公开(公告)号：US5332442A

公开(公告)日：1994-07-26

申请号：US973915

申请日：1992-11-12

申请人： Masao Kubodera ,  Masaki Narushima ,  Masahito Ozawa ,  Hiromi Kumagai ,  Tomihiro Yonenaga ,  Sumi Tanaka

发明人： Masao Kubodera ,  Masaki Narushima ,  Masahito Ozawa ,  Hiromi Kumagai ,  Tomihiro Yonenaga ,  Sumi Tanaka

IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/48 ,  C30B25/10 ,  C30B31/20 ,  H01L21/00 ,  C23C16/00

CPC分类号： C23C16/45512 ,  C23C16/4584 ,  C23C16/481 ,  C30B25/105 ,  C30B31/20 ,  H01L21/67017 ,  H01L21/67115

摘要： The present invention relates to a surface processing apparatus which performs heating processing of an object of heating which is mounted on a mounting device provided inside a process container, and which includes a plural number of lamps provided so as to oppose a rear surface of a processing surface of an object of processing, a rotating unit which has the plural number of lamps mounted to it in a ring shape, and a drive unit which drives the rotating unit. Also, the present invention relates to a processing apparatus for leading a process gas from a gas supply tube to a gas chamber partitioned inside a process container, and which blows process gas from an outlet of the gas chamber and onto an object of processing which is mounted on a mounting device provided inside the process container, and which includes a plural number of partition plates each provided with a plural number of through holes, being provided at required intervals in a direction of gas flow and inside the gas chamber.

摘要翻译： 本发明涉及一种对加热对象进行加热处理的表面处理装置，该加热处理装置安装在设置在处理容器内部的安装装置上，并且包括多个设置成与处理容器的后表面相对的灯 处理对象的表面，具有安装在环状的多个灯的旋转单元和驱动旋转单元的驱动单元。 本发明还涉及一种处理装置，用于将处理气体从气体供给管引导到在处理容器内分隔的气体室，并且将处理气体从气体室的出口吹送到处理对象物上， 安装在设置在处理容器内部的安装装置上，并且包括多个分隔板，每个分隔件设置有多个通孔，沿气流方向和气室内部需要间隔设置。

公开(公告)号：US5474410A

公开(公告)日：1995-12-12

申请号：US212821

申请日：1994-03-14

申请人： Masahito Ozawa ,  Masami Mizukami ,  Masanobu Kanazashi ,  Toshihiko Takasoe ,  Masaki Narushima ,  Masao Kubodera

发明人： Masahito Ozawa ,  Masami Mizukami ,  Masanobu Kanazashi ,  Toshihiko Takasoe ,  Masaki Narushima ,  Masao Kubodera

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/68 ,  B65G1/06

CPC分类号： H01L21/67167 ,  H01L21/67766 ,  H01L21/67775 ,  H01L21/681 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A cassette carrier unit for carrying a cassette, in which a plurality of substrates are housed, into and out of cassette chambers of the multi-chamber system including a hand on which the cassette is mounted. A multi-joined arm for supports the swingable hand, and a base supports the multi-joined swingable arm. The multi-joined arm includes a first shaft member rotatably attached to the hand, a second shaft member rotatably attached to the base, a third shaft member rotated associating with the first shaft member but in a direction reverse to the direction in which the first shaft member is rotated, and a fourth shaft member rotatably attached to the base and to which rotation drive force is transmitted. A first arm is rotatably attached to the first shaft member at the front end thereof and to the second shaft member at the base end thereof. A second arm is arranged substantially parallel to the first arm and fixed to the third shaft member at the front end thereof and to the fourth shaft member at the base end thereof. When the first and second arms are swung, the hand is swung in a direction reverse to the direction in which the first and second arms are swung.

摘要翻译： 用于将容纳多个基板的盒带入和插入多室系统的盒室中的盒式载体单元，其包括安装有盒的手。 用于支撑可摆动的手的多连接臂，以及支撑多重可摆动臂的基座。 所述多接合臂包括可旋转地附接到所述手的第一轴构件，可旋转地附接到所述基座的第二轴构件，与所述第一轴构件旋转相关联但与所述第一轴构件的方向相反的方向旋转的第三轴构件 构件旋转，第四轴构件可旋转地安装到基座并且传递旋转驱动力。 第一臂在其前端处可旋转地附接到第一轴构件，并且在其基端处可旋转地附接到第二轴构件。 第二臂基本上平行于第一臂布置并在其前端固定到第三轴构件，并在其基端固定到第四轴构件。 当第一和第二臂摆动时，手沿与第一和第二臂摆动的方向相反的方向摆动。

