公开(公告)号：US06841746B2

公开(公告)日：2005-01-11

申请号：US10414343

申请日：2003-04-14

Applicant: Marvin Glenn Wong ,  Lewis R. Dove ,  Julius K. Botka

Inventor： Marvin Glenn Wong ,  Lewis R. Dove ,  Julius K. Botka

IPC: H01H29/28 ,  H01H61/00 ,  H01H29/00

CPC classification number: H01H29/28 ,  H01H61/00 ,  H01H2029/008 ,  H01H2061/006

Abstract: A switch having first and second mated substrates that define therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.

Abstract translation: 一种具有第一和第二配合基板的开关，其在弯曲开关流体腔的第一和第二相交通道之间限定它们。 开关流体保持在弯曲的开关流体腔内，并响应于施加到开关流体的力而在第一和第二开关状态之间移动。 更多的开关流体在第一开关状态下被迫进入第一相交通道，并且在第二开关状态下，更多的开关流体被迫进入相交通道中的第二个。

公开(公告)号：US05999861A

公开(公告)日：1999-12-07

申请号：US872285

申请日：1997-06-10

Applicant: Lewis R. Dove ,  Daniel J. Miller

Inventor： Lewis R. Dove ,  Daniel J. Miller

IPC: G06F17/50 ,  G06F19/00 ,  G06G7/66

CPC classification number: G06F17/5068

Abstract: A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.

Abstract translation: 提出了一种用于设计RF模块化混合电路组件的方法和装置。 该装置包括基于规则的控制机制，图形用户界面和包括模型前端和后端以及输入/输出实例的RF混合元件库。 该方法包括以下步骤：初始化标准化的前平面模型和后平面模型，沿着背面的周边添加输入/输出实例，在前平面上设计混合电路并组合两个平面以得到RF模块 混合布局设计。 提供RF混合元件的数据库，以促进快速原型设计。 然后将最终设计同时发送到光绘图仪和用于印刷厚膜并分别切割PTH的激光子系统。

公开(公告)号：US06809931B2

公开(公告)日：2004-10-26

申请号：US10615472

申请日：2003-07-07

Applicant: Lewis R. Dove ,  Marvin G. Wong

Inventor： Lewis R. Dove ,  Marvin G. Wong

IPC: H05K720

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3677 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that the area between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

公开(公告)号：US5504986A

公开(公告)日：1996-04-09

申请号：US397594

申请日：1995-03-02

Applicant: John F. Casey ,  Ronald W. Schroeder ,  Lewis R. Dove ,  Philip J. Yearsley

Inventor： John F. Casey ,  Ronald W. Schroeder ,  Lewis R. Dove ,  Philip J. Yearsley

IPC: H05K1/02 ,  H01C17/065 ,  H01C17/242 ,  H01L23/64 ,  H01L27/01 ,  H05K1/09 ,  H05K1/16 ,  H05K3/02 ,  H01C17/06

CPC classification number: H05K1/167 ,  H01C17/065 ,  H01C17/242 ,  H01L23/647 ,  H01L24/48 ,  H01L24/49 ,  H01L27/013 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0237 ,  H05K1/092 ,  H05K2201/0317 ,  H05K2201/09236 ,  H05K2203/049 ,  H05K2203/171 ,  H05K3/027

Abstract: A collinear terminated transmission line structure and method for producing same is presented. The structure comprises a plurality of conductors electrically connected to a plurality of resistors. A predetermined spacing between each of the plurality of conductors ranges from 2 mils to 7 mils. Greater spacings are easily accomplished with the present method. The method comprises the steps of screen-printing a resistor swath onto a substrate, the swath being adjacent to one end of the plurality of conductors. After the substrate is dipped into a solution, the resistor swath is laser trimmed to form the plurality of resistors. The substrate is then rinsed with warm water to remove the solution. The solution can be a poly-vinyl alcohol and isopropyl alcohol mixture.

