摘要:
According to one embodiment, a semiconductor device includes a first main electrode, a control electrode, an extraction electrode, a second insulating film, a plurality of contact electrodes, and a control terminal. The first main electrode is electrically connected to a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type selectively provided on a surface of the first semiconductor region. The control electrode is provided on the first semiconductor region via a first insulating film. The extraction electrode is electrically connected to the control electrode. The second insulating film is provided on the first main electrode and the extraction electrode. The plurality of contact electrodes are provided in an inside of a plurality of first contact holes formed in the second insulating film and are electrically connected to the extraction electrode. The control terminal covers portions of the first main electrode provided on the first semiconductor region, on the second semiconductor region, and on the control electrode, respectively, and the extraction electrode, is electrically connected to the plurality of contact electrodes, and is electrically insulated from the first main electrode by the second insulating film.
摘要:
A semiconductor device comprises a first top electrode and a second top electrode at a front surface of the die, at least a Ni plating layer and an Au plating layer overlaying the Ni plating layer are formed on each of the first top electrode and the second top electrode. A copper clip attaches on the Au plating layer of the second top electrode. A gold (Au) stud bump is formed on the Au plating layer of the first top electrode with a copper wire connected on the stud bump. The Au stud bump is thicker than a thickness of the Au plating layer and thinner than a thickness of the copper clip to avoid copper wire NSOP (non-stick on pad) problem due to Ni plating layer diffusion during the solder reflow process in the copper clip attachment.
摘要:
An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
摘要:
An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
摘要:
In one aspect of the present invention, an integrated circuit package will be described. The integrated circuit package includes at least two integrated circuits that are attached with a substrate. The integrated circuits and the substrates are at least partially encapsulated in a molding material. There is a groove or air gap that extends partially through the molding material and that is arranged to form a thermal barrier between the integrated circuits.
摘要:
An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
摘要:
In one aspect of the present invention, an integrated circuit package will be described. The integrated circuit package includes at least two integrated circuits that are attached with a substrate. The integrated circuits and the substrates are at least partially encapsulated in a molding material. There is a groove or air gap that extends partially through the molding material and that is arranged to form a thermal barrier between the integrated circuits.
摘要:
A semiconductor apparatus includes: a semiconductor device including a semiconductor layer, a first metal main electrode provided on the semiconductor layer and having a first region and a second region, and a metal gate interconnect provided on the semiconductor layer and insulated from and interposed between the first region and the second region; a lead; and a conductive member made of a metal and connecting the first metal main electrode to the lead. The conductive member is bonded to the first region and the second region so as to cover the metal gate interconnect, and the conductive member has a recess on its lower surface above the metal gate interconnect to be spaced from the metal gate interconnect.