公开(公告)号：US06702865B1

公开(公告)日：2004-03-09

申请号：US09647659

申请日：2000-10-04

申请人： Masahito Ozawa ,  Masaki Narushima

发明人： Masahito Ozawa ,  Masaki Narushima

IPC分类号： H01L2100

CPC分类号： H01L21/67775 ,  H01L21/682 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14 ,  Y10S414/141 ,  Y10T29/41

摘要： An alignment processing mechanism 10 according to the present invention includes: a conveying mechanism 11 for conveying a substrate W to be processed, an alignment mechanism 12 for aligning the substrate W conveyed by the conveying mechanism 11 to a predetermined direction, and a buffer mechanism 13 for relaying the substrate W from the conveying mechanism 11 to the alignment mechanism 12. The buffer mechanism 13 is adapted to temporarily hold the substrate W conveyed by the conveying mechanism 11, and to pass the temporarily holding substrate W to the alignment mechanism 12 based on a state of the alignment mechanism 12. According to the present invention, the alignment mechanism 12 can be used with greater efficiency in order to achieve a high speed of an alignment process.

摘要翻译： 根据本发明的对准处理机构10包括：用于输送待处理基板W的输送机构11，用于将由输送机构11输送的基板W与预定方向对准的对准机构12和缓冲机构13 用于将基板W从输送机构11中继到对准机构12.缓冲机构13适于暂时保持由输送机构11输送的基板W，并且基于以下方式将暂时保持基板W通过对准机构12 对准机构12的状态。根据本发明，可以以更高的效率使用对准机构12，以实现高速的对准过程。

公开(公告)号：US20130295751A1

公开(公告)日：2013-11-07

申请号：US13978942

申请日：2012-01-13

申请人： Takamasa Kato ,  Masaki Narushima ,  Kenichi Hara

发明人： Takamasa Kato ,  Masaki Narushima ,  Kenichi Hara

IPC分类号： H01L21/02

CPC分类号： H01L21/02617 ,  C23C24/02 ,  H01L21/02543 ,  H01L21/02546 ,  H01L21/02557 ,  H01L21/02562 ,  H01L21/02568 ,  H01L21/02601 ,  H01L21/02628 ,  H01L31/0322 ,  H01L31/0326 ,  H01L31/03923 ,  H01L31/03925 ,  H01L31/18 ,  H01L31/1828 ,  H01L31/20 ,  Y02E10/541 ,  Y02E10/543

摘要： This thin film forming method for a solar cell forms a thin film that contains a plurality of elements on the surface of an object to be processed. A raw material solution that contains the elements is dispersed in a processing space and microparticles by an electric field, and the microparticles that are dispersed form a thin film that adheres to the surface of the object to be processed. Thus, a thin film for a solar cell element with preferable crystallinity can be formed even in an atmosphere at atmospheric pressure.

摘要翻译： 该太阳能电池薄膜形成方法形成在被处理物的表面上含有多个元素的薄膜。 含有这些元素的原料溶液通过电场分散在处理空间和微粒中，并且分散的微粒形成粘附到待处理物体的表面的薄膜。 因此，即使在大气压的气氛中也可以形成具有优选结晶性的太阳能电池元件用薄膜。

公开(公告)号：US07198448B2

公开(公告)日：2007-04-03

申请号：US11332653

申请日：2006-01-13

申请人： Jun Ozawa ,  Jun Hirose ,  Masaki Narushima

发明人： Jun Ozawa ,  Jun Hirose ,  Masaki Narushima

IPC分类号： B65G49/07

CPC分类号： H01L21/67161 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67745 ,  Y10S414/139

摘要： A vacuum process system comprises: a load port on which an object to be processed is set; a common transfer chamber disposed adjacent to the load port, having an internal space set at an atmospheric pressure level, and including a first transfer device that is movable and transfers the object into/from the load port, the first transfer device being disposed within the internal space; and a process unit having one process chamber for subjecting the object to a predetermined process, and a vacuum transfer chamber connected to the process chamber, having an internal space set at a vacuum pressure level, and including a second transfer device for transferring the object into/from the process chamber, the second transfer device being disposed within the internal space. The process units are individually connected to the common transfer chamber such that the process units are substantially parallel to each other. The vacuum chamber of each process unit is connected to the common transfer chamber. Each process unit extends linearly in a direction substantially perpendicular to the common transfer chamber. The object is transferred into/from the vacuum transfer chamber by means of the first transfer device.