Abstract translation: 提出了共线终端传输线结构及其制造方法。 该结构包括电连接到多个电阻器的多个导体。 多个导体中的每一个之间的预定间隔范围为2密耳至7密耳。 使用本方法可以容易地实现更大的间隔。 该方法包括以下步骤：将电阻丝网丝网印刷到基底上，该条带与多个导体的一端相邻。 在将基板浸入溶液中之后，电阻器条被激光修整以形成多个电阻器。 然后用温水冲洗底物以除去溶液。 该溶液可以是聚乙烯醇和异丙醇混合物。

公开(公告)号：US5426405A

公开(公告)日：1995-06-20

申请号：US366000

申请日：1994-12-29

Applicant: Daniel J. Miller ,  Kim H. Chen ,  Lewis R. Dove ,  Vaddoarahalli K. Nagesh

Inventor： Daniel J. Miller ,  Kim H. Chen ,  Lewis R. Dove ,  Vaddoarahalli K. Nagesh

IPC: H01L23/50 ,  H01L23/40 ,  H01P1/02 ,  H01P3/08 ,  H01P5/08 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L23/32

CPC classification number: H01L23/66 ,  H01L23/4006 ,  H05K1/141 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/0243 ,  H05K1/0286 ,  H05K2201/10393 ,  H05K2201/10477 ,  H05K2201/10946 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/368

Abstract: A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.

Abstract translation: 具有高频互连的一系列模块化混合组件由附接到母板的高频电路组件实现。 每个组件包括标准化的导电元件和可定制的转变和电路区域。 可定制的转换可以放置在导电元件的任何地方，并且能够实现低频和高频性能。 组件的附接可以通过标准化的夹紧结构实现，该结构将弹性构件压缩在导电元件上，或通过弯曲导电元件并在端部焊接到主板上的附接位置。 模块化混合组件系列的每个成员提供从电路组件上的传输线到主板上的传输线的受控阻抗转变。

公开(公告)号：US07265043B2

公开(公告)日：2007-09-04

申请号：US11510102

申请日：2006-08-25

Applicant: John F. Casey ,  Lewis R. Dove ,  Ling Liu ,  James R. Drehle ,  R. Frederick Rau, Jr. ,  Rosemary O. Johnson ,  Julius Botka

Inventor： John F. Casey ,  Lewis R. Dove ,  Ling Liu ,  James R. Drehle ,  R. Frederick Rau, Jr. ,  Rosemary O. Johnson ,  Julius Botka

IPC: H01L21/44

CPC classification number: H05K1/0221 ,  H01C17/065 ,  H01L2924/0002 ,  H01P11/003 ,  H05K1/0237 ,  H05K1/053 ,  H05K1/092 ,  H05K1/167 ,  H05K3/06 ,  H05K3/4664 ,  H05K2201/09809 ,  H05K2201/09981 ,  H05K2203/1476 ,  H01L2924/00

Abstract: Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In one embodiment, before the subsintering, the conductive thickfilm is patterned to define at least one conductor. In another embodiment, after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired at a full sintering temperature.

Abstract translation: 公开了使用厚膜组件制造微波电路的方法。 在一个实施例中，该方法包括在接地平面上沉积电介质，然后在电介质上形成导体。 导体通过在电介质上沉积导电厚膜并且然后“导通”导电厚膜形成。 在一个实施例中，在子切割之前，将导电厚膜图案化以限定至少一个导体。 在另一个实施例中，在子切换之后，将导电厚膜图案化以限定至少一个导体。 在再次切割之后，蚀刻导电厚膜以暴露导体，然后在完全烧结温度下对导体进行烧制。

公开(公告)号：US07022251B2

公开(公告)日：2006-04-04

申请号：US10601042

申请日：2003-06-19

Applicant: John F. Casey ,  Lewis R. Dove ,  Ling Liu ,  James R. Drehle ,  R. Frederick Rau, Jr. ,  Rosemary O. Johnson

Inventor： John F. Casey ,  Lewis R. Dove ,  Ling Liu ,  James R. Drehle ,  R. Frederick Rau, Jr. ,  Rosemary O. Johnson

IPC: C23F1/00

CPC classification number: H01P11/003 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/06 ,  H05K3/38 ,  H05K2203/1131 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49163

Abstract: Disclosed is a method for forming a conductor on a dielectric. The method commences with the deposition of a conductive thickfilm on the dielectric, followed by a “subsintering” of the conductive thickfilm. Either before or after the subsintering, the conductive thickfilm is patterned to define at least one conductor. After subsintering, the conductive thickfilm is etched to expose the conductor(s), and the conductor(s) are then fired. A brief chemical etch may be used after the final firing step if improved wire-bondability is required.

