00 , G02F1/1362 , G02F2001/136295 , H01L21/0274 , H01L21/3065 , H01L21/3083 , H01L21/31144 , H01L21/4803 , H01L23/5389 , H01L24/24 , H01L24/31 , H01L24/82 , H01L24/97 , H01L2224/24225 , H01L2224/24227 , H01L2224/32225 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2224/95136 , H01L2224/95144 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/01084 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10S977/883 , H01L2224/82 , H01L2924/00
摘要： Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a method, each of the elements include an electrical component and are assembled into one of the openings by a fluidic self assembly process. In an particular example of a method to create such an opening, the substrate is etched through a first patterned mask and is later etched through a second patterned mask. Typically, the second patterned mask is aligned relative to the opening created by etching through the first patterned mask and has an area of exposure which is smaller than an area of exposure through the first patterned mask. In another example of a method, a photosensitive material is exposed through a patterned mask to oblique sources of light such that some of the light impinges into a first portion of the photosensitive material which is under the patterned mask, and the patterned mask and a second portion of the photosensitive material, which is under the patterned mask, is removed. In another example of a method, an opening in a first layer, which comprises silicon dioxide, is formed by depositing a second layer over the first layer and depositing a tungsten layer over the second layer. The tungsten and second layers are patterned to expose a portion of the first layer, and this portion is etched. Various apparatuses which may be made using these methods are also described.
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公开(公告)号：US20080036087A1
公开(公告)日：2008-02-14
申请号：US11869665
申请日：2007-10-09
申请人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
发明人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
CPC分类号： H01L24/95 , H01L23/5387 , H01L23/5389 , H01L24/18 , H01L24/50 , H01L24/82 , H01L24/97 , H01L25/50 , H01L2224/18 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01084 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/31681 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及将多个块沉积到衬底上并且耦合到其上沉积有互连的柔性层。 本发明的另一个实施方案涉及沿着柔性层的长度形成显示器，其中包含多个元件的浆料在其上洗涤在柔性层上并且滑入在柔性层中发现的凹陷区域或孔中。 然后在其上沉积互连。 在另一个实施例中，互连被放置在柔性层上，随后是含有多个元件的浆料。
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公开(公告)号：US20050255620A1
公开(公告)日：2005-11-17
申请号：US11169534
申请日：2005-06-28
申请人： Mark Hadley , Ann Chiang , Gordon Craig , Jeffrey Jacobsen , John Smith , Jay Tu , Roger Stewart
发明人： Mark Hadley , Ann Chiang , Gordon Craig , Jeffrey Jacobsen , John Smith , Jay Tu , Roger Stewart
IPC分类号： G02F1/1333 , G02F1/1343 , G02F1/1362 , H01L21/77 , H01L21/84 , H01L21/98 , H01L25/075 , H01L31/0304 , H01L31/103 , H01L31/109
CPC分类号： H01L27/1214 , G02F1/133305 , G02F1/1362 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L29/0657 , H01L2224/24101 , H01L2224/24137 , H01L2224/24227 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95145 , H01L2224/97 , H01L2251/5338 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/10158 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , H01S5/0201 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.
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公开(公告)号：US20050046018A1
公开(公告)日：2005-03-03
申请号：US10966617
申请日：2004-10-14
申请人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
发明人： Jeffrey Jacobsen , Glenn Gengel , Mark Hadley , Gordon Craig , John Smith
IPC分类号： G02F1/1345 , G09F9/00 , G09F9/30 , G09F9/35 , H01L21/02 , H01L21/336 , H01L21/98 , H01L23/538 , H01L27/12 , H01L27/32 , H01L29/786 , H01L33/00 , H01L51/50 , H05B33/02 , H01L27/00 , H01L21/70
CPC分类号： H01L24/95 , H01L23/5387 , H01L23/5389 , H01L24/18 , H01L24/50 , H01L24/82 , H01L24/97 , H01L25/50 , H01L2224/18 , H01L2224/76155 , H01L2224/7665 , H01L2224/82102 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01084 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/30105 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926 , Y10T428/31681 , H01L2224/82 , H01L2924/00
摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.
摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及将多个块沉积到衬底上并且耦合到其上沉积有互连的柔性层。 本发明的另一个实施方案涉及沿着柔性层的长度形成显示器，其中包含多个元件的浆料在其上洗涤在柔性层上并且滑动到柔性层中发现的凹陷区域或孔中。 然后在其上沉积互连。 在另一个实施例中，互连被放置在柔性层上，随后是含有多个元件的浆料。
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6.发明申请公开(公告)号：US20070117274A1
公开(公告)日：2007-05-24
申请号：US11654312
申请日：2007-01-16
申请人： Susan Swindlehurst , Mark Hadley , Paul Drzaic , Gordon Craig , Glenn Gengel , Scott Herrmann , Aly Tootoochi , Randolph Eisenhardt
发明人： Susan Swindlehurst , Mark Hadley , Paul Drzaic , Gordon Craig , Glenn Gengel , Scott Herrmann , Aly Tootoochi , Randolph Eisenhardt
IPC分类号： H01L21/00
CPC分类号： G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
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公开(公告)号：US20060148166A1
公开(公告)日：2006-07-06
申请号：US11268837
申请日：2005-11-07
申请人： Gordon Craig , Ali Tootoonchi , Randolph Eisenhardt , Scott Herrmann , Mark Hadley , Paul Drzaic
发明人： Gordon Craig , Ali Tootoonchi , Randolph Eisenhardt , Scott Herrmann , Mark Hadley , Paul Drzaic
IPC分类号： H01L21/8238
CPC分类号： G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.
摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。
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公开(公告)号：US20060117554A1
公开(公告)日：2006-06-08
申请号：US10997608
申请日：2004-11-23
申请人： Scott Herrmann , Mark Hadley , Gordon Craig , John Hattick , Paul Drzaic , Eric Kanemoto
发明人： Scott Herrmann , Mark Hadley , Gordon Craig , John Hattick , Paul Drzaic , Eric Kanemoto
CPC分类号： G06K19/07735 , G06K19/077 , G08B13/244 , H01Q17/004 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124
摘要： Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.
摘要翻译： 描述了用于保护射频识别（RFID）设备的方法和设备。 在一个方面，静电消散材料被应用于天线结构的腹板。 静电消散材料的涂层连续地施加在卷筒材料卷的多个天线结构上。 将RFID集成电路（IC）连接到具有耗散涂层的天线结构网上，随后在辊上进行测试。 执行对RFID标签的附加处理以产生RFID标签。
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9.发明申请Method of making a flexible substrate containing self-assembling microstructures 审中-公开制造含有自组装微结构的柔性基板的方法公开(公告)号：US20060210769A1
公开(公告)日：2006-09-21
申请号：US11409632
申请日：2006-04-24
申请人： Susan Swindlehurst , Mark Hadley , Gordon Craig , Eng-Pi Chang , Philip Chu , Dong-Tsai Hseih , Robert Pricone , Scott Thielman
发明人： Susan Swindlehurst , Mark Hadley , Gordon Craig , Eng-Pi Chang , Philip Chu , Dong-Tsai Hseih , Robert Pricone , Scott Thielman
IPC分类号： G11B5/64
CPC分类号： H01L24/97 , G02F1/133305 , H01L23/5387 , H01L24/24 , H01L24/82 , H01L24/95 , H01L25/50 , H01L51/52 , H01L2221/68354 , H01L2224/13022 , H01L2224/24227 , H01L2224/7665 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01052 , H01L2924/01058 , H01L2924/01061 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/04953 , H01L2924/10158 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/1579 , Y10T428/24355 , Y10T428/24479 , Y10T428/24612 , H01L2224/82 , H01L2924/00
摘要： A substrate has embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 1000 μm or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 μm or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 1010 dynes/cm2 and a viscoelastic index of less than about 0.1.
摘要翻译： 衬底上已经在其上压印了多个具有预定精确几何轮廓的成形凹槽，每个凹槽具有一个主要尺寸为大约1000μm或更小的平坦底表面，该基底能够在约约1小时的时间内经历约1小时的热循环 同时保持压花成形凹陷的约±10μm或更小的尺寸稳定性，并且其中所述基底包括无定形热塑性材料。 在热循环期间，基底的弹性模量大于约10/10达因/厘米2，粘弹性指数小于约0.1。
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公开(公告)号：US20060269689A1
公开(公告)日：2006-11-30
申请号：US11452444
申请日：2006-06-13
申请人： Gordon Craig , Ming Chan , Cornelius Sutu , Omar Alvarado , Hoang Pham , Mark Hadley
发明人： Gordon Craig , Ming Chan , Cornelius Sutu , Omar Alvarado , Hoang Pham , Mark Hadley
CPC分类号： H05K13/027 , H01L21/67144 , H01L24/95 , H01L25/50 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2224/95136 , H01L2924/01005 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/15155 , H01L2924/15165 , Y10S29/046 , Y10T29/49133 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T29/53261 , H01L2924/15153
摘要： An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.
摘要翻译： 一种用于在衬底上分配流体中的块的装置。 该装置包括具有第一端和第二端的第一管。 压缩装置连接到第一管。 第二管连接到第一管，以将具有块的浆料输送到第一管。 压缩装置使流过第一管的一部分的浆料中的至少一个块脉动。
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