摘要翻译： 真空处理系统包括：设置待处理对象的装载端口; 与负载端口相邻设置的公共传送室，具有设定在大气压力水平的内部空间，并且包括第一传送装置，该第一传送装置可移动并将物体传送到/从所述装载端口传送，所述第一传送装置设置在所述传送室内 内部空间; 以及处理单元，其具有用于使物体经受预定处理的一个处理室和连接到处理室的真空传送室，其具有设置在真空压力水平的内部空间，并且包括用于将物体传送到 /从处理室，第二传送装置设置在内部空间内。 处理单元分别连接到公共传送室，使得处理单元基本上彼此平行。 每个处理单元的真空室连接到公共传送室。 每个处理单元在基本上垂直于公共传送室的方向上线性地延伸。 物体通过第一传送装置传送到/从真空传送室传送。

公开(公告)号：US20060084266A1

公开(公告)日：2006-04-20

申请号：US11252795

申请日：2005-10-19

申请人： Masaki Narushima ,  Koumei Matsuzawa ,  Hiroshi Sato ,  Takayuki Komiya ,  Eiichi Kondoh

发明人： Masaki Narushima ,  Koumei Matsuzawa ,  Hiroshi Sato ,  Takayuki Komiya ,  Eiichi Kondoh

IPC分类号： H01L21/44

CPC分类号： H01L21/76877 ,  C23C18/161 ,  C23C18/1678 ,  C23C18/168 ,  C23C18/1682 ,  C23C18/1685 ,  C23C18/40 ,  H01L21/28556 ,  H01L21/288

摘要： A film formation method of forming a film on a fine-pattern by supplying a processing medium that is in the supercritical state in which a precursor is dissolved on a target substrate is disclosed. The film formation method includes a first process of supplying the processing medium on the target substrate, the temperature of which is set at a first temperature that is lower than a film formation minimum temperature that is the lowest temperature at which film formation takes place, and a second process of forming the film on the target substrate by raising the temperature of the target substrate from the first temperature to a second temperature that is higher than the film formation minimum temperature.

摘要翻译： 公开了一种通过在目标基板上提供处于前体被溶解的超临界状态的处理介质，在微细图案上形成薄膜的成膜方法。 成膜方法包括：将目标基板上的处理介质供给到第一温度的第一工序，该第一工序的温度设定在低于成膜的最低温度的成膜最低温度的第一温度，以及 通过将目标基板的温度从第一温度升高到高于成膜最低温度的第二温度，在目标基板上形成膜的第二工序。

公开(公告)号：US4941800A

公开(公告)日：1990-07-17

申请号：US260608

申请日：1988-10-21

申请人： Hisashi Koike ,  Itaru Takao ,  Masaki Narushima ,  Kiyoshi Takekoshi

发明人： Hisashi Koike ,  Itaru Takao ,  Masaki Narushima ,  Kiyoshi Takekoshi

IPC分类号： H01L21/677 ,  H01L21/683

CPC分类号： H01L21/67778 ,  H01L21/6838

摘要： A transfer apparatus for carrying a semiconductor wafer into a wafer cassette comprising an arm to load a semiconductor wafer thereon, a moving mechanism to move the arm to a wafer cassette, a chucking device to have a wafer attracted to the arm, and an auxiliary mechanism to push a wafer and adjust the position of the wafer to the inlet of a wafer cassette when the wafer comes into contact with the side wall of the wafer cassette.

摘要翻译： 一种用于将半导体晶片携带到晶片盒中的转印装置，该晶片盒包括用于在其上装载半导体晶片的臂，用于将臂移动到晶片盒的移动机构，具有吸引到臂的晶片的夹持装置和辅助机构 当晶片与晶片盒的侧壁接触时，推动晶片并将晶片的位置调整到晶片盒的入口。

公开(公告)号：US20120125889A1

公开(公告)日：2012-05-24

申请号：US13113746

申请日：2011-05-23

申请人： Noriaki TOYODA ,  Isao Yamada ,  Masaki Narushima

发明人： Noriaki TOYODA ,  Isao Yamada ,  Masaki Narushima

IPC分类号： B44C1/22 ,  B08B7/00

CPC分类号： H01J37/08 ,  G03F7/427 ,  H01J2237/006 ,  H01J2237/0812 ,  H01J2237/31 ,  H01L21/02041 ,  H01L21/31116

摘要： A cluster beam generating apparatus that generates a cluster beam includes a mixer that mixes a gas source material and a liquid source material; a nozzle that supplies a cluster beam including clusters originating from the gas source material and the liquid source material that are mixed in the mixer; and a temperature adjusting portion that adjusts a temperature of the nozzle, thereby controlling a ratio of the clusters originating from the gas source material and the clusters originating from the liquid source material in the cluster beam.

