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公开(公告)号：US4455202A
公开(公告)日：1984-06-19
申请号：US404316
申请日：1982-08-02
IPC分类号： C25C3/02
CPC分类号： C25C3/02
摘要： Process for producing lithium by electroreduction of a lithium compound dispersed in a fused salt electrolyte and deposition of said electroreduced lithium in a liquid metal cathode from which said lithium is recovered.
摘要翻译： 通过电解还原分散在熔盐电解质中的锂化合物并将所述电还原锂沉积在回收所述锂的液态金属阴极中来生产锂的方法。
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公开(公告)号：US08493746B2
公开(公告)日：2013-07-23
申请号：US12704592
申请日：2010-02-12
申请人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
发明人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S. N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
CPC分类号： H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
摘要： In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
摘要翻译： 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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公开(公告)号：US07344679B2
公开(公告)日：2008-03-18
申请号：US11163327
申请日：2005-10-14
CPC分类号： G01N13/04 , Y10T436/11
摘要： An apparatus and a method are disclosed for providing point of care testing for osmolarity of a bodily fluid. An apparatus is disclosed as having a fluid pathway passing through it for receiving and testing a sample fluid. The invention permits osmolarity testing of a sample fluid wherein the sample fluid has a volume of less than approximately 30 nL, and implements a method and device to measure fluid osmolarity in a clinical setting quickly and accurately, while also reducing evaporation of the fluid.
摘要翻译： 公开了一种用于提供用于体液的渗透压的护理测试点的装置和方法。 公开了一种具有通过它的流体路径用于接收和测试样品流体的装置。 本发明允许样品流体的渗透压测试，其中样品流体具有小于约30nL的体积，并且实现了在临床设置中快速且准确地测量流体渗透压的方法和装置，同时还减少了流体的蒸发。
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公开(公告)号：US5925443A
公开(公告)日：1999-07-20
申请号：US758991
申请日：1991-09-10
申请人： Farid Youssif Aoude , Lawrence Daniel David , Renuka Shastri Divakaruni , Shaji Farooq , Lester Wynn Herron , Hal Mitchell Lasky , Anthony Mastreani , Govindarajan Natarajan , Srinivasa S. N. Reddy , Vivek Madan Sura , Rao Venkateswara Vallabhaneni , Donald Rene Wall
发明人： Farid Youssif Aoude , Lawrence Daniel David , Renuka Shastri Divakaruni , Shaji Farooq , Lester Wynn Herron , Hal Mitchell Lasky , Anthony Mastreani , Govindarajan Natarajan , Srinivasa S. N. Reddy , Vivek Madan Sura , Rao Venkateswara Vallabhaneni , Donald Rene Wall
CPC分类号： H05K1/092 , H01L21/486 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K3/4611 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/252 , Y10T428/31678
摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
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公开(公告)号：US5655213A
公开(公告)日：1997-08-05
申请号：US553226
申请日：1995-11-07
CPC分类号： C03C17/3607 , C03C17/36 , C03C17/3649 , C04B41/009 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/4846 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L23/3731 , C03C2217/40 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , Y10T428/12 , Y10T428/12007 , Y10T428/12167
摘要： A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.
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6.发明授权Co-sintered surface metallization for pin-join, wire-bond and chip attach 失效用于引脚接合，引线接合和芯片连接的共烧结表面金属化
公开(公告)号：US5639562A
公开(公告)日：1997-06-17
申请号：US553227
申请日：1995-11-07
CPC分类号： C03C17/3607 , C03C17/36 , C03C17/3649 , C04B41/009 , C04B41/52 , C04B41/89 , C23C26/00 , H01L21/4846 , H01L21/4853 , H01L21/4857 , H01L21/4867 , H01L23/3731 , C03C2217/40 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , Y10T428/12 , Y10T428/12007 , Y10T428/12167
摘要： A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.
摘要翻译： 通过用多个复合金属浆料和/或油墨冲压和筛选多个陶瓷生片形成共烧结陶瓷基片结构并层压该结构。 共烧结表面金属化包括双重筛选的复合金属糊料，一个在另一个上并结合到烧结的陶瓷基底上，以提供表面金属化与烧结陶瓷基底的结合。
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7.发明授权
公开(公告)号：US5167913A
公开(公告)日：1992-12-01
申请号：US813244
申请日：1991-12-23
申请人： John Acocella , Philip L. Flaitz , Raj N. Master , Chandrasekhar Narayan , Sarah H. Knickerbocker , Paul H. Palmateer , Sampath Purushothaman , Srinivasa S. N. Reddy
发明人： John Acocella , Philip L. Flaitz , Raj N. Master , Chandrasekhar Narayan , Sarah H. Knickerbocker , Paul H. Palmateer , Sampath Purushothaman , Srinivasa S. N. Reddy
CPC分类号： H05K3/1291 , H01L21/4846 , H01L21/486 , H05K1/092 , H05K2203/1126 , H05K3/4629 , Y10T428/12528 , Y10T428/12611
摘要： A method of forming an adherent layer of metallurgy on a ceramic substrate which includes the steps of obtaining a ceramic material containing a polymeric binder and copper metallurgy patterns within the ceramic body. In one embodiment of the invention, the ceramic body also contains MgO.Thereafter, a surface layer of metallurgy is formed on the surface of the ceramic body. In one embodiment, the surface layer is nickel and in another embodiment, the surface layer is copper or gold.Then, the ceramic body undergoes a sintering cycle which includes the steps of pyrolysis, binder burnoff and, lastly, densification and, in some cases, crystallization. During densification and crystallization, there is a predetermined steam atmosphere which meets the following requirements: a partial pressure of oxygen less than that necessary to satisfy the equilibrium equation 4Cu+O.sub.2 =2Cu.sub.2 O; and a partial pressure of oxygen less than or equal to that necessary to satisfy the equilibrium equation 2Ni+O.sub.2 =2NiO for nickel in said surface metallurgy.
