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23 条记录 (耗时 0.023 秒)

    Electrical connector for opto-electronic modules
    2.
    发明授权
    Electrical connector for opto-electronic modules 有权
    光电模块用电接头

    公开(公告)号：US06802654B1

    公开(公告)日：2004-10-12

    申请号：US10119619

    申请日：2002-04-09

    申请人： Bruce C. Roberts ,  Stephen A. Gee ,  William P. Mazotti ,  Luu T. Nguyen ,  Jia Liu ,  Peter Deane ,  Ken Pham

    发明人： Bruce C. Roberts ,  Stephen A. Gee ,  William P. Mazotti ,  Luu T. Nguyen ,  Jia Liu ,  Peter Deane ,  Ken Pham

    IPC分类号： G02B636

    CPC分类号： H05K1/0219 ,  G02B6/4245 ,  G02B6/4261 ,  G02B6/4284 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121

    摘要： The invention comprises a connector apparatus for electrically interconnecting a chip sub-assembly to an optical sub-assembly. The apparatus includes a connector sleeve with a chip sub-assembly having at least one electrical connection arranged thereon. The connector sleeve is suitable for receiving a connector plug that includes an optical fiber optically coupled to the photonic devices of an optical sub-assembly that includes electrical connectors. The connector plug is engaged with the connector sleeve, thereby electrically interconnecting the electrical connections of the chip sub-assembly to the electrical connectors of the optical sub-assembly such that electrical signals can pass between the chip sub-assembly and a photonic device of the optical sub-assembly.

    摘要翻译： 本发明包括用于将芯片子组件电连接到光学子组件的连接器装置。 该装置包括具有芯片子组件的连接器套筒，其具有布置在其上的至少一个电连接。 连接器套筒适于接收连接器插头，该连接器插头包括光学耦合到包括电连接器的光学子组件的光子器件的光纤。 连接器插头与连接器套筒接合，由此将芯片子组件的电连接电连接到光学子组件的电连接器，使得电信号可以在芯片子组件和光子装置的光子器件之间通过 光学子组件。

    Method of making plastic encapsulated integrated circuit package
    4.
    发明授权
    Method of making plastic encapsulated integrated circuit package 失效
    塑料封装集成电路封装方法

    公开(公告)号：US5437095A

    公开(公告)日：1995-08-01

    申请号：US171713

    申请日：1993-12-21

    申请人： Luu T. Nguyen ,  Hem P. Takiar

    发明人： Luu T. Nguyen ,  Hem P. Takiar

    IPC分类号： H01L23/50 ,  H01L21/56 ,  H01L23/495 ,  H01R43/00

    CPC分类号： H01L23/49541 ,  H01L21/565 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49121

    摘要： A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the package's formation. The package itself includes an IC chip having an army of chip output/input terminals, and means for supporting the chip including an array of electrically conductive leads, all of which are provided for connection with the output/input terminals of the IC chip. In addition, the overall package includes bonding wires connecting the chip output/input terminals with respective ones of the leads such that each bonding wire extends in a direction that defines an acute angle of less than 45 degrees with the given flow direction of the plastic material used to encapsulate the IC chip, support means and bonding wires. In a preferred embodiment, at least a portion and most preferably substantially all of the bonding wires are substantially parallel with the given flow direction of the plastic material.

    摘要翻译： 本文公开了制造集成电路封装的方法以及封装本身，该封装本身由塑料封装，在封装的形成过程中，封装件被塑料封装，使其沿给定的方向流动。 封装本身包括具有芯片输出/输入端子的一部分的IC芯片，以及用于支持包括导电引线阵列的芯片的装置，所有这些芯片都设置用于与IC芯片的输出/输入端子连接。 此外，整体封装包括将芯片输出/输入端子与相应的引线相连的接合线，使得每个接合线沿塑料材料的给定流动方向沿着限定小于45度的锐角的方向延伸 用于封装IC芯片，支撑装置和接合线。 在优选实施例中，至少一部分，最优选基本上所有的接合线基本上与塑料材料的给定流动方向平行。

    Inkjet printed leadframes
    6.
    发明授权
    Inkjet printed leadframes 有权
    喷墨打印引线框

    公开(公告)号：US07667304B2

    公开(公告)日：2010-02-23

    申请号：US12110991

    申请日：2008-04-28

    申请人： Randall L. Walberg ,  Luu T. Nguyen ,  Anindya Poddar

    发明人： Randall L. Walberg ,  Luu T. Nguyen ,  Anindya Poddar

    IPC分类号： H01L23/495 ,  H01L21/44

    CPC分类号： H01L21/4821 ,  H01L21/6835 ,  H01L23/49579 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2924/14 ,  H01L2924/00

    摘要： Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.