摘要翻译： 产生聚束束的聚束束发生装置包括混合气体源材料和液体源材料的混合器; 提供包括源自气源材料的簇和混合在混合器中的液体源材料的簇束的喷嘴; 以及温度调节部，其调节喷嘴的温度，从而控制源自气体源材料的簇和源自簇流束中的液体源材料的簇的比例。

公开(公告)号：US20100099254A1

公开(公告)日：2010-04-22

申请号：US12443983

申请日：2007-10-01

申请人： Masaki Narushima ,  Yasuhiko Kojima

发明人： Masaki Narushima ,  Yasuhiko Kojima

IPC分类号： H01L21/768 ,  H01L21/00

CPC分类号： H01L21/76843 ,  C23C16/44 ,  H01L21/67207 ,  H01L21/68742 ,  H01L21/76831 ,  H01L21/76861 ,  H01L21/76864 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor manufacturing apparatus, when a barrier film and a copper film are formed along a recess in an insulating film by using an alloy layer of copper and addictive metal, e.g., Mn, and copper wiring is embedded therein, reduces Mn in the copper film to suppress an increase in wiring resistance. A vacuum transfer module is connected, through a load lock chamber, to a loader module for transferring a wafer with respect to a carrier. A formic acid treatment module supplying formic acid vapor as an organic acid to the wafer and a module forming a film of Cu, e.g., by CVD are connected to the vacuum transfer module to configure an apparatus manufacturing a semiconductor. The wafer W subjected to alloy layer formation and then, e.g., to annealing is transferred into the apparatus, and treatment with formic acid is performed followed by Cu film formation.

摘要翻译： 半导体制造装置，通过使用例如Mn的铜和上釉金属的合金层，在绝缘膜中的凹部形成阻挡膜和铜膜，并且嵌入铜布线，从而减少铜膜中的Mn 以抑制布线电阻的增加。 真空传递模块通过负载锁定室连接到用于相对于载体传送晶片的加载器模块。 向晶片供给作为有机酸的甲酸蒸气的甲酸处理组件和例如通过CVD形成Cu膜的模块连接到真空转印模块以构造制造半导体的装置。 进行合金层形成然后例如退火的晶片W被转移到装置中，然后用甲酸处理，然后进行Cu膜形成。

公开(公告)号：US06951587B1

公开(公告)日：2005-10-04

申请号：US09722485

申请日：2000-11-28

申请人： Masaki Narushima

发明人： Masaki Narushima

IPC分类号： H01L21/302 ,  C23C16/00 ,  C23C16/458 ,  C23F1/00 ,  H01L21/00 ,  H01L21/205 ,  H01L21/306 ,  H01L21/3065 ,  H05B3/20

CPC分类号： H01L21/67109 ,  C23C16/4586

摘要： A ceramic heater system has a ceramic heater base having a substrate-mounting surface formed on the top surface thereof and a heater, buried in the heater base, for heating a substrate. A fluid passage is formed buried in the heater base below where the heater is buried. The heater base is cooled as a fluid whose temperature is lower than the temperature of the heater base is let flow in the fluid passage. A substrate processing apparatus has the ceramic heater system installed in a process chamber whose vacuum state can be maintained, a gas supply mechanism for feeding a gas into the process chamber, and a power supply. The substrate processing apparatus performs a heat treatment, etching and film deposition on a substrate placed in the process chamber.

摘要翻译： 陶瓷加热器系统具有陶瓷加热器基座，其具有形成在其顶表面上的基板安装表面和埋在加热器基座中用于加热基板的加热器。 在加热器底部埋入加热器底部的流体通道形成在加热器的下面。 加热器基座被冷却为温度低于加热器基座的温度的流体，流体流过流体通道。 基板处理装置具有陶瓷加热器系统，其安装在可以保持真空状态的处理室中，用于将气体供给到处理室中的气体供给机构和电源。 基板处理装置在放置在处理室中的基板上进行热处理，蚀刻和膜沉积。