摘要翻译： 一种在陶瓷基板上形成冶金粘附层的方法，包括以下步骤：在陶瓷体内获得含有聚合物粘合剂和铜冶金图案的陶瓷材料。 在本发明的一个实施例中，陶瓷体还含有MgO。 此后，在陶瓷体的表面上形成表面冶金层。 在一个实施方案中，表面层是镍，在另一个实施方案中，表面层是铜或金。 然后，陶瓷体经历烧结循环，其包括热解，粘合剂燃烧的步骤，最后是致密化，在某些情况下，结晶。 在致密化和结晶过程中，有一个预定的蒸气气氛满足以下要求：氧气分压小于满足平衡方程式4Cu + O2 = 2Cu2O所需的氧分压; 以及小于或等于满足所述表面冶金中镍的平衡方程式2Ni + O2 = 2NiO所需的氧分压。
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公开(公告)号：US5053361A
公开(公告)日：1991-10-01
申请号：US523949
申请日：1990-05-16
IPC分类号： B32B18/00 , C04B35/634 , C04B35/638 , H01L21/48
CPC分类号： B32B18/00 , C04B35/04 , C04B35/117 , C04B35/14 , C04B35/45 , C04B35/48 , C04B35/634 , C04B35/638 , C04B38/00 , H01L21/4857 , C04B2235/3217 , C04B2235/3281 , C04B2235/6562 , C04B2235/658 , C04B2235/6582 , C04B2235/6588 , C04B2235/9623 , C04B2237/34 , C04B2237/341 , C04B2237/562 , C04B2237/565
摘要： There is disclosed a partially sintered setter tile for use in the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in a partially sintered setter tile in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate and partially sintered setter tile are sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.
摘要翻译： 公开了一种用于在其烧结期间从多层陶瓷基板层压体去除碳的部分烧结的固定砖。 具有金属线和通孔的多层陶瓷基板层叠体在靠近基板层压体的部分烧结的安装器瓦中设置有可还原的金属氧化物。 多层陶瓷基板层叠体包含聚合物粘合剂，其在加热时解聚成碳。 在相对于可还原金属氧化物还原并且相对于碳氧化的气氛中，将基板层压体和部分烧结的固定器瓦片烧结。
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公开(公告)号：US20090267228A1
公开(公告)日：2009-10-29
申请号：US12111510
申请日：2008-04-29
申请人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
发明人： Charles L. Arvin , Carla A. Bailey , Harry D. Cox , Hua Gan , Hsichang Liu , Arthur G. Merryman , Vall F. McClean , Srinivasa S. N. Reddy , Brian R. Sundlof
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/03462 , H01L2224/03472 , H01L2224/03831 , H01L2224/0401 , H01L2224/05011 , H01L2224/05017 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2924/00013 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/14 , H01L2924/1461 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00 , H01L2224/05552
摘要： One embodiment of the present invention is directed to an under bump metallurgy material. The under bump metallurgy material of this embodiment includes an adhesion layer and a conduction layer formed on top of the adhesion layer. The under bump metallurgy material of this embodiment also includes a barrier layer plated on top of the conduction layer and a sacrificial layer plated on top of the barrier layer. The conduction layer of this embodiment includes a trench formed therein, the trench contacting a portion of the barrier layer and blocking a path of intermetallic formation between the conduction layer and the sacrificial layer.
摘要翻译： 本发明的一个实施例涉及一种凸块下金属材料。 本实施方式的凸块状冶金材料包括粘合层和形成在粘合层顶部的导电层。 该实施例的凸块下冶金材料还包括电镀在导电层顶部上的阻挡层和镀在阻挡层顶部上的牺牲层。 该实施例的导电层包括在其中形成的沟槽，沟槽接触势垒层的一部分并且阻挡导电层和牺牲层之间的金属间形成路径。
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公开(公告)号：US06339527B1
公开(公告)日：2002-01-15
申请号：US09470456
申请日：1999-12-22
IPC分类号： H01G4008
CPC分类号： H01L28/40 , H01L21/31683
摘要： The capacitor on a ceramic substrate one by unique film metallization including in one embodiment an in situ oxidation of titanium to create a metal oxide capacitor. The combination of metals when used with the appropriate optimized oxidation conditions and parameters ensures a high yielding capacitor with high capacitance in absence of noble metals and with ease of manufacture providing a low cost, high yield capacitor on ceramic.
摘要翻译： 陶瓷衬底上的电容器通过独特的膜金属化，包括在一个实施方案中，原位氧化钛以产生金属氧化物电容器。 当与适当的优化氧化条件和参数一起使用时，金属的组合确保了在不存在贵金属的情况下具有高电容的高产电容器，并且易于制造，在陶瓷上提供低成本，高产率的电容器。
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