    摘要翻译： 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板，以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板，该导电衬底面板具有多个单独的器件阵列，每个单独的器件阵列包括多个电互连图案，每个均包括安装在导电衬底面板上的多个集成电路器件，以及封装集成电路器件和相关联的电互连图案的模制帽。 模制帽在每个分离的装置阵列上具有基本均匀的厚度，并且延伸到分离的装置阵列之间的空间中。

    INKJET PRINTED LEADFRAMES
    7.
    发明申请
    INKJET PRINTED LEADFRAMES 有权

    公开(公告)号：US20090267216A1

    公开(公告)日：2009-10-29

    申请号：US12110991

    申请日：2008-04-28

    申请人： Randall L. Walberg ,  Luu T. Nguyen ,  Anindya Poddar

    发明人： Randall L. Walberg ,  Luu T. Nguyen ,  Anindya Poddar

    IPC分类号： H01L23/48 ,  H01L21/4763

    CPC分类号： H01L21/4821 ,  H01L21/6835 ,  H01L23/49579 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2924/14 ,  H01L2924/00

    摘要： Apparatuses and methods for inkjet printing electrical interconnect patterns such as leadframes for integrated circuit devices are disclosed. An apparatus for packaging includes a thin substrate adapted for high temperature processing, and an attach pad and contact regions that are inkjet printed to the thin substrate using a metallic nanoink. The nanoink is then cured to remove liquid content. The residual metallic leadframe or electrical interconnect pattern has a substantially consistent thickness of about 10 to 50 microns or less. An associated panel assembly includes a conductive substrate panel having multiple separate device arrays comprising numerous electrical interconnect patterns each, a plurality of integrated circuit devices mounted on the conductive substrate panel, and a molded cap that encapsulates the integrated circuit devices and associated electrical interconnect patterns. The molded cap is of substantially uniform thickness over each separate device array, and extends into the space between separate device arrays.

    摘要翻译： 公开了用于集成电路装置的用于喷墨印刷电互连图案的引线框架的装置和方法。 一种用于包装的装置包括适于高温处理的薄基板，以及使用金属纳米接头喷墨印刷到薄基板上的连接焊盘和接触区域。 然后将nanoink固化以除去液体内容物。 剩余的金属引线框架或电互连图案具有约10至50微米或更小的基本一致的厚度。 相关联的面板组件包括导电衬底面板，该导电衬底面板具有多个单独的器件阵列，每个器件阵列包括多个电互连图案，每个电连接图案，安装在导电衬底面板上的多个集成电路器件，以及封装集成电路器件和相关电气互连图案的模制帽。 模制帽在每个分离的装置阵列上具有基本均匀的厚度，并且延伸到分离的装置阵列之间的空间中。

    Apparatus and method for scribing semiconductor wafers using vision recognition
    8.
    发明授权
    Apparatus and method for scribing semiconductor wafers using vision recognition 有权
    使用视觉识别刻划半导体晶片的装置和方法

    公开(公告)号：US06822315B2

    公开(公告)日：2004-11-23

    申请号：US10076818

    申请日：2002-02-14

    申请人： Nikhil V. Kelkar ,  Luu T. Nguyen

    发明人： Nikhil V. Kelkar ,  Luu T. Nguyen

    IPC分类号： H01L23544

    CPC分类号： H01L21/3043 ,  H01L21/67092 ,  H01L21/681

    摘要： An apparatus and method for scribing a semiconductor wafer coated with a substantially opaque material using vision recognition is disclosed. The apparatus includes a stage configured to hold a wafer, an imaging unit configured to generate an image of the wafer, and a computer configured to identify the coordinates of the scribe lines on the wafer from the image. During operation, the wafer is imaged using the imaging unit. The computer then identifies the coordinates of the scribe lines on the wafer from the image. Thereafter the coordinates are provided to a dicing machine which performs the dicing of the wafer. Accuracy is therefore improved since the dicing machine relies on the coordinates of the scribe lines as opposed to attempting to recognize the scribe lines through the opaque material. According to various embodiments of the invention, the imaging unit may use infrared, X-ray or ultrasound waves to generate the image of the wafer.

    摘要翻译： 公开了一种用于使用视觉识别来划刻涂有基本不透明材料的半导体晶片的装置和方法。 该装置包括配置成保持晶片的台，被配置为产生晶片的图像的成像单元和被配置为从图像识别晶片上的划线的坐标的计算机。 在操作期间，使用成像单元对晶片进行成像。 然后，计算机从图像中识别晶片上划线的坐标。 此后，将坐标提供给执行晶片切割的切割机。 因此，由于切割机依赖于划痕线的坐标，而是试图通过不透明材料识别划线，因此精度得到改善。 根据本发明的各种实施例，成像单元可以使用红外，X射线或超声波来产生晶片的图像。

    Dam for lead encapsulation
    9.
    发明授权
    Dam for lead encapsulation 失效
    大坝铅封装

    公开(公告)号：US5130781A

    公开(公告)日：1992-07-14

    申请号：US593374

    申请日：1990-10-01

    申请人： Caroline A. Kovac ,  Peter G. Ledermann ,  Luu T. Nguyen

    发明人： Caroline A. Kovac ,  Peter G. Ledermann ,  Luu T. Nguyen

    IPC分类号： H01L21/56

    CPC分类号： H01L21/56 ,  H01L2224/50

    摘要： A method and apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

    摘要翻译： 一种用封装材料封装耦合到导电引线的器件和接头的方法和装置。 固定装置具有通过真空将装置保持在适当位置的凹部。 设备中的管道供应设备周围的空气，以形成围绕设备和引线向外流动的空气坝。 喷嘴向设备的表面提供计量的材料。 通过控制固定装置的温度和/或形成空气坝的空气，材料的流动可以在其固化时被限制在装置和接头的表面上。 该方法还可以提供封装边缘封盖以减少器件应力。