Abstract translation: 公开了一种在电介质上形成导体的方法。 该方法开始于在电介质上沉积导电厚膜，接着是导电厚膜的“次级”。 在接下来的切割之前或之后，导电厚膜被图案化以限定至少一个导体。 在次切割之后，蚀刻导电厚膜以暴露导体，然后将导体烧制。 如果需要改进的引线接合性，则在最后的烧制步骤之后可以使用简单的化学蚀刻。

公开(公告)号：US06894590B2

公开(公告)日：2005-05-17

申请号：US10449544

申请日：2003-05-30

Applicant: Lewis R. Dove ,  Robert E. Alman ,  James P. Stephens ,  Michael T. Powers ,  Michael B. Whitener

Inventor： Lewis R. Dove ,  Robert E. Alman ,  James P. Stephens ,  Michael T. Powers ,  Michael B. Whitener

IPC: H01P5/08 ,  H01P1/04

CPC classification number: H01P5/085 ,  Y10T29/49117

Abstract: An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.

Abstract translation: 与支撑地平面的基板上形成的微电路的界面。 衬底支撑具有电连接到接地平面的金涂覆的倾斜侧壁的电介质结构。 连接到微电路的传输线由电介质结构支撑。 同轴电缆连接至传输线。 所述同轴电缆的端部以与所述电介质结构的倾斜侧壁大致相同的角度剥离，其中所述中心导体的所述暴露长度结合到所述传输线，并且所述同轴电缆的外导体被接合到 在电介质结构上镀金，使得同轴电缆的倾斜部分与厚膜电介质的斜面配合。

公开(公告)号：US06825429B2

公开(公告)日：2004-11-30

申请号：US10403743

申请日：2003-03-31

Applicant: Lewis R. Dove ,  Marvin Glenn Wong

Inventor： Lewis R. Dove ,  Marvin Glenn Wong

IPC: H01H904

CPC classification number: H01H29/28 ,  H01H2029/008

Abstract: One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint. In case (b) the cover block may be soldered to dielectric layer. In another embodiment for cases (a) and (b) glass frit is used in place of solder. Disturbances to signal line impedance may be compensated by changes in signal conductor width. The layer of suitable dielectric material may be a thin sheet or gasket of previously patterned ceramic material, or it may be formed by the application of a thick film paste. Suitable thick film dielectric materials deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141 A/D thick film compositions from DuPont.

Abstract translation: 可能具有相同表面信号导体的衬底上的一个或多个LIMMS器件通过以下方式密封：（a）将每个整个LIMMS器件封闭在与LIMMS器件分开的通用或相应的外盖下方，并且不可渗透 污染物 或（b）制造每个LIMMS装置，使其单独的盖块（其已经是LIMMS的部件并且不是单独的外盖）可以与衬底气密密封。 每种情况都必须限制气密密封对阻抗的影响。 在（a）的情况下，衬底被与分离的外盖的周边的带状足迹相匹配的介电材料层覆盖。 在（b）的情况下，衬底上的LIMMS覆盖块的整个（实心）占地面积接收一层电介质材料，该材料层本身可以用合适的粘合剂在其周边附近被覆盖。 在（a）的情况下，外盖可以焊接到周边覆盖区。 在（b）的情况下，盖块可以焊接到电介质层。 在（a）和（b）的情况的另一实施例中，使用玻璃料代替焊料。 信号线阻抗的干扰可以通过信号导体宽度的变化来补偿。 合适的介电材料层可以是先前图案化的陶瓷材料的薄片或垫片，或者可以通过施加厚膜糊形成。 作为糊料沉积并随后固化的合适的厚膜电介质材料包括来自Heraeus的KQ 150和KQ 115厚膜电介质和来自DuPont的4141A / D厚膜组合物。

公开(公告)号：US5736784A

公开(公告)日：1998-04-07

申请号：US740595

申请日：1996-10-31

Applicant: Lewis R. Dove

Inventor： Lewis R. Dove

IPC: H01L23/498 ,  H01L23/66 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/48 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/45 ,  H05K1/0243 ,  H05K3/3426 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/45013 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/141 ,  H05K2201/0792 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A variable-width lead interconnection structure disposed between a printed circuit board and a multichip module is presented. An edge clip with leads having a widened middle section is provided to optimize manufacturability and electrical performance. Each lead has a characteristic width and spacing of conventional leads where the leads are soldered to a multichip module or PCB. However, in between each end, each lead has a middle section that is widened to provide a characteristic impedance closer to the ideal 50 ohms, thus producing structures with better return loss at high frequencies.

Abstract translation: 提出了布置在印刷电路板和多芯片模块之间的可变宽度引线互连结构。 提供具有加宽中间部分的引线的边缘夹以优化可制造性和电性能。 每个引线具有传统引线的特征宽度和间距，其中引线焊接到多芯片模块或PCB。 然而，在每个端部之间，每个引线具有被加宽的中间部分，以提供更接近理想的50欧姆的特征阻抗，从而产生在高频下具有更好的回波损耗的结构。